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STFW38N65M5

STMicroelectronics

STFW38N65M5 by STMicroelectronics

STFW38N65M5 by STMicroelectronics is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 120A IDM, 660mJ EAS, and 0.095 ohm RDS(on). The transistor operates in ENHANCEMENT MODE with SILICON element material and METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$6.350

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 87 parts In-Stock

1+ parts

$6.350

100+ parts

$3.470

1k+ parts

$3.100

10k+ parts

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87

$6.350

$3.470

$3.100

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Chip1Stop

Japan . 188 parts In-Stock

1+ parts

$15.590

100+ parts

$246.000

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-

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188

$15.590

$246.000

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Verical

USA . 114 parts In-Stock

1+ parts

-

100+ parts

$2.460

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-

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114

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$2.460

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,352 parts In-Stock

1+ parts

$5.786

100+ parts

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4,352

$5.786

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Vyrian

USA . 5,286 parts In-Stock

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5,286

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Anansix

USA . 1,283 parts In-Stock

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1,283

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,321 parts In-Stock

1+ parts

$1.460

100+ parts

-

1k+ parts

$1.314

10k+ parts

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2,321

$1.460

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$1.314

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MKK Technologies

India . 1,788 parts In-Stock

1+ parts

$2.746

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-

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1,788

$2.746

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DigiPath Technology Company

USA . 1,788 parts In-Stock

1+ parts

$2.746

100+ parts

-

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1,788

$2.746

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Corphita

USA . 3,572 parts In-Stock

1+ parts

$5.481

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-

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3,572

$5.481

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Component Stockers USA

USA . 422 parts In-Stock

1+ parts

$6.640

100+ parts

$2.060

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422

$6.640

$2.060

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Microchip USA

USA . 7,280 parts In-Stock

1+ parts

$31.307

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7,280

$31.307

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A-Z Elektronik GmbH

Germany . 4,745 parts In-Stock

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4,745

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RC Electronics

USA . 3,703 parts In-Stock

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3,703

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Alle Elektronik GmbH

Germany . 3,130 parts In-Stock

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3,130

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Parana Technologies

USA . 1,404 parts In-Stock

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$1.746

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1,404

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$1.746

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Perfect Parts

USA . 403 parts In-Stock

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403

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Overview

Power up your projects with the STFW38N65M5 from STMicroelectronics. This high-quality N-CHANNEL Power Field Effect Transistor (FET) offers a wide range of applications, including switching functions. With a robust design and built-in diode, this transistor ensures reliability and efficiency in any project. Whether you're working on industrial machinery or electronic devices, the STFW38N65M5 delivers superior performance and value. Trust STMicroelectronics for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy packaging offers good protection for the transistor, ensuring reliable performance and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better conductivity and efficiency compared to P-channel transistors, making them a preferred choice for many applications.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications, providing robust protection and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching times and low losses, making it efficient for various electronic circuits.

Maximum Pulsed Drain Current (IDM): 120 A

The high maximum pulsed drain current capability of 120 A allows this FET to handle high current spikes without damage, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 660 mJ

The high avalanche energy rating of 660 mJ indicates the FET's ability to withstand energy spikes and transient events, ensuring reliable operation in harsh conditions.

Maximum Drain Current (ID): 30 A

With a high maximum drain current rating of 30 A, this FET can handle large continuous current flows, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.095 ohm

The low on-resistance of 0.095 ohm minimizes power losses in the FET, leading to higher efficiency and reduced heat generation.

Technical Specifications

Power Field Effect Transistors (FET) STFW38N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA LOW RESISTANCE

Avalanche Energy Rating (EAS):

660 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

120 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STFW38N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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