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STFPC311BTR

STMicroelectronics

STFPC311BTR by STMicroelectronics

STFPC311BTR by STMicroelectronics is a power management IC designed for industrial applications, operating b/w -40 °C and 85 °C. It features a nominal voltage of 3.3V, with a compact 10mm x 10mm flatpack design and 52 terminals. Ideal for efficient power supply management in various electronic devices.

Median Price

$1.300

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 989 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.300

989

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-

$1.300

Distributors (In-Stock)

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Digiode

USA . 1,485 parts In-Stock

1+ parts

$2.594

100+ parts

-

1k+ parts

-

10k+ parts

-

1,485

$2.594

-

-

-

Vyrian

USA . 3,574 parts In-Stock

1+ parts

$2.730

100+ parts

-

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3,574

$2.730

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-

-

Rebound Electronics

UK . 5,660 parts In-Stock

1+ parts

-

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5,660

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-

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Anansix

USA . 1,494 parts In-Stock

1+ parts

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1,494

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-

-

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Bristol Electronics

USA . 1,071 parts In-Stock

1+ parts

-

100+ parts

$1.165

1k+ parts

$0.955

10k+ parts

-

1,071

-

$1.165

$0.955

-

Dan-Mar Components

USA . 1,071 parts In-Stock

1+ parts

-

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1,071

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,329 parts In-Stock

1+ parts

$2.457

100+ parts

-

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4,329

$2.457

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Vigor

Singapore . 5,554 parts In-Stock

1+ parts

$2.760

100+ parts

-

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5,554

$2.760

-

-

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Microchip USA

USA . 184 parts In-Stock

1+ parts

$9.464

100+ parts

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184

$9.464

-

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IDEA Electronic Components Group

UK . 1,982 parts In-Stock

1+ parts

$14.025

100+ parts

-

1k+ parts

$12.623

10k+ parts

-

1,982

$14.025

-

$12.623

-

MKK Technologies

India . 1,305 parts In-Stock

1+ parts

$26.374

100+ parts

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1,305

$26.374

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DigiPath Technology Company

USA . 1,305 parts In-Stock

1+ parts

$26.374

100+ parts

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1,305

$26.374

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Perfect Parts

USA . 32,366 parts In-Stock

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32,366

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Cyclops Electronics Ltd (Excess)

UK . 13,385 parts In-Stock

1+ parts

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13,385

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Kepictronics

USA . 3,800 parts In-Stock

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3,800

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Parana Technologies

USA . 883 parts In-Stock

1+ parts

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100+ parts

$16.770

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883

-

$16.770

-

-

Overview

Elevate your power management solutions with the STFPC311BTR by STMicroelectronics, a standout in reliability and efficiency. Designed for optimal performance in demanding environments, this robust IC ensures consistent voltage regulation while minimizing energy loss. Its compact package is perfect for space-constrained applications, making it ideal for industrial automation, telecommunications, and consumer electronics. Trust in STMicroelectronics’ legacy of innovation and quality to empower your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space.

Package Shape: SQUARE

A square package shape aids in uniform thermal distribution and simplifies PCB layout.

Nominal Supply Voltage (Vsup): 3.3 V

Standard voltage level makes it compatible with a wide range of digital systems.

No. of Terminals: 52

A higher number of terminals provides flexibility for various connections and features.

Package Style (Meter): FLATPACK

Flatpack design is ideal for automated assembly processes and saves space on PCBs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in extreme conditions, making it suitable for industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and reduces the risk of whiskering.

Terminal Position: QUAD

Quad terminal position allows for efficient routing and improved electrical performance.

Maximum Seated Height: 2.35 mm

Low seated height contributes to compact designs, which are essential in space-constrained applications.

Width: 10 mm

Standard width facilitates compatibility with existing PCB layouts while maintaining a compact footprint.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Designed specifically for power management applications, ensuring optimal performance in power distribution.

Minimum Supply Voltage (Vsup): 3 V

Versatile supply voltage supports a wide range of applications requiring low power consumption.

Maximum Time At Peak Reflow Temperature: 30 s

Short reflow time minimizes thermal stress on components during assembly.

Peak Reflow Temperature: 260 °C

High peak temperature accommodates lead-free soldering processes, meeting modern environmental standards.

Length: 10 mm

Standard length makes it easily integrable into existing designs and layouts.

Temperature Grade: INDUSTRIAL

Meets industrial grade requirements, ensuring longevity and reliability in harsh environments.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of inspection and soldering.

Terminal Pitch: 0.65 mm

Tighter terminal pitch allows for more connections in a limited space, maximizing PCB utility.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level allows for standard handling and storage practices.

Maximum Supply Voltage (Vsup): 3.6 V

Flexibility in supply voltage enhances compatibility with various components and systems.

Technical Specifications

Power Management ICs STFPC311BTR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

10 mm

Trade Compliance

STFPC311BTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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