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ST7FLITEU09M3TR

STMicroelectronics

ST7FLITEU09M3TR by STMicroelectronics

ST7FLITEU09M3TR microcontroller from STMicroelectronics features an 8-bit CPU with a max supply voltage of 5.5V and operates in extreme temperatures (-40 °C to 125 °C). It includes 2048 ROM words, 128 RAM bytes, and supports ADC with 5 channels. Ideal for automotive applications, it offers reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,379 parts In-Stock

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7,379

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Digiode

USA . 4,728 parts In-Stock

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4,728

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Anansix

USA . 1,425 parts In-Stock

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1,425

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Distributors (Availability)

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Microchip USA

USA . 462 parts In-Stock

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$1.797

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462

$1.797

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AZTECH Wire

Italy . 37 parts In-Stock

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$12.840

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37

$12.840

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IDEA Electronic Components Group

UK . 1,847 parts In-Stock

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$72.536

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$65.283

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1,847

$72.536

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$65.283

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MKK Technologies

India . 1,754 parts In-Stock

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$136.400

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1,754

$136.400

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DigiPath Technology Company

USA . 1,754 parts In-Stock

1+ parts

$136.400

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1,754

$136.400

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RC Electronics

USA . 5,000 parts In-Stock

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5,000

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Vigor

Singapore . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,908 parts In-Stock

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2,908

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Parana Technologies

USA . 753 parts In-Stock

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$86.728

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753

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$86.728

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Overview

Elevate your projects with the ST7FLITEU09M3TR microcontroller from STMicroelectronics, a leader in innovation and quality. This compact powerhouse offers exceptional performance in automotive applications, designed to thrive under extreme conditions. With its versatile features, including 5-channel ADCs and PWM capabilities, it ensures seamless integration and reliable operation. Choose STMicroelectronics for unmatched reliability and empower your designs with cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material allows for reliability and protection against environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology ensures a compact design, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The ability to operate at a maximum voltage of 5.5 V provides flexibility for a variety of power supply designs.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient board layout and easier integration into circuit designs.

Bit Size: 8

8-bit architecture is sufficient for many control applications, offering a good balance between processing power and cost.

Power Supplies (V): 3/5

Compatibility with both 3V and 5V power supplies enhances versatility, allowing it to fit into diverse systems.

No. of Terminals: 8

With 8 terminals, the microcontroller supports multiple I/O operations while remaining compact.

Package Style (Meter): SMALL OUTLINE

Small outline packaging optimizes PCB space, which is critical for forming compact electronics.

Minimum Supply Voltage: 3.3 V

The capability to operate at a minimum voltage of 3.3 V renders it suitable for low-power applications.

Maximum Operating Temperature: 125 °C

Designed for high temperature resilience, this microcontroller is ideal for automotive and industrial applications.

CPU Family: ST72

The ST72 family is known for its reliable performance in various applications, ensuring robust processing capabilities.

Minimum Operating Temperature: -40 °C

Operating in extreme temperatures makes the microcontroller highly suitable for harsh environments.

ADC Channels: YES

Integrated ADC channels enhance its ability to interface with sensors, making it more versatile for data acquisition.

Terminal Position: DUAL

Dual terminal positioning allows for easier soldering and better connectivity options on the PCB.

ROM Words: 2048

A substantial ROM capacity allows for complex program storage, providing ample space for application logic.

Maximum Seated Height: 1.75 mm

The low profile contributes to compact design and allows integration into thin devices.

Width: 3.9 mm

Width optimization allows better design flexibility when integrating into smaller footprint applications.

Data EEPROM Size: 128

Sufficient EEPROM space for storing critical data enhances functionality in embedded applications.

Peripherals: TIMER(2)

With two timers, this microcontroller can handle time-sensitive operations efficiently, useful for real-time applications.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency provides adequate processing speed for most control tasks, maintaining energy efficiency.

Length: 4.9 mm

Compact length contributes to a smaller PCB design, accommodating space-restricted applications.

Temperature Grade: AUTOMOTIVE

An automotive temperature grade ensures reliability in demanding conditions, suitable for vehicle applications.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it provides specific functionalities for embedded projects and automation.

RAM Bytes: 128

128 bytes of RAM allow for essential data manipulation and operational efficiency in applications.

Technology: CMOS

CMOS technology offers low power consumption, enhancing efficiency and battery life for portable applications.

Terminal Form: GULL WING

Gull wing leads simplify assembly and provide strong solder joints for reliable electrical connection.

Analog To Digital Convertors: 5-Ch 10-Bit

With five 10-bit ADC channels, it allows high-resolution analog sensing, increasing its application range.

Nominal Supply Voltage: 5 V

Standard nominal voltage of 5V aligns with typical electrical component systems, promoting compatibility.

PWM Channels: YES

Pulse Width Modulation capabilities enable advanced control of motors and other devices, enhancing the microcontroller's utility.

ROM Programmability: FLASH

Flash programmability facilitates easy updates and modifications to the stored program, allowing for quick adaptations.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is suitable for standard PCB designs, aiding in easier assembly and fabrication.

Speed: 8 rpm

The 8 rpm speed rating indicates the capability to handle lower-speed applications effectively without complex computing.

On Chip Program ROM Width: 8

8-bit program ROM width allows suitable storage and processing of data in applications requiring basic control.

No. of I/O Lines: 6

Six I/O lines facilitate sufficient interfacing with other components or systems, enhancing system connectivity.

Technical Specifications

Microcontrollers ST7FLITEU09M3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of I/O Lines:

6

No. of Terminals:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.75 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Peripheral IC Type:

Data EEPROM Size:

128

Peripherals:

TIMER(2)

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

ST7FLITEU09M3TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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