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STE50N40

STMicroelectronics

STE50N40 by STMicroelectronics

STE50N40 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 50 A, a breakdown voltage of 400 V, and power dissipation up to 450 W. Ideal for high-performance power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,459 parts In-Stock

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2,459

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Vyrian

USA . 2,335 parts In-Stock

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2,335

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Digiode

USA . 484 parts In-Stock

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484

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 407 parts In-Stock

1+ parts

$1.375

100+ parts

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$1.238

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407

$1.375

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$1.238

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MKK Technologies

India . 1,961 parts In-Stock

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$2.586

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1,961

$2.586

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DigiPath Technology Company

USA . 1,961 parts In-Stock

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$2.586

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1,961

$2.586

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Corphita

USA . 1,216 parts In-Stock

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1,216

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Parana Technologies

USA . 1,175 parts In-Stock

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$1.644

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1,175

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$1.644

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Kepictronics

USA . 564 parts In-Stock

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564

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Overview

Unlock unparalleled performance and reliability with the STE50N40 from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for efficient power management, this N-channel FET excels in versatile applications, from industrial automation to renewable energy systems. With superior switching capabilities and built-in protection, it ensures longevity and optimal operation. Experience the quality and expertise that come with STMicroelectronics—where cutting-edge technology meets exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material enhances reliability and withstands environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors provide high efficiency and are often preferred for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode offers protection against voltage spikes, increasing the reliability of the device in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, which enhances performance and efficiency in power management.

Minimum DS Breakdown Voltage: 400 V

A high breakdown voltage enables the device to handle higher voltages, making it suitable for various industrial applications.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient space utilization on circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control and efficiency in low-power applications.

Maximum Pulsed Drain Current (IDM): 200 A

High pulsed drain current capacity allows the device to handle transient conditions effectively in high-power situations.

Maximum Drain Current (Abs) (ID): 50 A

The ability to manage significant continuous current makes this FET ideal for demanding applications.

No. of Terminals: 4

Having four terminals allows for versatile connection options in circuit designs.

Maximum Power Dissipation (Abs): 450 W

A high power dissipation capability means this FET can operate in high-temperature, high-power environments without failure.

Package Style (Meter): FLANGE MOUNT

The flange mount style enhances mechanical stability and heat dissipation in heavy-duty applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, ideal for sensitive applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature expands the range of environments in which the FET can function reliably.

Transistor Element Material: SILICON

Silicon is the most widely used semiconductor material, providing excellent performance and stability.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and corrosion resistance in diverse environments.

Maximum Drain Current (ID): 50 A

The ability to handle significant current ensures the FET can perform well in high-load conditions.

Maximum Drain-Source On Resistance: 0.075 ohm

Low on-resistance minimizes energy loss during operation, enhancing overall efficiency in power applications.

Terminal Position: UPPER

Upper terminal positioning facilitates easier integration into various designs and layouts.

Case Connection: ISOLATED

Isolated case connections enhance safety and prevent unintended electrical paths in circuit designs.

Reference Standard: UL RECOGNIZED

Being UL recognized signifies compliance with safety standards, promoting trust and reliability in applications.

Technical Specifications

Power Field Effect Transistors (FET) STE50N40 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

400 V

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PUFM-X4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STE50N40 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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