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STD38NH02L-1

STMicroelectronics

STD38NH02L-1 by STMicroelectronics

STD38NH02L-1 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 38 A, a breakdown voltage of 24 V, and operates at up to 175 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,915 parts In-Stock

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Digiode

USA . 3,923 parts In-Stock

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Anansix

USA . 839 parts In-Stock

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839

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IDEA Electronic Components Group

UK . 1,641 parts In-Stock

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$0.561

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$0.505

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1,641

$0.561

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$0.505

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MKK Technologies

India . 307 parts In-Stock

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$1.055

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307

$1.055

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DigiPath Technology Company

USA . 307 parts In-Stock

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$1.055

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307

$1.055

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AZTECH Wire

Italy . 1,013 parts In-Stock

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$16.740

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$16.740

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Component Stockers USA

USA . 478 parts In-Stock

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$99.990

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478

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,918 parts In-Stock

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Kepictronics

USA . 5,075 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,999 parts In-Stock

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Corphita

USA . 3,465 parts In-Stock

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Parana Technologies

USA . 1,500 parts In-Stock

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$0.671

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$0.671

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Overview

Elevate your projects with the STD38NH02L-1 from STMicroelectronics, a leader in power solutions. This N-channel FET combines superior reliability with remarkable efficiency, making it ideal for high-performance switching applications. With its robust construction and impressive thermal capabilities, this transistor ensures long-lasting performance under demanding conditions. Choose STMicroelectronics for top-tier quality that empowers your innovations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better performance than P-channel types, providing lower on-resistance and higher efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode enhances protection against back EMF, making it ideal for inductive load applications.

Transistor Application: SWITCHING

This FET is optimized for switching applications, providing fast response times and improved efficiency in power management systems.

Minimum DS Breakdown Voltage: 24 V

A minimum breakdown voltage of 24 V ensures that the transistor can operate safely in various voltage environments.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient PCB layout and space optimization for compact electronic designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals enhance mechanical stability and allow for easier soldering, suitable for prototyping and production.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control over the on-state of the transistor, providing high input impedance.

Maximum Pulsed Drain Current (IDM): 152 A

The high pulsed drain current rating allows it to handle large surges, making it suitable for applications requiring high power bursts.

Avalanche Energy Rating (EAS): 250 mJ

A significant avalanche energy rating increases reliability and robustness in applications exposed to voltage spikes.

Maximum Drain Current (Abs) (ID): 38 A

This maximum drain current rating makes it suitable for high-power applications, ensuring reliable operation under load.

No. of Terminals: 3

A three-terminal design simplifies circuit integration while ensuring efficient operation in various configurations.

Maximum Power Dissipation (Abs): 40 W

With a 40 W maximum power dissipation, this FET can efficiently manage heat, prolonging its operational lifespan.

Package Style (Meter): IN-LINE

The in-line package style allows for easy assembly and integration into standard electronic circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides low power consumption and high-speed switching capabilities, making this FET excellent for modern electronics.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature indicates the device's ability to function in demanding conditions, enhancing reliability.

Transistor Element Material: SILICON

Silicon as a semiconductor material offers a good balance of performance and cost-effectiveness for various applications.

Maximum Drain Current (ID): 38 A

High maximum drain current rating ensures robust performance in power applications, handling significant loads effectively.

Maximum Drain-Source On Resistance: 0.0135 ohm

Low on-resistance minimizes power loss during operation, enhancing overall efficiency and thermal performance.

Terminal Position: SINGLE

A single terminal position simplifies design implementation, allowing for straightforward circuit integration.

Case Connection: DRAIN

This configuration provides direct connection for efficient power delivery to the load, optimizing performance in circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) STD38NH02L-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, LOW THRESHOLD

Avalanche Energy Rating (EAS):

250 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

38 A

Maximum Drain Current (ID):

38 A

Maximum Drain-Source On Resistance:

.0135 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

152 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD38NH02L-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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