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ST7FOXK2T6

STMicroelectronics

ST7FOXK2T6 by STMicroelectronics

ST7FOXK2T6 microcontroller from STMicroelectronics features a 5V supply, operates in -40 °C to 85°C range, and includes 10 ADC channels. Ideal for industrial applications, it supports I2C/SPI connectivity and has a low-profile package design. With 32 terminals and 384 bytes of RAM, it's perfect for compact embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,657 parts In-Stock

1+ parts

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4,657

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Digiode

USA . 1,624 parts In-Stock

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1,624

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Anansix

USA . 1,125 parts In-Stock

1+ parts

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1,125

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,858 parts In-Stock

1+ parts

$1.470

100+ parts

-

1k+ parts

-

10k+ parts

-

2,858

$1.470

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-

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Microchip USA

USA . 484 parts In-Stock

1+ parts

$2.252

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-

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484

$2.252

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AZTECH Wire

Italy . 1,218 parts In-Stock

1+ parts

$16.970

100+ parts

-

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1,218

$16.970

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IDEA Electronic Components Group

UK . 755 parts In-Stock

1+ parts

$44.493

100+ parts

-

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$40.044

10k+ parts

-

755

$44.493

-

$40.044

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MKK Technologies

India . 2,139 parts In-Stock

1+ parts

$83.666

100+ parts

-

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2,139

$83.666

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DigiPath Technology Company

USA . 2,139 parts In-Stock

1+ parts

$83.666

100+ parts

-

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2,139

$83.666

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Component Stockers USA

USA . 300 parts In-Stock

1+ parts

$99.990

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300

$99.990

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Perfect Parts

USA . 10,360 parts In-Stock

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10,360

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A-Z Elektronik GmbH

Germany . 4,530 parts In-Stock

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4,530

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Parana Technologies

USA . 1,810 parts In-Stock

1+ parts

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100+ parts

$53.198

1k+ parts

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1,810

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$53.198

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Corphita

USA . 1,464 parts In-Stock

1+ parts

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1,464

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GreenTree Electronics

Israel . 1,100 parts In-Stock

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1,100

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Overview

Unlock your innovation potential with the ST7FOXK2T6 microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for reliability and performance, this versatile component excels across various applications, from industrial automation to consumer electronics. Its compact, low-profile design ensures seamless integration, while advanced features like I2C and SPI connectivity enhance functionality. Trust in ST's quality and experience to propel your projects forward, delivering efficiency and precision that drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and moderate thermal stability, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for higher precision in assembly and saves space on PCB layouts.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, the microcontroller is safe for use with standard 5V power supplies.

Package Shape: SQUARE

The square package shape optimizes space on a circuit board and enhances thermal performance.

Bit Size: 8

An 8-bit architecture is efficient for simple applications and can handle basic control tasks easily.

Power Supplies (V): 5

Designed to operate on a 5V supply, enabling compatibility with widely available power sources.

No. of Terminals: 32

The ample number of terminals allows for numerous I/O connections, enhancing versatility in various applications.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design minimizes height on the board, benefiting compact designs.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V allows for a broader range of available power source options.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this microcontroller suitable for industrial environments.

CPU Family: ST72

The ST72 CPU family offers reliable performance, primarily geared towards control and automation applications.

Minimum Operating Temperature: -40 °C

This product's tolerance to low temperatures ensures it can be deployed in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Built-in ADC channels allow for easy interfacing with analog sensors, enhancing application flexibility.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and maximizes connection density.

ROM Words: 8192

With 8192 ROM words available, there is sufficient space for user programs and firmware.

Maximum Seated Height: 1.6 mm

The low seated height helps in compact designs and allows for better airflow in tight spaces.

Width: 7 mm

A compact width of 7 mm helps integrate the microcontroller into smaller devices seamlessly.

Peripherals: TIMER(6)

Six timers provide extensive timing options for various applications such as PWM generation or event counting.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz offers sufficient performance for most standard control applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures the microcontroller can withstand the reflow soldering process without damage.

Peak Reflow Temperature °C: 260

Designed for high-temperature soldering processes, this microcontroller can be assembled using industry-standard practices.

Length: 7 mm

The compact length enhances ease of integration into small-scale electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates reliability in demanding operational conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is ideal for dedicated control applications, enabling greater efficiency.

RAM Bytes: 384

384 bytes of RAM provide sufficient memory for storing temporary data and variables in simple applications.

Technology: CMOS

CMOS technology enables low power consumption, which is essential for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals offer better solder joint reliability and are compatible with automated assembly processes.

Analog To Digital Convertors: 10-Ch 10-Bit

With 10 channels and 10-bit resolution, this ADC allows for accurate conversion of analog signals.

Maximum Supply Current: 9 mA

A maximum supply current of 9 mA indicates low power consumption in operational tasks.

Nominal Supply Voltage: 5 V

The nominal voltage of 5 V provides a standard and reliable operating condition for various applications.

PWM Channels: YES

Having Pulse Width Modulation (PWM) channels enables precise control of motors and other devices.

Connectivity: I2C, SPI

Support for I2C and SPI interfaces enhances the microcontroller's ability to communicate with various other devices.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to firmware as needed.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, this component is well-suited for modern, compact PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, guiding proper handling and storage during manufacturing.

Speed: 8 rpm

An operational speed of 8 rpm suits applications requiring low-speed control, like motors or actuators.

On Chip Program ROM Width: 8

The 8-bit program ROM width is efficient for simple control applications and minimizes resource usage.

No. of I/O Lines: 24

Twenty-four I/O lines provide flexibility in interfacing with various external components and sensors.

Technical Specifications

Microcontrollers ST7FOXK2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

TIMER(6)

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

ST7FOXK2T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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