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ST7FMC2S4T6

STMicroelectronics

ST7FMC2S4T6 by STMicroelectronics

ST7FMC2S4T6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, supporting up to 11 ADC channels. It operates within -40 °C to 85 °C and is ideal for industrial applications requiring reliable performance. With a compact flatpack design, it offers versatile connectivity options like LIN and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,295 parts In-Stock

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3,295

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Digiode

USA . 3,029 parts In-Stock

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3,029

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Anansix

USA . 2,450 parts In-Stock

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2,450

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Cyclops Electronics Ltd

UK . 3 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 204 parts In-Stock

1+ parts

$9.030

100+ parts

-

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204

$9.030

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Vigor

Singapore . 50 parts In-Stock

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$42.000

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50

$42.000

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IDEA Electronic Components Group

UK . 1,779 parts In-Stock

1+ parts

$52.164

100+ parts

-

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$46.948

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1,779

$52.164

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$46.948

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MKK Technologies

India . 1,215 parts In-Stock

1+ parts

$98.091

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1,215

$98.091

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DigiPath Technology Company

USA . 1,215 parts In-Stock

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$98.091

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1,215

$98.091

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GreenTree Electronics

Israel . 69,120 parts In-Stock

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Perfect Parts

USA . 6,359 parts In-Stock

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6,359

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RC Electronics

USA . 5,752 parts In-Stock

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$6.360

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$5.800

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$5.630

5,752

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$6.360

$5.800

$5.630

Kepictronics

USA . 4,842 parts In-Stock

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Corphita

USA . 3,402 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,052 parts In-Stock

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Futuretech Components

Singapore . 1,080 parts In-Stock

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S.R.D Solutions

India . 780 parts In-Stock

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780

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Parana Technologies

USA . 442 parts In-Stock

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$62.370

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442

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$62.370

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iodParts Technologies Inc.

India . 59 parts In-Stock

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59

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Overview

Unlock the potential of your projects with the ST7FMC2S4T6 microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, STMicroelectronics delivers a powerhouse that excels in various applications, from industrial automation to automotive systems. With its robust performance and versatile connectivity options, this microcontroller ensures efficient operation, empowering you to create innovative solutions that stand out in today's competitive landscape. Embrace excellence and elevate your designs with unmatched value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for compact design and efficient use of PCB space.

Maximum Supply Voltage: 5.5 V

Supports a higher maximum voltage, providing flexibility in power supply options.

Package Shape: SQUARE

The square shape optimizes space on the PCB and allows for efficient thermal management.

Bit Size: 8

An 8-bit architecture is typically simpler and well-suited for numerous embedded applications.

Power Supplies (V): 5

Standard 5V power supply makes it compatible with a wide range of devices and applications.

No. of Terminals: 44

The high number of terminals provides the ability to connect multiple peripherals and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design is advantageous for space-constrained applications.

Minimum Supply Voltage: 3.8 V

Allows for operation with a wider range of supply voltages, enhancing versatility in designs.

Maximum Operating Temperature: 85 °C

Rated for high operating temperatures, making it suitable for industrial applications.

CPU Family: ST72

Part of a well-established CPU family, benefiting from extensive support and resources.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, perfect for outdoor and industrial applications.

Terminal Finish: Matte Tin (Sn) - annealed

This finish provides excellent solderability, ensuring reliable connections in manufacturing.

ADC Channels: YES

Presence of ADC channels allows for interfacing with analog sensors, adding to functionality.

Terminal Position: QUAD

Quad positioning aids in easier routing and improved signal integrity on PCBs.

ROM Words: 16384

Sufficient ROM capacity for various applications, allowing complex programs to be stored.

Maximum Seated Height: 1.6 mm

Low seated height enhances compatibility with tight layouts and minimizes profile.

Width: 10 mm

Compact width allows for versatile PCB designs and integration into space-sensitive applications.

Peripherals: TIMER(5)

Multiple timers enable precise timing control for various applications.

Maximum Clock Frequency: 16 MHz

A decent clock frequency for 8-bit microcontrollers, suitable for many common tasks.

Maximum Time At Peak Reflow Temperature (s): 30

A longer time at peak temperature supports various assembly processes including soldering.

Peak Reflow Temperature (°C): 260

High peak reflow temperature indicates compatibility with robust soldering methods.

Length: 10 mm

Maintaining compact dimensions, this microcontroller fits easily into small devices.

Temperature Grade: INDUSTRIAL

Industrial grade means it can withstand harsher environmental conditions, ensuring longevity.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, making it ideal for embedded applications.

RAM Bytes: 768

A substantive amount of RAM for data processing makes it effective for a variety of tasks.

Technology: CMOS

CMOS technology enables low power consumption and high integration levels.

Terminal Form: GULL WING

Gull wing terminals provide reliability in solder connections, crucial for durability.

Analog To Digital Converters: 11-Ch 10-Bit

Multiple ADCs with 10-bit resolution enhance the ability to read analog signals accurately.

Maximum Supply Current: 18 mA

Low supply current is beneficial for battery-operated devices to extend operational life.

Nominal Supply Voltage: 5 V

Common nominal voltage ensures wide compatibility with existing electronic components.

PWM Channels: YES

PWM capability allows for precise control of motors and other devices, increasing versatility.

Connectivity: LIN, SCI, SPI

Multiple connectivity options enable seamless communication with various peripherals and networks.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming of the firmware.

Terminal Pitch: 0.8 mm

Fine terminal pitch facilitates high-density layouts on PCBs, accommodating more functionality.

Moisture Sensitivity Level (MSL): 3

MSL 3 means it can handle exposure to moisture and is suitable for various environments.

Speed: 8 rpm

Speed rating indicates suitability for low-speed applications, such as automotive and industrial controls.

On Chip Program ROM Width: 8

8-bit program ROM width is adequate for many simple control applications.

No. of I/O Lines: 26

A good number of I/O lines enables the connection of multiple sensors and actuators.

Technical Specifications

Microcontrollers ST7FMC2S4T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

768

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

LIN, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

11-Ch 10-Bit

Trade Compliance

ST7FMC2S4T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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