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STD134N4F7AG

STMicroelectronics

STD134N4F7AG by STMicroelectronics

STD134N4F7AG by STMicroelectronics is a high-performance N-channel FET designed for switching applications. It features a max drain current of 80 A, a breakdown voltage of 40 V, and operates efficiently at temperatures up to 175 °C. Ideal for power management in compact designs, it offers low on-resistance and built-in diode functionality.

Median Price

$1.935

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 7,500 parts In-Stock

1+ parts

$1.180

100+ parts

-

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10k+ parts

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7,500

$1.180

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Element14

Singapore . 2,500 parts In-Stock

1+ parts

$2.690

100+ parts

$1.790

1k+ parts

$1.290

10k+ parts

$1.270

2,500

$2.690

$1.790

$1.290

$1.270

Avnet

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,500

-

-

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Distributors (In-Stock)

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Digiode

USA . 3,231 parts In-Stock

1+ parts

$1.121

100+ parts

-

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3,231

$1.121

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Vyrian

USA . 2,051 parts In-Stock

1+ parts

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2,051

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Anansix

USA . 1,347 parts In-Stock

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1,347

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 884 parts In-Stock

1+ parts

$1.062

100+ parts

-

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-

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884

$1.062

-

-

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Continental Prestige Electronics

USA . 75 parts In-Stock

1+ parts

$1.360

100+ parts

$0.778

1k+ parts

$0.482

10k+ parts

-

75

$1.360

$0.778

$0.482

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IDEA Electronic Components Group

UK . 1,025 parts In-Stock

1+ parts

$1.820

100+ parts

-

1k+ parts

$1.638

10k+ parts

-

1,025

$1.820

-

$1.638

-

MKK Technologies

India . 1,253 parts In-Stock

1+ parts

$3.422

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1,253

$3.422

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DigiPath Technology Company

USA . 1,253 parts In-Stock

1+ parts

$3.422

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1,253

$3.422

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Microchip USA

USA . 8,396 parts In-Stock

1+ parts

$6.185

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8,396

$6.185

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Component Stockers USA

USA . 8,737 parts In-Stock

1+ parts

$15.300

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8,737

$15.300

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iodParts Technologies Inc.

India . 26,351 parts In-Stock

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26,351

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Perfect Parts

USA . 5,600 parts In-Stock

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5,600

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Alle Elektronik GmbH

Germany . 1,600 parts In-Stock

1+ parts

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1,600

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Parana Technologies

USA . 507 parts In-Stock

1+ parts

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100+ parts

$2.176

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507

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$2.176

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Overview

Elevate your projects with the STD134N4F7AG from STMicroelectronics—a pinnacle of quality and reliability in power FET technology. Designed for seamless switching applications, this N-channel transistor excels in performance, boasting robust current handling and efficient thermal management. With STMicroelectronics' commitment to excellence, you gain not just a component but a trusted partner for innovative designs across automotive, industrial, and consumer electronics, ensuring superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy helps in providing durability and reliability in various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and better performance for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode enhances the performance by providing better protection against voltage spikes.

Transistor Application: SWITCHING

Designed for switching applications, this FET is ideal for driving loads efficiently.

Surface Mount: YES

Surface mount technology facilitates compact design and improved thermal management in electronic circuits.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET is versatile for various applications while ensuring safety.

Package Shape: RECTANGULAR

Rectangular package shape is optimized for space efficiency on PCB layouts.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical stability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for higher efficiency and lower power consumption during operation.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed drain current capability makes this FET suitable for high-power applications.

Avalanche Energy Rating (EAS): 325 mJ

A robust avalanche energy rating ensures reliability under transient conditions, making it suitable for automotive use.

No. of Terminals: 2

Minimal terminal count aids in simpler designs and reduces the footprint.

Maximum Power Dissipation (Abs): 134 W

High power dissipation capability allows this FET to handle demanding applications without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style maximizes space and is ideal for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology leads to faster switching speeds and lower power consumption, making it efficient for modern applications.

Maximum Operating Temperature: 175 °C

A high operating temperature range ensures reliability and performance in challenging thermal environments.

Transistor Element Material: SILICON

Silicon as a material provides excellent electrical properties, stability, and performance longevity.

Minimum Operating Temperature: -55 °C

The broad temperature range allows for use in extreme environments, key for automotive and industrial applications.

Maximum Drain Current (ID): 80 A

A maximum drain current capability of 80A supports high-performance applications requiring significant power.

Maximum Drain-Source On Resistance: 0.0035 ohm

Low on-resistance significantly reduces power losses during operation, enhancing overall efficiency.

Terminal Position: SINGLE

Single terminal position simplifies PCB layout and enhances design robustness.

Case Connection: DRAIN

DRAIN case connection provides a straightforward interfacing in circuit designs.

Maximum Feedback Capacitance (Crss): 60 pF

Low feedback capacitance results in better frequency performance, suitable for high-speed applications.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 ensures that the product meets stringent automotive standards for reliability and quality.

Technical Specifications

Power Field Effect Transistors (FET) STD134N4F7AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

BULK: 2500

Avalanche Energy Rating (EAS):

325 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

60 pF

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD134N4F7AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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