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STFPC320

STMicroelectronics

STFPC320 by STMicroelectronics

STFPC320 by STMicroelectronics is a versatile power management IC designed for industrial applications. It operates within a supply voltage range of 2.97V to 3.63V and features 4 channels with a low profile flatpack design. With an operating temp range of -40 °C to 85°C, it ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,210

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-

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Digiode

USA . 1,034 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,034

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-

-

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Anansix

USA . 926 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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926

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 347 parts In-Stock

1+ parts

$3.731

100+ parts

-

1k+ parts

$3.358

10k+ parts

-

347

$3.731

-

$3.358

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MKK Technologies

India . 1,317 parts In-Stock

1+ parts

$7.015

100+ parts

-

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-

10k+ parts

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1,317

$7.015

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DigiPath Technology Company

USA . 1,317 parts In-Stock

1+ parts

$7.015

100+ parts

-

1k+ parts

-

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-

1,317

$7.015

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-

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Corphita

USA . 4,928 parts In-Stock

1+ parts

-

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1k+ parts

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4,928

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Parana Technologies

USA . 1,726 parts In-Stock

1+ parts

-

100+ parts

$4.460

1k+ parts

-

10k+ parts

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1,726

-

$4.460

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Overview

Unlock the potential of your designs with the STFPC320 from STMicroelectronics, a leader in power management solutions. This efficient and reliable IC, designed for industrial applications, ensures optimal performance in demanding environments. With its low-profile package and robust temperature range, it fits seamlessly into your projects while delivering superior energy efficiency. Trust in STMicroelectronics' legacy of quality and innovation to elevate your product's performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and cost-effectiveness, making this IC suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for smaller footprints on PCBs, thus enabling more compact designs and efficient manufacturing processes.

Package Shape: SQUARE

A square package shape simplifies layout design and optimizes space utilization on the circuit board.

Nominal Supply Voltage (Vsup): 3.3 V

3.3 V is a widely used voltage level in modern electronics, making this IC compatible with many existing systems.

No. of Terminals: 52

With 52 terminals, this IC can connect to multiple functions and provides flexibility for various applications.

Package Style (Meter): FLATPACK, LOW PROFILE

Low-profile design minimizes height, allowing for space-saving solutions in applications with strict height restrictions.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this IC suitable for demanding environments, enhancing its reliability.

Minimum Operating Temperature: -40 °C

A minimum temperature rating of -40 °C allows for use in extreme cold conditions, broadening application possibilities.

Terminal Position: QUAD

Quad terminal positioning facilitates easier connections and layout design on printed circuit boards.

Maximum Seated Height: 1.54 mm

A low seated height promotes a slimmer profile in device designs, which is advantageous for mobile and portable applications.

Width: 14 mm

Compact width aids in space-constrained designs, allowing for efficient assembly in tight layouts.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, this IC is critical for maintaining optimal power levels and enhancing device efficiency.

Minimum Supply Voltage (Vsup): 2.97 V

The low minimum supply voltage allows for operation in a range of environments and applications where power is limited.

Length: 14 mm

A uniform length of 14 mm corresponds with its width, maximizing the symmetry and predictability for PCB design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures higher reliability and durability in challenging environmental conditions.

No. of Channels: 4

Four channels provide versatility in power management, allowing for more functions in a single circuit.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and provide a reliable connection, improving manufacturing yield.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for higher density layouts, accommodating advanced circuit design requirements.

Maximum Supply Voltage (Vsup): 3.63 V

The capability to handle up to 3.63 V affirms its flexibility in various electronic systems, allowing for expanded use cases.

Technical Specifications

Power Management ICs STFPC320 attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQFP-G52

Length:

14 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.54 mm

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.97 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width (mm):

14 mm

Trade Compliance

STFPC320 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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