Loading...

STFPC320BTR

STMicroelectronics

STFPC320BTR by STMicroelectronics

STFPC320BTR from STMicroelectronics is a low-profile power management IC designed for industrial applications. It operates within a supply voltage range of 2.97-3.63 V and features 4 channels with a max temp of 85 °C. Its compact design (10x10 mm) ensures efficient space utilization in electronic devices.

Median Price

$1.719

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.719

3,249

-

-

-

$1.719

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,323 parts In-Stock

1+ parts

$1.865

100+ parts

-

1k+ parts

-

10k+ parts

-

3,323

$1.865

-

-

-

Anansix

USA . 2,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,549

-

-

-

-

Digiode

USA . 2,342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,342

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 6,199 parts In-Stock

1+ parts

$3.640

100+ parts

-

1k+ parts

-

10k+ parts

-

6,199

$3.640

-

-

-

IDEA Electronic Components Group

UK . 2,181 parts In-Stock

1+ parts

$4.836

100+ parts

-

1k+ parts

$4.352

10k+ parts

-

2,181

$4.836

-

$4.352

-

MKK Technologies

India . 1,346 parts In-Stock

1+ parts

$9.093

100+ parts

-

1k+ parts

-

10k+ parts

-

1,346

$9.093

-

-

-

DigiPath Technology Company

USA . 1,346 parts In-Stock

1+ parts

$9.093

100+ parts

-

1k+ parts

-

10k+ parts

-

1,346

$9.093

-

-

-

Microchip USA

USA . 412 parts In-Stock

1+ parts

$12.512

100+ parts

-

1k+ parts

-

10k+ parts

-

412

$12.512

-

-

-

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,000

-

-

-

-

Perfect Parts

USA . 3,669 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,669

-

-

-

-

Corphita

USA . 2,994 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,994

-

-

-

-

Parana Technologies

USA . 2,094 parts In-Stock

1+ parts

-

100+ parts

$5.782

1k+ parts

-

10k+ parts

-

2,094

-

$5.782

-

-

Kepictronics

USA . 1,557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,557

-

-

-

-

Overview

Unlock the potential of your designs with the STFPC320BTR from STMicroelectronics, a leader in power management solutions. This compact, robust IC is engineered for reliability across diverse applications, ensuring optimal performance even in extreme conditions. With its superior thermal stability and low-profile design, it enhances efficiency while saving space. Experience unparalleled quality and innovation that drives your projects forward, making the STFPC320BTR an essential asset for any engineer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers good durability and protection, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for more compact and efficient designs, facilitating easier integration into modern PCB layouts.

Package Shape: SQUARE

A square package shape aids in efficient space utilization on PCBs, promoting better layout flexibility.

Nominal Supply Voltage (Vsup): 3.3 V

The standard nominal supply voltage is optimal for a wide range of electronics, ensuring compatibility with various devices.

No. of Terminals: 52

With 52 terminals, this IC can support multiple connections, offering versatility in power management solutions.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile design minimizes height, making it ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this IC suitable for industrial applications that may face thermal challenges.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this IC is perfect for applications in harsh environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and avoids oxidation, ensuring reliable performance.

Terminal Position: QUAD

The quad terminal position allows for efficient PCB layout and helps in minimizing inductance and resistance.

Maximum Seated Height: 2.45 mm

The low seated height allows for compact designs, which is advantageous in portable electronic devices.

Width: 10 mm

The 10 mm width strikes a balance between size and connectivity options, making it versatile for various applications.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Specialized in power supply management, this IC enhances system reliability and efficiency for power-critical applications.

Minimum Supply Voltage (Vsup): 2.97 V

This low minimum supply voltage ensures compatibility with a range of battery-powered devices.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds ensures it can withstand the assembly process without damage.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature is critical for modern soldering processes, ensuring robust connections.

Length: 10 mm

The uniform length of 10 mm complements its width, ensuring a compact footprint for efficient PCB design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specifications ensure reliability in challenging environments, extending the IC's usable life.

No. of Channels: 4

Having 4 channels allows for multi-functional power management, making it suitable for complex systems.

Terminal Form: GULL WING

The gull wing terminal design facilitates easier handling during assembly and enhances solder joint reliability.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm supports high-density designs, crucial for modern electronics needing compact components.

Moisture Sensitivity Level (MSL): 3

Being MSL 3 indicates moderate moisture sensitivity, guiding storage conditions and handling practices during assembly.

Maximum Supply Voltage (Vsup): 3.63 V

The maximum supply voltage allows for flexibility in design, supporting a range of output configurations.

Technical Specifications

Power Management ICs STFPC320BTR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.97 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

10 mm

Trade Compliance

STFPC320BTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 3