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STB12NM60N-1

STMicroelectronics

STB12NM60N-1 by STMicroelectronics

STB12NM60N-1 by STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a 600V breakdown voltage, 10A max drain current, and 90W power dissipation. This versatile FET operates efficiently in high-temperature environments up to 150 °C.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,037 parts In-Stock

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5,037

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Digiode

USA . 3,995 parts In-Stock

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3,995

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Anansix

USA . 639 parts In-Stock

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IDEA Electronic Components Group

UK . 25 parts In-Stock

1+ parts

$1.776

100+ parts

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$1.598

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25

$1.776

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$1.598

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MKK Technologies

India . 1,191 parts In-Stock

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$3.339

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$3.339

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DigiPath Technology Company

USA . 1,191 parts In-Stock

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$3.339

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1,191

$3.339

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AZTECH Wire

Italy . 1,039 parts In-Stock

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$18.560

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1,039

$18.560

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Alle Elektronik GmbH

Germany . 4,019 parts In-Stock

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4,019

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Corphita

USA . 813 parts In-Stock

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Parana Technologies

USA . 784 parts In-Stock

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$2.123

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784

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$2.123

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Overview

Unlock superior performance with the STB12NM60N-1 from STMicroelectronics, a trusted leader in power solutions. This high-quality N-channel FET is designed for efficient switching applications, making it ideal for industrial and consumer electronics alike. With impressive durability and reliability, this transistor ensures optimal power management while minimizing heat generation. Choose STMicroelectronics for innovation that drives your projects forward, providing unmatched value and efficiency you can count on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and faster switching speeds, which enhances efficiency in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier integration into circuit designs, providing reverse current protection and enhancing overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching, this FET is ideal for a variety of applications, including power management and signal processing.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this component can handle high-voltage applications, ensuring safety and performance in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space and facilitates efficient layout on PCBs, making it suitable for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robustness and better mechanical stability, making them ideal for high-reliability applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and better overall efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 40 A

The ability to handle high pulsed currents means increased reliability and performance in dynamic load conditions.

Avalanche Energy Rating (EAS): 200 mJ

A high avalanche rating enhances the FET's capability to withstand transient conditions, contributing to device longevity.

Maximum Drain Current (Abs) (ID): 10 A

Capable of supporting substantial current levels, this FET is suitable for demanding applications where high performance is required.

No. of Terminals: 3

With three terminals, this FET is simple to integrate into circuits, allowing for straightforward design and assembly processes.

Maximum Power Dissipation (Abs): 90 W

High power dissipation capability ensures that the FET can operate efficiently without overheating, extending its service life.

Package Style (Meter): IN-LINE

In-line packaging simplifies PCB layout and improves thermal performance, making it a practical choice for various designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high-speed switching and lower power consumption, making the device efficient for modern applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating allows for usage in extreme conditions, ensuring reliability across a wide range of environments.

Transistor Element Material: SILICON

Silicon technology offers good thermal conductivity and is widely used, ensuring availability and compatibility in designs.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good solderability and corrosion resistance, enhancing the durability of connections.

Maximum Drain Current (ID): 10 A

Similar to the previous entry, this high drain current supports substantial loads, enabling effective functionality in various applications.

Maximum Drain-Source On Resistance: 0.41 ohm

Low on-resistance indicates efficient power transmission and minimal heat generation, promoting energy savings in power circuits.

Terminal Position: SINGLE

A single terminal position simplifies PCB design and layout, making it easier for engineers to integrate into their systems.

Maximum Time At Peak Reflow Temperature (s): 40

Capability to withstand longer reflow times contributes to reliable soldering processes during manufacturing, ensuring quality assembly.

Peak Reflow Temperature °C: 245

A high peak reflow temperature ensures compatibility with modern soldering techniques, making it versatile for various assembly processes.

Technical Specifications

Power Field Effect Transistors (FET) STB12NM60N-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.41 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB12NM60N-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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