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ST7FMC2S6T3

STMicroelectronics

ST7FMC2S6T3 by STMicroelectronics

STMicroelectronics ST7FMC2S6T3 microcontroller features 8-bit CPU, 32768 ROM words, and 1024 RAM bytes. Ideal for automotive applications with LIN, SCI, SPI connectivity options and 11-Ch 10-Bit ADC channels. Operates b/w -40 to 125 °C with a max clock frequency of 16 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,467 parts In-Stock

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6,467

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Digiode

USA . 2,512 parts In-Stock

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2,512

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Anansix

USA . 1,868 parts In-Stock

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1,868

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Distributors (Availability)

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Microchip USA

USA . 196 parts In-Stock

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$10.316

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196

$10.316

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AZTECH Wire

Italy . 154 parts In-Stock

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$12.800

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154

$12.800

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IDEA Electronic Components Group

UK . 871 parts In-Stock

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$66.137

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$59.523

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871

$66.137

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$59.523

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MKK Technologies

India . 96 parts In-Stock

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$124.366

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96

$124.366

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DigiPath Technology Company

USA . 96 parts In-Stock

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$124.366

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96

$124.366

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Vigor

Singapore . 1,979 parts In-Stock

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Parana Technologies

USA . 1,142 parts In-Stock

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$79.077

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$79.077

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Perfect Parts

USA . 1,075 parts In-Stock

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Corphita

USA . 151 parts In-Stock

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Overview

Unleash the power of innovation with the ST7FMC2S6T3 microcontroller by STMicroelectronics. This cutting-edge device offers unmatched quality and reliability, making it the top choice for automotive applications. With advanced features like 11-channel ADC, 1024 bytes of RAM, and 5 PWM channels, this microcontroller provides exceptional performance and versatility. Experience seamless connectivity with LIN, SCI, and SPI interfaces, while enjoying the benefits of low power consumption and high-speed processing. Elevate your designs to the next level with the ST7FMC2S6T3 microcontroller - the ultimate solution for all your automotive electronics needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for easy and fast assembly of the microcontroller onto a PCB.

Maximum Supply Voltage: 5.5 V

A high maximum supply voltage ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

Square packages are space-efficient and allow for efficient layout on a PCB.

Bit Size: 8

8-bit microcontrollers are suitable for applications that do not require complex processing.

Power Supplies (V): 5

Operating at a standard 5V voltage simplifies power management and interfacing with other components.

No. of Terminals: 44

Having a sufficient number of terminals allows for versatile connectivity options with peripherals and external devices.

Package Style (Meter): FLATPACK, LOW PROFILE

Flatpack low profile packages are suitable for compact designs and applications with limited space.

Minimum Supply Voltage: 3.8 V

A low minimum supply voltage ensures that the microcontroller can operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions.

CPU Family: ST72

The ST72 CPU family is known for its reliability and performance in microcontroller applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this microcontroller suitable for a wide range of environments.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and ensures reliable connections with other components.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

Quad terminal positions simplify PCB layout and routing for efficient design.

ROM Words: 32768

With a large ROM capacity, this microcontroller can store a significant amount of program data.

Maximum Seated Height: 1.6 mm

A low seated height enables a compact design and facilitates efficient heat dissipation.

Width: 10 mm

Compact width dimensions make this microcontroller suitable for space-constrained applications.

Peripherals: TIMER(5)

Having 5 timer peripherals allows for precise timing and control in various applications.

Maximum Clock Frequency: 16 MHz

A high clock frequency enables fast processing and response times in the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures that the microcontroller can be assembled efficiently with solder reflow processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable solder joints and ensures long-term durability.

Length: 10 mm

Compact length dimensions contribute to a space-efficient design for the microcontroller.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets the stringent requirements of the automotive industry.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller-specific IC ensures that this product is optimized for embedded control applications.

RAM Bytes: 1024

With a sufficient RAM capacity, this microcontroller can efficiently store and access data during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and robust mechanical connections on the PCB.

Analog To Digital Convertors: 11-Ch 10-Bit

Having 11 ADC channels with 10-bit resolution enables precise conversion of analog signals to digital data.

Maximum Supply Current: 18 mA

With a low supply current, this microcontroller operates efficiently without consuming excessive power.

Nominal Supply Voltage: 5 V

Operating at a standard 5V voltage simplifies power management and interfacing with other components.

PWM Channels: YES

Having PWM channels allows for precise control of analog devices such as motors and LEDs.

Connectivity: LIN, SCI, SPI

Support for LIN, SCI, and SPI interfaces enables versatile communication options with other devices and systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible updating of firmware on the microcontroller.

Terminal Pitch: 0.8 mm

With a fine terminal pitch, this microcontroller can accommodate a high density of connections on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this microcontroller has moderate sensitivity to moisture, suitable for typical assembly and storage conditions.

Speed: 8 rpm

At 8 RPM, this microcontroller can handle real-time processing tasks efficiently.

On Chip Program ROM Width: 8

With an 8-bit program ROM width, this microcontroller can store and process program instructions effectively.

No. of I/O Lines: 26

Having 26 I/O lines provides ample connectivity options for interfacing with external devices and components.

Technical Specifications

Microcontrollers ST7FMC2S6T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

LIN, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

11-Ch 10-Bit

Trade Compliance

ST7FMC2S6T3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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