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ST7FMC2R6T6

STMicroelectronics

ST7FMC2R6T6 by STMicroelectronics

ST7FMC2R6T6 microcontroller from STMicroelectronics features a 5V supply, 64 terminals, and operates in -40 °C to 85 °C. With 16 MHz max clock speed and integrated ADC channels, it's ideal for industrial applications requiring reliable performance. Its compact design ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,460 parts In-Stock

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7,460

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Digiode

USA . 2,983 parts In-Stock

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2,983

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Anansix

USA . 2,013 parts In-Stock

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2,013

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Chip Stock

USA . 675 parts In-Stock

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675

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 362 parts In-Stock

1+ parts

$21.150

100+ parts

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362

$21.150

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IDEA Electronic Components Group

UK . 1,876 parts In-Stock

1+ parts

$40.693

100+ parts

-

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$36.624

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1,876

$40.693

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$36.624

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MKK Technologies

India . 2,249 parts In-Stock

1+ parts

$76.521

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2,249

$76.521

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DigiPath Technology Company

USA . 2,249 parts In-Stock

1+ parts

$76.521

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2,249

$76.521

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QUARKTWIN TECHNOLOGY LTD

USA . 13,677 parts In-Stock

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13,677

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Microchip USA

USA . 5,476 parts In-Stock

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5,476

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Vigor

Singapore . 3,755 parts In-Stock

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3,755

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,261 parts In-Stock

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$48.655

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1,261

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$48.655

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Corphita

USA . 325 parts In-Stock

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325

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Overview

Unlock innovation with the ST7FMC2R6T6 microcontroller from STMicroelectronics, a leader in cutting-edge technology. This compact powerhouse delivers exceptional performance, reliability, and versatility for diverse applications—from industrial controls to consumer electronics. With robust features like multiple ADC channels and seamless connectivity options, it empowers engineers to create smarter solutions, ensuring your projects are not just built, but crafted for excellence. Experience quality that stands the test of time!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on printed circuit boards.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supply systems.

Package Shape: SQUARE

The square package shape offers efficient space utilization and standardization in mounting.

Bit Size: 8

An 8-bit size is suitable for simpler applications, providing adequate processing power while maintaining efficiency.

Power Supplies (V): 5

Operating at 5 V simplifies design considerations and reduces the need for voltage conversion in many applications.

No. of Terminals: 64

With 64 terminals, this microcontroller supports various peripherals and functionalities, making it versatile for different projects.

Package Style (Meter): FLATPACK, LOW PROFILE

A flatpack low profile design is ideal for space-constrained applications while ensuring a sturdy connection.

Minimum Supply Voltage: 3.8 V

The ability to operate at a minimum of 3.8 V allows flexibility in power supply options, enhancing usability.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this microcontroller suitable for industrial applications where heat may be a factor.

CPU Family: ST72

Part of the ST72 family, this microcontroller benefits from a solid reputation for reliability and performance.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C ensures reliability in extreme environments, such as automotive and industrial applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish improves the solderability of terminals, facilitating easier manufacturing and assembly processes.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to process analog signals, enhancing its functionality for various applications.

Terminal Position: QUAD

Quad terminal positioning allows for better layout options on PCBs, accommodating dense designs.

ROM Words: 32768

A ROM word capacity of 32,768 provides ample storage for programs, accommodating more complex applications.

Maximum Seated Height: 1.6 mm

A low seated height promotes compact design, essential for modern electronics that require space efficiency.

Width: 14 mm

With a width of 14 mm, this microcontroller is suitable for a variety of applications requiring small footprints.

Peripherals: TIMER(5)

Having five timers gives the chip flexibility in timing applications, making it ideal for real-time processing needs.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides sufficient speed for most tasks while maintaining low power consumption.

Maximum Time At Peak Reflow Temperature: 30 s

The capability to withstand peak reflow temperatures supports robust manufacturing processes.

Peak Reflow Temperature: 250 °C

A peak reflow temperature of 250 °C reflects compatibility with contemporary soldering practices, enhancing reliability.

Length: 14 mm

At a length of 14 mm, this microcontroller remains space-efficient while providing considerable functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the microcontroller can operate reliably in challenging environments.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is optimized for control-oriented tasks in a variety of applications.

RAM Bytes: 1024

1,024 bytes of RAM allows for adequate data processing and temporary storage for applications.

Technology: CMOS

CMOS technology contributes to low power consumption, enhancing battery life in portable applications.

Terminal Form: GULL WING

Gull wing terminals facilitate effective soldering and assembly, improving the overall manufacturing process.

Analog To Digital Converters: 16-Ch 10-Bit

A 16-channel 10-bit ADC provides extensive features for high-precision measurement, essential for applications requiring sensor integration.

Maximum Supply Current: 18 mA

A maximum supply current of 18 mA indicates low power requirements, making it suitable for low-power applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V simplifies integration with existing electronic systems.

PWM Channels: YES

Pulse Width Modulation (PWM) support allows for control of motors and other devices, enhancing versatility.

Connectivity: LIN, SCI, SPI

Multiple connectivity options like LIN, SCI, and SPI make it easily adaptable for various communication needs.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming, increasing the longevity and flexibility of designs.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is compatible with common PCB layouts, simplifying the design and assembly process.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, guiding proper handling and storage during manufacturing.

Speed: 8 rpm

Its speed of 8 rpm is adequate for applications requiring controlled movements, suitable for automation tasks.

On Chip Program ROM Width: 8

An 8-bit program ROM width aligns with the 8-bit architecture, allowing for efficient data processing.

No. of I/O Lines: 44

With 44 I/O lines, this microcontroller can interface with a multitude of sensors and actuators in complex systems.

Technical Specifications

Microcontrollers ST7FMC2R6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

44

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

LIN, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST7FMC2R6T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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