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STCCP27TBR

STMicroelectronics

STCCP27TBR by STMicroelectronics

STCCP27TBR by STMicroelectronics is a CMOS line receiver with a max supply voltage of 3.6V and operates in -40 °C to 85 °C range. It features a compact 25-terminal grid array design, supporting up to 8A output current. Ideal for industrial applications requiring reliable signal transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,924 parts In-Stock

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2,924

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Anansix

USA . 1,332 parts In-Stock

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1,332

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Prism Electronics

USA . 414 parts In-Stock

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414

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Vyrian

USA . 255 parts In-Stock

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255

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 827 parts In-Stock

1+ parts

$3.096

100+ parts

-

1k+ parts

$2.786

10k+ parts

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827

$3.096

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$2.786

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MKK Technologies

India . 955 parts In-Stock

1+ parts

$5.821

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955

$5.821

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DigiPath Technology Company

USA . 955 parts In-Stock

1+ parts

$5.821

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955

$5.821

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Corphita

USA . 4,836 parts In-Stock

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4,836

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Parana Technologies

USA . 576 parts In-Stock

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$3.702

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576

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$3.702

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Overview

Elevate your designs with the STCCP27TBR line driver from STMicroelectronics, where quality meets innovation. Renowned for excellence, STMicroelectronics ensures unmatched reliability and efficiency in every chip. This compact solution delivers precision performance across various applications, from industrial automation to communication systems. Enjoy enhanced signal integrity and robust operation even in demanding environments, maximizing value while minimizing power consumption. Choose STCCP27TBR for superior performance that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability, making the product suitable for various industrial applications.

Surface Mount: YES

The surface mount capability allows for compact design and ensures efficient space utilization on PCBs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V provides flexibility in system design for compatibility with low-voltage applications.

Package Shape: SQUARE

The square package shape simplifies layout and routing on PCB, contributing to better thermal performance.

Power Supplies: 1.8, 2.8

Support for multiple power supply voltages makes this product versatile for different system requirements.

No. of Terminals: 25

With 25 terminals, the product offers extensive connectivity options, allowing for complex signal handling.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array design and thin profile optimize performance in compact electronics, ideal for space-constrained applications.

Minimum Supply Voltage: 2.65 V

A minimum supply voltage of 2.65 V ensures wide compatibility with low-power devices.

Maximum Operating Temperature: 85 °C

Rated for a maximum operating temperature of 85 °C, ensuring reliability in demanding thermal environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this component is reliable for use in extreme conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish aids in solderability and enhances connections on printed circuit boards.

Terminal Position: BOTTOM

Bottom-positioned terminals facilitate easy soldering and effective surface mount integration.

Maximum Seated Height: 1.16 mm

A low maximum seated height allows for a low-profile design, ideal for slim electronic devices.

Width: 3 mm

With a compact width of 3 mm, the product is well-suited for miniaturized applications.

Maximum Output Low Current: 8 Amp

The ability to handle up to 8 Amps in low output current scenarios makes this device appropriate for robust applications.

Length: 3 mm

A compact length of 3 mm makes this line driver and receiver a space-efficient component.

Temperature Grade: INDUSTRIAL

Classified as industrial-grade, this product ensures reliability and performance in harsh environments.

Maximum Receive Delay: 8.5 ns

A maximum receive delay of 8.5 ns highlights quick response times, beneficial for high-speed signal processing.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it an effective solution for digital applications.

Terminal Form: BALL

Ball terminal form provides enhanced mechanical strength and reliability during soldering.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger inputs enhance signal integrity and reduce noise susceptibility.

Nominal Supply Voltage: 2.8 V

With a nominal supply voltage of 2.8 V, this product is tailored for energy-efficient applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for a high density of connections while maintaining ease of assembly.

Interface IC Type: LINE RECEIVER

As a line receiver IC type, this component is specialized for robust communication over difficult transmission paths.

Technical Specifications

Line Drivers & Receivers STCCP27TBR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRES 1.8V SECONDARY SUPPLY

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8,2.8

Qualification:

Not Qualified

Maximum Receive Delay:

8.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.16 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.65 V

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

3 mm

Trade Compliance

STCCP27TBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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