Loading...

STA1102RQTR

STMicroelectronics

STA1102RQTR by STMicroelectronics

STA1102RQTR by STMicroelectronics is a high-speed line transceiver with a max supply voltage of 3.6V and operates efficiently b/w 0 °C to 85°C. It features a very thin profile, measuring just 4mm x 4mm, with transmit/receive delays of only 0.4ns. Ideal for compact applications requiring differential output in surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,519 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,519

-

-

-

-

Digiode

USA . 2,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,861

-

-

-

-

Anansix

USA . 2,184 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,184

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 955 parts In-Stock

1+ parts

$11.637

100+ parts

-

1k+ parts

$10.473

10k+ parts

-

955

$11.637

-

$10.473

-

MKK Technologies

India . 82 parts In-Stock

1+ parts

$21.883

100+ parts

-

1k+ parts

-

10k+ parts

-

82

$21.883

-

-

-

DigiPath Technology Company

USA . 82 parts In-Stock

1+ parts

$21.883

100+ parts

-

1k+ parts

-

10k+ parts

-

82

$21.883

-

-

-

A-Z Elektronik GmbH

Germany . 6,284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,284

-

-

-

-

Parana Technologies

USA . 1,716 parts In-Stock

1+ parts

-

100+ parts

$13.914

1k+ parts

-

10k+ parts

-

1,716

-

$13.914

-

-

Corphita

USA . 295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

295

-

-

-

-

Overview

Elevate your designs with the STA1102RQTR from STMicroelectronics, a top-tier line driver and receiver that ensures exceptional performance in a compact form. Designed for high-speed applications, it delivers rapid data transmission while maintaining reliability under various conditions. With STMicroelectronics' renowned commitment to quality, this versatile IC is perfect for telecommunications, automotive, and industrial applications, providing unmatched efficiency and value for your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier integration into compact PCB designs, optimizing space and improving assembly efficiency.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for various applications while ensuring stable performance.

Package Shape: SQUARE

Square package shape aids in efficient use of PCB space and simplifies layout designs.

Maximum Transmit Delay: 0.4 ns

Low transmit delay enhances signal integrity and supports high-speed communication, making it ideal for demanding applications.

No. of Terminals: 20

A generous number of terminals allows for complex circuit configurations and increased I/O flexibility.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink design facilitate heat dissipation, improving reliability in high-performance scenarios.

Minimum Supply Voltage: 3 V

Lower supply voltage requirement ensures compatibility with low-power systems, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Designed to operate in high-temperature environments, ensuring reliability in challenging conditions.

Minimum Operating Temperature: 0 °C

Operates effectively from ambient temperature, suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal positioning aids in symmetrical layout, improving electrical performance and reducing interference.

Maximum Seated Height: 0.8 mm

Low profile reduces overall device height in assemblies, crucial for space-constrained designs.

Width: 4 mm

Compact width makes it ideal for dense circuit board layouts.

Differential Output: YES

Differential output enhances signal quality by reducing susceptibility to noise, resulting in improved communication reliability.

Length: 4 mm

Short length contributes to a compact overall package, facilitating easy integration into tight spaces.

Maximum Receive Delay: 0.4 ns

Low receive delay ensures rapid response times, supporting high-speed data transmission.

Terminal Form: NO LEAD

No-lead design enhances reliability and simplifies assembly while improving the thermal performance of the device.

Input Characteristics: DIFFERENTIAL

Differential inputs further enhance noise immunity and signal integrity, making it suitable for high-speed applications.

Nominal Supply Voltage: 3.3 V

Optimized supply voltage ensures peak performance while maximizing power efficiency for a range of applications.

Terminal Pitch: 0.5 mm

Tighter terminal pitch allows for high-density interconnections, ideal for modern high-performance electronic designs.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC provides robust communication functionality, perfect for interfacing in data transmission applications.

Technical Specifications

Line Drivers & Receivers STA1102RQTR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N20

Length:

4 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Receive Delay:

.4 ns

Receiver No. of Bits:

1

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Transmit Delay:

.4 ns

Width:

4 mm

Trade Compliance

STA1102RQTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 1