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STFPC311

STMicroelectronics

STFPC311 by STMicroelectronics

STFPC311 by STMicroelectronics is a power management IC designed for industrial applications, operating b/w -40 °C and 85°C. It features a nominal voltage of 3.3V, with a compact flatpack design measuring 10mm x 10mm. This surface-mount device supports up to 52 terminals for efficient power supply management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,000 parts In-Stock

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6,000

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Rebound Electronics

UK . 5,796 parts In-Stock

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5,796

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Digiode

USA . 4,882 parts In-Stock

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4,882

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Anansix

USA . 2,244 parts In-Stock

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2,244

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Distributors (Availability)

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Microchip USA

USA . 128 parts In-Stock

1+ parts

$5.192

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128

$5.192

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IDEA Electronic Components Group

UK . 1,944 parts In-Stock

1+ parts

$7.313

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-

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$6.582

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1,944

$7.313

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$6.582

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MKK Technologies

India . 106 parts In-Stock

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$13.752

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106

$13.752

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DigiPath Technology Company

USA . 106 parts In-Stock

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$13.752

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106

$13.752

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AZTECH Wire

Italy . 653 parts In-Stock

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$21.370

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653

$21.370

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Corphita

USA . 3,667 parts In-Stock

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3,667

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Parana Technologies

USA . 1,852 parts In-Stock

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$8.744

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1,852

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$8.744

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Vigor

Singapore . 1,149 parts In-Stock

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1,149

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Overview

Elevate your power management solutions with the STFPC311 from STMicroelectronics, a trusted leader in innovative technology. Designed for reliability in demanding environments, this robust IC ensures optimal performance across various industrial applications. Its compact size and advanced features make it an ideal choice for efficient power supply management. Choose STFPC311 for unparalleled quality, exceptional durability, and the expertise of STMicroelectronics driving your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and lightweight design, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic circuits, reducing space requirements on PCBs.

Package Shape: SQUARE

The square package shape simplifies layout design and improves the thermal performance of the IC.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3 V makes this IC compatible with most digital circuits, ensuring easy integration.

No. of Terminals: 52

With 52 terminals, this IC offers high connectivity, allowing for various input and output configurations.

Package Style (Meter): FLATPACK

The flatpack style enhances thermal dissipation and makes the IC ideal for compact and thermally efficient designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C makes this IC suitable for high-temperature environments, ensuring reliability in industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for harsh environments, ensuring dependable performance under extreme conditions.

Terminal Position: QUAD

The quad terminal position allows for efficient connections on all four sides, providing flexibility in board layout.

Maximum Seated Height: 2.35 mm

A low seated height of 2.35 mm permits stacking in space-constrained designs and further enhances the compact nature of your applications.

Width: 10 mm

A width of 10 mm is ideal for various PCB designs, facilitating a balance between performance and size.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, this IC efficiently manages power distribution, ensuring optimal operation of connected components.

Minimum Supply Voltage (Vsup): 3 V

The ability to operate at a minimum supply voltage of 3 V allows for greater flexibility in various applications.

Length: 10 mm

With a length of 10 mm, this IC is designed for compact applications that require space-efficient solutions.

Temperature Grade: INDUSTRIAL

Being graded for industrial use, this IC is built to withstand the rigors of manufacturing environments and ensure longevity.

Terminal Form: GULL WING

Gull wing terminals provide enhanced solder joint reliability, making assembly easier and improving durability.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density layouts without compromising on soldering reliability.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V allows for flexibility in designs that require slightly higher voltage operation while maintaining stability.

Technical Specifications

Power Management ICs STFPC311 attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

10 mm

Trade Compliance

STFPC311 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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