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STCCP27ATBR

STMicroelectronics

STCCP27ATBR by STMicroelectronics

STCCP27ATBR by STMicroelectronics is a CMOS line receiver with an 8-bit capacity, operating b/w -40 °C to 85°C. It supports supply voltages of 1.65V to 3.6V and features a max output low current of 8A. Ideal for industrial applications, it ensures reliable data transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,807 parts In-Stock

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4,807

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Anansix

USA . 853 parts In-Stock

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853

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Digiode

USA . 707 parts In-Stock

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707

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 421 parts In-Stock

1+ parts

$2.705

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421

$2.705

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IDEA Electronic Components Group

UK . 2,088 parts In-Stock

1+ parts

$12.429

100+ parts

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$11.186

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2,088

$12.429

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$11.186

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AZTECH Wire

Italy . 647 parts In-Stock

1+ parts

$14.410

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647

$14.410

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MKK Technologies

India . 202 parts In-Stock

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$23.372

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202

$23.372

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DigiPath Technology Company

USA . 202 parts In-Stock

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$23.372

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202

$23.372

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Component Stockers USA

USA . 800 parts In-Stock

1+ parts

$99.990

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800

$99.990

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Vigor

Singapore . 2,660 parts In-Stock

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2,660

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Corphita

USA . 1,881 parts In-Stock

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1,881

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Parana Technologies

USA . 597 parts In-Stock

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$14.861

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597

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$14.861

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Overview

Unlock unparalleled performance with the STCCP27ATBR from STMicroelectronics, a leader in innovation and quality. This compact line driver and receiver combines robust design and exceptional reliability, ideal for industrial applications. With its superior temperature tolerance and efficient power management, it ensures seamless data transmission and enhances system longevity. Elevate your projects with a trusted solution that delivers value, efficiency, and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into modern PCB designs, saving space and improving assembly efficiency.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows compatibility with a wide range of low-voltage applications, ensuring versatile usage.

Package Shape: SQUARE

The square package shape can facilitate efficient space utilization on the PCB, enhancing overall design flexibility.

Maximum Supply Voltage-1: 1.95 V

This lower maximum supply voltage option makes the device suitable for ultra-low voltage applications, extending its usability.

Power Supplies (V): 1.8, 2.8

With various power supply options at 1.8 V and 2.8 V, this product fits diverse system designs and applications.

No. of Terminals: 25

The 25 terminals allow for multi-functional connectivity, supporting complex interfacing requirements in modern electronics.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array and fine pitch design enable high-density mounting on PCBs, ideal for compact and sophisticated applications.

Minimum Supply Voltage-1: 1.65 V

This low minimum supply voltage enhances power efficiency and allows for operation in battery-powered devices.

Minimum Supply Voltage: 2.65 V

Enabling operation at a minimum supply voltage of 2.65 V supports applications that require reliable performance under low voltage conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for industrial environments, ensuring reliability in harsh conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this product ideal for applications in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish provides excellent solderability and corrosion resistance, enhancing product longevity.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier mounting and reduces space along the sides, optimizing PCB layout.

Maximum Seated Height: 1.16 mm

The low seated height supports compact designs, making it suitable for space-constrained applications.

Width: 3 mm

A compact width of 3 mm aids in maintaining small footprints on circuit boards without sacrificing functionality.

Maximum Output Low Current: 8 Amp

With a maximum output low current capability of 8 Amp, this product is suitable for applications requiring high current handling.

Receiver No. of Bits: 8

The 8-bit receiver provides reliable data transmission, essential for effective communication in digital systems.

Maximum Time At Peak Reflow Temperature: 40 s

A peak reflow time of 40 seconds minimizes the risk of component damage, ensuring quality during soldering processes.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature withstands modern manufacturing practices, ensuring compatibility with lead-free soldering.

Length: 3 mm

With a length of 3 mm, this device contributes to compact layouts while providing significant functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product ensures robust performance and reliability in demanding environments.

Maximum Receive Delay: 8.5 ns

The low receive delay is crucial for high-speed data transmission, enhancing the performance of communication systems.

Technology: CMOS

Using CMOS technology indicates low power consumption and high-speed operation, making it ideal for energy-efficient applications.

Terminal Form: BALL

Ball terminal form enhances connection reliability and supports automated assembly processes in manufacturing.

Maximum Supply Current: 7 mA

With a maximum supply current of 7 mA, this device is power-efficient, contributing to lower overall energy consumption.

Input Characteristics: DIFFERENTIAL

Differential input characteristics improve noise immunity, ensuring stable communication in noisy environments.

Nominal Supply Voltage: 2.8 V

Nominal supply voltage of 2.8 V aligns with many low-power applications, optimizing energy usage in operation.

Terminal Pitch: 0.5 mm

The fine terminal pitch supports high-density designs, crucial for minimizing space on modern circuit boards.

Nominal Supply Voltage-1: 1.8 V

The 1.8 V nominal supply voltage option provides versatility, making it suitable for a range of designs and applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, outlining storage and handling protocols that maintain product integrity.

Interface IC Type: LINE RECEIVER

As a line receiver, this IC is specifically designed for reliable data communication, making it essential for signal integrity in systems.

Technical Specifications

Line Drivers & Receivers STCCP27ATBR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,2.8

Qualification:

Not Qualified

Maximum Receive Delay:

8.5 ns

Receiver No. of Bits:

8

Maximum Seated Height:

1.16 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.65 V

Nominal Supply Voltage:

2.8 V

Maximum Supply Voltage-1:

1.95 V

Minimum Supply Voltage-1:

1.65 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

STCCP27ATBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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