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STD30NF04LT

STMicroelectronics

STD30NF04LT by STMicroelectronics

STD30NF04LT by STMicroelectronics is a N-CHANNEL FET with 30A max drain current and 50W max power dissipation. Ideal for power applications, it operates at up to 175 °C and features surface mount configuration for easy installation.

Median Price

$0.977

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,462 parts In-Stock

1+ parts

-

100+ parts

-

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6,462

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Digiode

USA . 4,688 parts In-Stock

1+ parts

-

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-

1k+ parts

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4,688

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Anansix

USA . 2,354 parts In-Stock

1+ parts

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2,354

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Micros

Poland . 200 parts In-Stock

1+ parts

-

100+ parts

$1.030

1k+ parts

$0.490

10k+ parts

$0.490

200

-

$1.030

$0.490

$0.490

Partservice

France . 200 parts In-Stock

1+ parts

-

100+ parts

$0.912

1k+ parts

$0.434

10k+ parts

$0.434

200

-

$0.912

$0.434

$0.434

Micros sp.j. W. Kędra i J. Lic

Poland . 200 parts In-Stock

1+ parts

-

100+ parts

$0.977

1k+ parts

$0.465

10k+ parts

$0.465

200

-

$0.977

$0.465

$0.465

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 498 parts In-Stock

1+ parts

$1.103

100+ parts

-

1k+ parts

$0.993

10k+ parts

-

498

$1.103

-

$0.993

-

MKK Technologies

India . 1,959 parts In-Stock

1+ parts

$2.074

100+ parts

-

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1,959

$2.074

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DigiPath Technology Company

USA . 1,959 parts In-Stock

1+ parts

$2.074

100+ parts

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1,959

$2.074

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AZTECH Wire

Italy . 1,212 parts In-Stock

1+ parts

$20.980

100+ parts

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1,212

$20.980

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

1+ parts

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50,000

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QUARKTWIN TECHNOLOGY LTD

USA . 15,840 parts In-Stock

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15,840

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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9,000

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Alle Elektronik GmbH

Germany . 4,321 parts In-Stock

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4,321

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Kepictronics

USA . 1,500 parts In-Stock

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1,500

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Parana Technologies

USA . 1,042 parts In-Stock

1+ parts

-

100+ parts

$1.319

1k+ parts

-

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1,042

-

$1.319

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Corphita

USA . 741 parts In-Stock

1+ parts

-

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741

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Overview

Unlock the power of innovation with the STD30NF04LT by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Power Field Effect Transistors that offer unparalleled performance and reliability. With a maximum drain current of 30 A and maximum power dissipation of 50 W, this N-CHANNEL FET is optimized for high-demand applications. Trust STMicroelectronics to provide cutting-edge technology and superior engineering, ensuring your projects run smoothly and efficiently. Experience the difference with the STD30NF04LT and elevate your designs to new heights.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors typically have higher electron mobility, leading to faster switching speeds and lower on-resistance, making them ideal for high power applications.

Configuration: SINGLE

Single configuration simplifies circuit design and reduces complexity, making it easier to integrate into various electronic systems.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, making it suitable for modern electronics with limited space.

Maximum Drain Current (Abs) (ID): 30 A

High maximum drain current capacity allows for handling high power loads, making it suitable for power amplifier and high current applications.

Maximum Power Dissipation (Abs): 50 W

High power dissipation capability ensures reliable performance under heavy load conditions and prevents overheating, increasing the overall reliability of the system.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers better insulation properties, lower leakage current, and higher efficiency, making it suitable for power management and switching applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows for operation in harsh environments and ensures stable performance under varying temperature conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection and long-term performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for efficient soldering process during manufacturing, ensuring proper connection and solder joint reliability.

Technical Specifications

Power Field Effect Transistors (FET) STD30NF04LT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Trade Compliance

STD30NF04LT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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