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STF13NM60N-H

STMicroelectronics

STF13NM60N-H by STMicroelectronics

STF13NM60N-H from STMicroelectronics is an N-channel MOSFET ideal for switching applications, featuring a 600V breakdown voltage and 11A max drain current. It offers a low on-resistance of 0.36Ω and operates at up to 150 °C. This versatile FET is packaged in a flange mount design for easy integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,286 parts In-Stock

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8,286

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Anansix

USA . 2,287 parts In-Stock

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2,287

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Digiode

USA . 878 parts In-Stock

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878

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 213 parts In-Stock

1+ parts

$0.606

100+ parts

-

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$0.546

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213

$0.606

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$0.546

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MKK Technologies

India . 360 parts In-Stock

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$1.140

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360

$1.140

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DigiPath Technology Company

USA . 360 parts In-Stock

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$1.140

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360

$1.140

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AZTECH Wire

Italy . 427 parts In-Stock

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$17.810

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427

$17.810

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Alle Elektronik GmbH

Germany . 3,871 parts In-Stock

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3,871

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Corphita

USA . 3,393 parts In-Stock

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3,393

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Parana Technologies

USA . 1,238 parts In-Stock

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$0.725

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1,238

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$0.725

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Overview

Elevate your projects with the STF13NM60N-H from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET excels in switching applications, delivering reliability and efficiency even in demanding environments. With robust performance and built-in diode functionality, it offers exceptional value for industrial and consumer electronics alike. Trust STMicroelectronics for quality that powers your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional versatility and protection in switching applications.

Transistor Application: SWITCHING

Designed for efficient switching, this FET is ideal for power management and conversion applications.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage allows this FET to operate safely in high-voltage environments, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into various PCB designs, optimizing space use.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, ideal for high-power applications where reliability is critical.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer higher efficiency and faster switching times, making them a preferred choice in many applications.

Maximum Pulsed Drain Current (IDM): 44 A

This high pulsed current rating allows for handling transient loads effectively, which is crucial for robust power applications.

Avalanche Energy Rating (EAS): 200 mJ

An avalanche energy rating of 200 mJ ensures that this FET can withstand high-energy transients without damage.

Maximum Drain Current (Abs) (ID): 11 A

The ability to handle 11 A of current makes it suitable for a variety of power applications.

No. of Terminals: 3

Three terminals provide a simple connection scheme, facilitating easy integration into electronic circuits.

Maximum Power Dissipation (Abs): 25 W

This high power dissipation capability enables the device to handle significant heat, increasing reliability in demanding environments.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures secure attachment to heatsinks or chassis, improving thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making this FET efficient for a wide range of applications.

Maximum Operating Temperature: 150 °C

The high operating temperature ensures reliable performance in harsh environments, making it suitable for automotive and industrial applications.

Transistor Element Material: SILICON

Silicon material ensures good thermal performance and stability for reliable operation in various conditions.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and provides better corrosion resistance, improving longevity and reliability of connections.

Maximum Drain Current (ID): 11 A

Repeating spec: This current rating makes it suitable for applications requiring dependable power handling.

Maximum Drain-Source On Resistance: 0.36 ohm

A low on-resistance minimizes power loss and heat generation, making this FET highly efficient for power applications.

Terminal Position: SINGLE

Single terminal position simplifies layout design, offering flexibility in circuit design.

Case Connection: ISOLATED

Isolated case connection ensures safety and minimizes the risk of short circuits, making it suitable for high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) STF13NM60N-H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.36 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

44 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF13NM60N-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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