Loading...

STB100NH02LT4

STMicroelectronics

STB100NH02LT4 by STMicroelectronics

STB100NH02LT4 from STMicroelectronics is a high-performance N-channel FET designed for efficient switching applications. It features a max drain current of 60 A, a breakdown voltage of 24 V, and operates at up to 175 °C. Ideal for power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,979 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,979

-

-

-

-

Anansix

USA . 1,389 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,389

-

-

-

-

Digiode

USA . 1,314 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,314

-

-

-

-

Electronics Depot

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 863 parts In-Stock

1+ parts

$1.823

100+ parts

-

1k+ parts

$1.640

10k+ parts

-

863

$1.823

-

$1.640

-

MKK Technologies

India . 1,936 parts In-Stock

1+ parts

$3.427

100+ parts

-

1k+ parts

-

10k+ parts

-

1,936

$3.427

-

-

-

DigiPath Technology Company

USA . 1,936 parts In-Stock

1+ parts

$3.427

100+ parts

-

1k+ parts

-

10k+ parts

-

1,936

$3.427

-

-

-

AZTECH Wire

Italy . 469 parts In-Stock

1+ parts

$8.250

100+ parts

-

1k+ parts

-

10k+ parts

-

469

$8.250

-

-

-

Kepictronics

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,000

-

-

-

-

Corphita

USA . 4,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,861

-

-

-

-

Alle Elektronik GmbH

Germany . 3,401 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,401

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,650

-

-

-

-

Parana Technologies

USA . 1,370 parts In-Stock

1+ parts

-

100+ parts

$2.179

1k+ parts

-

10k+ parts

-

1,370

-

$2.179

-

-

RC Electronics

USA . 57 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

57

-

-

-

-

Overview

Unlock unparalleled performance with the STB100NH02LT4 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET is designed for efficient switching, offering superior reliability and remarkable thermal management for demanding applications. Ideal for power converters, motor drives, and industrial systems, it ensures minimal energy losses while maximizing output. Experience enhanced durability and performance that drive your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher efficiency and faster switching, making them ideal for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances circuit protection by preventing reverse current flow, providing added reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently handle power management in electronics.

Surface Mount: YES

Surface mount technology allows for compact designs and improved thermal performance, making it a great choice for modern PCBs.

Minimum DS Breakdown Voltage: 24 V

A minimum breakdown voltage of 24V allows for safe operation in a variety of electronic applications without risk of failure.

Package Shape: RECTANGULAR

The rectangular shape provides easy integration into circuit layouts, optimizing the use of space on PCBs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly on PCBs, enhancing manufacturing efficiency.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables the FET to switch on fully with minimal drive voltage, enhancing efficiency.

Maximum Pulsed Drain Current (IDM): 240 A

A high pulsed drain current rating makes this FET suitable for high-performance applications requiring significant short-term power.

Avalanche Energy Rating (EAS): 600 mJ

A high avalanche energy rating indicates the transistor can withstand inductive loads, making it robust for high-stress applications.

Maximum Drain Current (Abs) (ID): 60 A

A maximum drain current of 60A makes this FET capable of handling substantial loads, ideal for high-power applications.

No. of Terminals: 2

A simple two-terminal structure simplifies the design and integration into various electronic circuits.

Maximum Power Dissipation (Abs): 100 W

With a maximum power dissipation of 100W, this FET can effectively manage heat, ensuring reliable operation in demanding situations.

Package Style (Meter): SMALL OUTLINE

The small outline package ensures a compact design, allowing for high-density mounting on printed circuit boards.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides higher switching speeds and greater efficiency compared to other technologies, making it a superior choice.

Maximum Operating Temperature: 175 °C

The high operating temperature limit offers reliability in extreme conditions, suitable for automotive and industrial applications.

Transistor Element Material: SILICON

Silicon offers excellent thermal stability and electrical properties, contributing to the reliability of the FET.

Terminal Finish: MATTE TIN

Matte tin terminal finishing enhances solderability and minimizes corrosion, ensuring long-term performance.

Maximum Drain Current (ID): 60 A

This dual mention reinforces its capability to support high current loads in various applications.

Maximum Drain-Source On Resistance: 0.006 ohm

A low on-resistance minimizes power losses during operation, contributing to overall circuit efficiency.

Terminal Position: SINGLE

A single terminal position simplifies the layout and integration, making it easier for design engineers.

Case Connection: DRAIN

The case connection focusing on the drain ensures efficient power management and thermal performance.

Technical Specifications

Power Field Effect Transistors (FET) STB100NH02LT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Avalanche Energy Rating (EAS):

600 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB100NH02LT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20