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STI90N4F3

STMicroelectronics

STI90N4F3 by STMicroelectronics

STI90N4F3 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 40 V, and operates at up to 175 °C. Ideal for high-power circuits with low on-resistance (0.0062 Ω).

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,276 parts In-Stock

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3,276

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Digiode

USA . 2,935 parts In-Stock

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Anansix

USA . 679 parts In-Stock

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679

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IDEA Electronic Components Group

UK . 217 parts In-Stock

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$1.742

100+ parts

-

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$1.568

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217

$1.742

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$1.568

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MKK Technologies

India . 185 parts In-Stock

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$3.277

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185

$3.277

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DigiPath Technology Company

USA . 185 parts In-Stock

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$3.277

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185

$3.277

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AZTECH Wire

Italy . 945 parts In-Stock

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$12.140

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945

$12.140

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Alle Elektronik GmbH

Germany . 4,691 parts In-Stock

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4,691

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Corphita

USA . 3,420 parts In-Stock

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Parana Technologies

USA . 1,498 parts In-Stock

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$2.083

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1,498

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$2.083

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iodParts Technologies Inc.

India . 350 parts In-Stock

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350

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Overview

Experience the power of efficiency with the STI90N4F3 from STMicroelectronics, a leader in semiconductor innovation. This versatile N-channel FET is designed for robust switching applications, providing exceptional performance even under demanding conditions. With a built-in diode and high current capacity, it ensures reliability and durability for your projects, making it an ideal choice for automotive, industrial, and consumer electronics. Trust in STMicroelectronics' commitment to quality and elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides excellent moisture resistance and durability, making the FET suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and faster switching speeds, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances circuit protection and efficiency, reducing the need for additional components.

Transistor Application: SWITCHING

Designed for switching applications, this FET excels in power management and control circuits.

Minimum DS Breakdown Voltage: 40 V

A minimum breakdown voltage of 40 V allows for reliable operation in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization in circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connection and stability in high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and increased efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed drain current rating indicates the ability to handle large current spikes, excellent for dynamic load applications.

Avalanche Energy Rating (EAS): 400 mJ

A high avalanche energy rating enhances the FET's reliability and durability under fault conditions.

Maximum Drain Current (Abs) (ID): 80 A

An 80 A maximum drain current capability supports high-power applications with demanding current requirements.

No. of Terminals: 3

Having three terminals simplifies circuit design and integration into various applications.

Maximum Power Dissipation (Abs): 110 W

The ability to dissipate up to 110 W of power ensures efficient thermal management under load.

Package Style (Meter): IN-LINE

Inline package style facilitates easy mounting and assembly in various circuit boards.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, enhancing circuit efficiency.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature extends the FET's applications to environments with elevated thermal conditions.

Transistor Element Material: SILICON

Silicon is a common choice for FETs due to its excellent electrical properties and thermal stability.

Terminal Finish: Matte Tin (Sn)

The matte tin finish offers good solderability and corrosion resistance, ensuring durable connections.

Maximum Drain Current (ID): 80 A

This specification emphasizes the FET's reliability for continuous operation under heavy load.

Maximum Drain-Source On Resistance: 0.0062 ohm

A low on-resistance reduces power losses during operation, making it highly efficient for switching applications.

Terminal Position: SINGLE

Single terminal positioning simplifies layout designs in PCBs and makes routing easier.

Case Connection: DRAIN

DRAIN case connection is effective for managing current flow and ensuring optimal performance.

Technical Specifications

Power Field Effect Transistors (FET) STI90N4F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0062 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI90N4F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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