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STL42N65M5

STMicroelectronics

STL42N65M5 by STMicroelectronics

STL42N65M5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 650V breakdown voltage, 34A max drain current, and operates at up to 150 °C. Ideal for power management in compact electronic devices.

Median Price

$7.429

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,761 parts In-Stock

1+ parts

$7.218

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2,761

$7.218

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Verical

USA . 2,761 parts In-Stock

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$7.218

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2,761

$7.218

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Chip1Stop

Japan . 2,770 parts In-Stock

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$7.640

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2,770

$7.640

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DigiKey

USA . 2,913 parts In-Stock

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$7.850

2,913

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$7.850

Distributors (In-Stock)

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Digiode

USA . 4,499 parts In-Stock

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$6.857

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4,499

$6.857

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Vyrian

USA . 3,437 parts In-Stock

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$7.218

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3,437

$7.218

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Anansix

USA . 319 parts In-Stock

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319

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 85 parts In-Stock

1+ parts

$0.349

100+ parts

-

1k+ parts

$0.314

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85

$0.349

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$0.314

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MKK Technologies

India . 452 parts In-Stock

1+ parts

$0.656

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452

$0.656

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DigiPath Technology Company

USA . 452 parts In-Stock

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$0.656

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452

$0.656

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Andel Nordic

Denmark . 3,021 parts In-Stock

1+ parts

$2.961

100+ parts

-

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$2.843

10k+ parts

$2.843

3,021

$2.961

-

$2.843

$2.843

Corphita

USA . 2,899 parts In-Stock

1+ parts

$6.496

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2,899

$6.496

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Component Stockers USA

USA . 8,088 parts In-Stock

1+ parts

$7.020

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$7.020

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$7.020

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8,088

$7.020

$7.020

$7.020

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Perfect Parts

USA . 6,720 parts In-Stock

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6,720

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Alle Elektronik GmbH

Germany . 2,915 parts In-Stock

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2,915

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A-Z Elektronik GmbH

Germany . 2,391 parts In-Stock

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2,391

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Parana Technologies

USA . 627 parts In-Stock

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$0.417

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627

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$0.417

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Microchip USA

USA . 131 parts In-Stock

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131

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Overview

Unlock unparalleled performance with the STL42N65M5 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET delivers exceptional efficiency and reliability for all your switching applications, making it ideal for industrial and consumer electronics. With its robust design and superior thermal management, you can trust this component to enhance your systems while reducing energy costs. Choose STL42N65M5 for unmatched quality and performance!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility, which leads to lower on-resistance and faster switching speeds, making this transistor efficient for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better integration in circuits, particularly for applications needing protection against reverse voltage, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides quick and efficient control in power circuits, making it suitable for various electronic devices.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly processes, which is crucial for modern electronics manufacturing.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage ensures robustness in high-voltage applications, making it suitable for power management in various industrial electronics.

Package Shape: SQUARE

A square package efficiently uses PCB space and allows for uniform thermal distribution, optimizing cooling performance in high-power applications.

Terminal Form: NO LEAD

No lead design reduces the overall footprint and allows for direct soldering to the PCB, enhancing thermal and electrical performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows the transistor to remain off until a sufficient gate voltage is applied, resulting in lower power consumption in idle states.

Maximum Pulsed Drain Current (IDM): 136 A

The ability to handle high pulsed drain currents enables this FET to manage transient loads effectively, making it fit for demanding applications like motor controls.

Avalanche Energy Rating (EAS): 950 mJ

A high avalanche energy rating indicates excellent protection against voltage spikes, increasing reliability and longevity in harsh environments.

Maximum Drain Current (Abs) (ID): 34 A

Handling up to 34 A of current makes this FET suitable for high-load environments, ideal for applications ranging from power supplies to automotive systems.

No. of Terminals: 4

A four-terminal design allows for versatile circuit configurations, making it adaptable to a wide range of applications and simpler designs.

Maximum Power Dissipation (Abs): 208 W

With a maximum power dissipation of 208 W, this FET is capable of managing significant power levels, suitable for high-performance power applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style promotes a compact design while maintaining excellent thermal performance, crucial for portable and space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOS technology provides high input impedance and low power consumption, making it an efficient choice for a variety of switching and amplification needs.

Maximum Operating Temperature: 150 °C

Operating at high temperatures up to 150 °C ensures that the FET remains reliable in demanding environments, making it suitable for industrial applications.

Transistor Element Material: SILICON

Silicon's characteristics allow for a stable performance and ease of integration in various electronic applications, contributing to the transistor's versatility.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and corrosion resistance, ensuring long-term reliability and performance in electronic assemblies.

Maximum Drain Current (ID): 34 A

This rating confirms the ability of the FET to manage substantial currents effectively, making it ideal for both consumer electronics and industrial applications.

Maximum Drain-Source On Resistance: 0.079 ohm

A low on-resistance minimizes power loss during operation, making this FET highly efficient and suitable for applications where energy conservation is critical.

Terminal Position: DUAL

Dual terminal positioning allows for flexible circuit layouts, which benefits prototyping and custom board designs.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product indicates moderate moisture sensitivity, ideal for applications where limited exposure to moisture is expected.

Case Connection: DRAIN

A drain connection ensures direct and effective management of energy flow, improving circuit efficiency in power electronics.

Maximum Time At Peak Reflow Temperature: 30 s

This specification provides useful guidance for soldering processes, ensuring optimal solder joint integrity and reliability during manufacturing.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature tolerance indicates compatibility with advanced soldering techniques, which is advantageous for modern electronic assembly methods.

Technical Specifications

Power Field Effect Transistors (FET) STL42N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

950 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

34 A

Maximum Drain Current (ID):

34 A

Maximum Drain-Source On Resistance:

.079 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XDSO-N4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

136 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL42N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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