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STG5678BJR

STMicroelectronics

STG5678BJR by STMicroelectronics

STG5678BJR by STMicroelectronics is a CMOS SPDT switch with a max on-state resistance of 7Ω and operates b/w -40 °C to 85 °C. It features 12 terminals in a rectangular grid array, ideal for industrial applications requiring efficient signal routing. With a power supply range of 1.8V to 4V, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,294 parts In-Stock

1+ parts

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6,294

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Digiode

USA . 2,964 parts In-Stock

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2,964

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Anansix

USA . 2,039 parts In-Stock

1+ parts

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2,039

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Connector Distribution Corp

USA . 150 parts In-Stock

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150

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Right Parts Inc.

USA . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 933 parts In-Stock

1+ parts

$4.896

100+ parts

-

1k+ parts

$4.407

10k+ parts

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933

$4.896

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$4.407

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MKK Technologies

India . 605 parts In-Stock

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$9.207

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605

$9.207

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DigiPath Technology Company

USA . 605 parts In-Stock

1+ parts

$9.207

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605

$9.207

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AZTECH Wire

Italy . 644 parts In-Stock

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$11.220

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644

$11.220

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Microchip USA

USA . 1,396 parts In-Stock

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$14.876

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1,396

$14.876

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Corphita

USA . 3,510 parts In-Stock

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3,510

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Parana Technologies

USA . 982 parts In-Stock

1+ parts

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$5.854

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982

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$5.854

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Overview

Unlock seamless connectivity and superior performance with the STG5678BJR from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers this cutting-edge multiplexer designed for industrial applications, offering reliability in demanding environments. With its robust temperature range and efficient switching capabilities, this device ensures your systems operate flawlessly, enhancing productivity and reducing downtime—all while enjoying exceptional value and support from a leading manufacturer in semiconductor solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability in diverse environments, enhancing the longevity of the product.

Surface Mount: YES

Surface mount technology allows for a compact design, making it suitable for high-density circuit boards.

No. of Functions: 2

With two functions, this product provides flexibility in applications, allowing for efficient signal routing.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on the PCB, optimizing layout possibilities.

Power Supplies (V): 1.8/4

Wide voltage compatibility (1.8V to 4V) makes it versatile for various applications in modern electronic systems.

No. of Terminals: 12

Having 12 terminals provides ample connection points for complex circuitry, enhancing integration options.

Package Style (Meter): GRID ARRAY

The grid array packaging allows for easier soldering and improves thermal dissipation, leading to better performance.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliable performance in demanding environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

This wide temperature range allows the product to function effectively in extreme conditions, enhancing versatility.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates effective PCB layout and stability during assembly.

Other IC type: SPDT

Single Pole Double Throw configuration offers flexible switching options, making it ideal for various applications.

Maximum On-state Resistance (Ron): 7 ohm

A low on-state resistance ensures minimal power loss and improved efficiency in signal transmission.

Maximum Switch-on Time: 265 ns

Fast switch-on time enhances overall system responsiveness, making it suitable for high-speed applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, ensuring reliability and performance in tough environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it an excellent choice for battery-operated devices.

Terminal Form: BALL

Ball terminals allow for secure connections and better soldering, ensuring robust electrical performance.

Terminal Pitch: 0.4 mm

A small terminal pitch enables high-density designs, making it suitable for space-constrained applications.

Normal Position (V): NO/NC

The NO/NC configuration supports versatile applications in control systems, enhancing functionality.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature prevents short circuits during operation, ensuring safe and reliable performance.

Technical Specifications

Multiplexers & Switches STG5678BJR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B12

Normal Position (V):

NO/NC

No. of Functions:

2

No. of Terminals:

12

Maximum On-state Resistance (Ron):

7 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/4

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

265 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STG5678BJR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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