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STL40N75LF3

STMicroelectronics

STL40N75LF3 by STMicroelectronics

STL40N75LF3 by STMicroelectronics is a N-CHANNEL FET with 75V DS Breakdown Voltage, 160A IDM, and 0.022 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at up to 150 °C. Package: PLASTIC/EPOXY, RECTANGULAR shape with DUAL terminals.

Median Price

$0.552

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Future Electronics

Canada . 3,000 parts In-Stock

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$0.560

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$0.560

Avnet

USA . 3,000 parts In-Stock

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Verical

USA . 3,000 parts In-Stock

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$0.545

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$0.545

Distributors (In-Stock)

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Vyrian

USA . 12,553 parts In-Stock

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IBS Electronics

USA . 3,000 parts In-Stock

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$0.785

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$0.785

Anansix

USA . 1,705 parts In-Stock

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1,705

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ComSIT Distribution GmbH

Germany . 585 parts In-Stock

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Digiode

USA . 462 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$1.133

100+ parts

$1.031

1k+ parts

$0.929

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$1.133

$1.031

$0.929

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IDEA Electronic Components Group

UK . 2,328 parts In-Stock

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$1.685

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$1.517

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MKK Technologies

India . 867 parts In-Stock

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$3.169

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DigiPath Technology Company

USA . 867 parts In-Stock

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Microchip USA

USA . 151 parts In-Stock

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$5.392

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AZTECH Wire

Italy . 50 parts In-Stock

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Perfect Parts

USA . 9,481 parts In-Stock

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iodParts Technologies Inc.

India . 8,968 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,690 parts In-Stock

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Corphita

USA . 589 parts In-Stock

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Parana Technologies

USA . 557 parts In-Stock

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$2.015

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557

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$2.015

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Overview

Unleash the power of innovation with the STL40N75LF3 by STMicroelectronics. Designed to exceed expectations, this N-Channel Power FET offers unmatched quality and reliability for all your switching needs. With a maximum drain current of 40A and a low on-resistance of 0.022 ohm, this transistor is a game-changer in the field of power electronics. Whether you're looking to boost efficiency in industrial applications or enhance performance in automotive systems, the STL40N75LF3 delivers unparalleled value and performance. Trust in STMicroelectronics to provide cutting-edge solutions that set you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, making the product suitable for various environments.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching and control of current flow, enhancing the performance of the transistor.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds protection and improves functionality in applications requiring reverse voltage protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and consistent performance in such scenarios.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving time and effort during assembly.

Minimum DS Breakdown Voltage: 75 V

Offers a high breakdown voltage, allowing the transistor to withstand higher voltages without failure.

Maximum Pulsed Drain Current (IDM): 160 A

Supports high current applications, making it suitable for heavy-duty tasks that require a large amount of power.

Maximum Power Dissipation (Abs): 62 W

Can handle high power dissipation, ensuring the transistor remains within safe operating temperatures even under heavy loads.

Maximum Operating Temperature: 150 °C

Withstands high temperatures without compromising performance, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) STL40N75LF3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL40N75LF3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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