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ST7FLITEU09U3TR

STMicroelectronics

ST7FLITEU09U3TR by STMicroelectronics

ST7FLITEU09U3TR microcontroller from STMicroelectronics operates at 3.3-5.5 V with a max temp of 125 °C, making it ideal for automotive applications. It features 8-bit architecture, 2048 ROM words, and includes ADC channels for versatile data processing. Its compact design (4.5x3.5 mm) ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,889 parts In-Stock

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2,889

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Vyrian

USA . 2,172 parts In-Stock

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2,172

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Digiode

USA . 680 parts In-Stock

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680

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Distributors (Availability)

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AZTECH Wire

Italy . 1,130 parts In-Stock

1+ parts

$16.190

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1,130

$16.190

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IDEA Electronic Components Group

UK . 223 parts In-Stock

1+ parts

$39.722

100+ parts

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$35.750

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223

$39.722

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$35.750

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MKK Technologies

India . 1,496 parts In-Stock

1+ parts

$74.694

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1,496

$74.694

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DigiPath Technology Company

USA . 1,496 parts In-Stock

1+ parts

$74.694

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1,496

$74.694

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Microchip USA

USA . 7,573 parts In-Stock

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7,573

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Corphita

USA . 1,740 parts In-Stock

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1,740

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Parana Technologies

USA . 512 parts In-Stock

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$47.494

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512

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$47.494

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Overview

Unlock innovation with the ST7FLITEU09U3TR microcontroller from STMicroelectronics, a leader in semiconductor technology. Designed for high-performance applications, this ultra-reliable 8-bit microcontroller excels in automotive environments, boasting exceptional temperature resilience and low power consumption. Enhance your designs with integrated ADCs and timers, delivering outstanding efficiency and flexibility. Trust STMicroelectronics to elevate your projects with cutting-edge quality and support!

Feature Benefit Bullets

Surface Mount: YES

This surface mount design allows for easy integration into compact electronic circuits, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The wide maximum supply voltage offers flexibility in design and allows for use in a variety of power management circumstances.

Package Shape: RECTANGULAR

The rectangular package shape ensures efficient space utilization on PCBs and facilitates better layout options.

Bit Size: 8

An 8-bit architecture is suitable for many basic control applications, providing a balance of performance and simplicity.

Power Supplies (V): 3/5

Support for both 3V and 5V supply voltages makes this microcontroller versatile for various application requirements.

No. of Terminals: 8

The 8 terminals allow for sufficient I/O capabilities while maintaining a compact footprint, suitable for minimalistic designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink capability enhance thermal management and fit within slim enclosures.

Minimum Supply Voltage: 3.3 V

Supports modern low-power designs with a minimum supply voltage of 3.3V, which is essential for energy-efficient applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this MCU suitable for automotive and industrial applications where extreme conditions are common.

CPU Family: ST72

The ST72 family is known for its reliability and versatility, ensuring a broad scope of application options.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is fit for use in harsh environments and outdoor applications.

ADC Channels: YES

The presence of ADC channels allows for seamless analog signal processing, enabling a range of sensor interfaces.

Terminal Position: DUAL

Dual terminal positions make for easy routing on boards and improve manufacturability.

ROM Words: 2048

2048 words of ROM capacity provide ample storage for firmware, allowing for complex applications with multiple features.

Maximum Seated Height: 1 mm

With a seated height of just 1 mm, this microcontroller can fit within ultra-thin design constraints.

Width: 3.5 mm

A width of 3.5 mm contributes to miniaturization, making it suitable for handheld and compact devices.

Data EEPROM Size: 128

128 bytes of Data EEPROM allows for persistent data storage, essential for applications that require data retention without power.

Peripherals: TIMER(2)

Having two timers enhances the ability to manage multiple tasks or control signals efficiently.

Maximum Clock Frequency: 8 MHz

With a maximum clock frequency of 8 MHz, this microcontroller provides adequate processing speed for general applications.

Length: 4.5 mm

The compact length of 4.5 mm complements the small form factor, making it easy to integrate into limited spaces.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications ensures reliability and robustness needed for vehicle electronics.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is specifically tailored for control tasks in embedded systems.

RAM Bytes: 128

With 128 bytes of RAM, it provides necessary temporary data storage for operations without overwhelming the system.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, suitable for battery-operated devices.

Terminal Form: NO LEAD

No lead terminals reduce the environmental impact and improve the suitability for lead-free manufacturing processes.

Analog To Digital Converters: 5-Ch 10-Bit

Five channels of 10-bit ADCs enable multiple analog inputs, making it versatile for complex sensor applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V is standard in many applications, ensuring compatibility with various technologies.

PWM Channels: YES

The inclusion of PWM channels allows for advanced control capabilities in motors and lighting applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware without the need for special programming equipment.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch provides compatibility with common PCB designs, simplifying assembly and manufacturing.

Speed: 8 rpm

A speed rating of 8 rpm indicates sufficient performance for many low-speed control applications.

On Chip Program ROM Width: 8

With an 8-bit ROM width, this MCU offers simplicity in programming, beneficial for straightforward applications.

No. of I/O Lines: 6

Six I/O lines provide flexible interfacing options, allowing connection to various peripherals and interfaces.

Technical Specifications

Microcontrollers ST7FLITEU09U3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-XDSO-N8

Length:

4.5 mm

No. of I/O Lines:

6

No. of Terminals:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.12,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

3.5 mm

Peripheral IC Type:

Data EEPROM Size:

128

Peripherals:

TIMER(2)

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

ST7FLITEU09U3TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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