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STFV4N150

STMicroelectronics

STFV4N150 by STMicroelectronics

STFV4N150 by STMicroelectronics is an N-channel FET designed for switching applications. It features a 1500V breakdown voltage, 12A max pulsed drain current, and operates at up to 150 °C. Ideal for high-voltage power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,410 parts In-Stock

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2,410

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Anansix

USA . 1,881 parts In-Stock

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1,881

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Digiode

USA . 1,752 parts In-Stock

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1,752

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,286 parts In-Stock

1+ parts

$0.412

100+ parts

-

1k+ parts

$0.371

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1,286

$0.412

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$0.371

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MKK Technologies

India . 167 parts In-Stock

1+ parts

$0.775

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167

$0.775

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DigiPath Technology Company

USA . 167 parts In-Stock

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$0.775

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167

$0.775

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AZTECH Wire

Italy . 444 parts In-Stock

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$8.100

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444

$8.100

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Component Stockers USA

USA . 360 parts In-Stock

1+ parts

$99.990

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360

$99.990

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Alle Elektronik GmbH

Germany . 3,114 parts In-Stock

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3,114

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Corphita

USA . 3,051 parts In-Stock

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3,051

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QUARKTWIN TECHNOLOGY LTD

USA . 2,388 parts In-Stock

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2,388

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Parana Technologies

USA . 60 parts In-Stock

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$0.493

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60

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$0.493

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Overview

Unlock high-performance efficiency with the STFV4N150 from STMicroelectronics, a leader in innovative semiconductor solutions. This robust N-channel power FET excels in demanding switching applications, delivering exceptional reliability and an impressive breakdown voltage of 1500V. Ideal for industrial automation and power management, it ensures superior thermal performance and longevity, empowering your designs with unmatched quality and value. Choose STMicroelectronics for trusted excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package ensures durability and protection against environmental factors, making it suitable for reliable long-term applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their efficient switching performance, making them an excellent choice for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by integrating two functions into one component, thus saving space and enhancing reliability.

Transistor Application: SWITCHING

Optimized for switching applications, this FET can handle fast switching operations, making it ideal for modern electronic devices.

Minimum DS Breakdown Voltage: 1500 V

A high breakdown voltage allows this FET to be used in high-voltage applications, ensuring safety and preventing circuit damage.

Package Shape: RECTANGULAR

The rectangular shape provides easy mounting and space-efficient layout, accommodating various PCB designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and ease of soldering, ensuring reliability in connection quality.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower conduction losses when the FET is on, improving overall efficiency in power applications.

Maximum Pulsed Drain Current (IDM): 12 A

The ability to handle 12 A of pulsed drain current makes this FET highly versatile for transient load applications.

Avalanche Energy Rating (EAS): 350 mJ

A high avalanche energy rating indicates robustness against transient voltage spikes, enhancing the reliability of the device.

Maximum Drain Current (Abs) (ID): 4 A

With a maximum drain current capability of 4 A, this FET is suitable for moderate power applications without overheating.

No. of Terminals: 3

The three-terminal configuration simplifies circuit design and integration while maintaining full functionality.

Maximum Power Dissipation (Abs): 40 W

A high power dissipation rating of 40 W allows for effective thermal management in power applications, reducing the risk of damage.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging offers secure mechanical support and improved thermal conductivity for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and fast switching capabilities, making it ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

This high maximum operating temperature makes the FET suitable for environments with increased thermal demands.

Transistor Element Material: SILICON

Silicon is widely used for its excellent electrical properties and reliability in semiconductor devices, ensuring strong performance.

Maximum Drain Current (ID): 4 A

The sustained maximum drain current of 4 A provides flexibility for various load conditions while maintaining efficient operation.

Maximum Drain-Source On Resistance: 7 ohm

A low on-resistance minimizes power loss when the transistor is on, contributing to overall efficiency in power circuits.

Terminal Position: SINGLE

A single terminal position allows for a simplified layout and easy integration into existing designs.

Case Connection: ISOLATED

Isolated case connection ensures safety and prevents short circuits, particularly in sensitive electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) STFV4N150 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

350 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1500 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STFV4N150 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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