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ST7FLITE39F2B6

STMicroelectronics

ST7FLITE39F2B6 by STMicroelectronics

ST7FLITE39F2B6 microcontroller from STMicroelectronics operates at 3.3-5.5V with a max temp of 85 °C, featuring 8-bit architecture and 16 MHz clock speed. It includes 7 ADC channels and supports LIN/SPI connectivity. Ideal for industrial applications requiring reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,522 parts In-Stock

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Chip Stock

USA . 5,280 parts In-Stock

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5,280

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Digiode

USA . 3,132 parts In-Stock

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Anansix

USA . 381 parts In-Stock

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381

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Microchip USA

USA . 260 parts In-Stock

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$7.971

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260

$7.971

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AZTECH Wire

Italy . 571 parts In-Stock

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$13.410

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571

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IDEA Electronic Components Group

UK . 1,181 parts In-Stock

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$28.347

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$25.512

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$28.347

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$25.512

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MKK Technologies

India . 1,548 parts In-Stock

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$53.305

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$53.305

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DigiPath Technology Company

USA . 1,548 parts In-Stock

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$53.305

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$53.305

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A-Z Elektronik GmbH

Germany . 7,340 parts In-Stock

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Corphita

USA . 4,826 parts In-Stock

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Parana Technologies

USA . 1,782 parts In-Stock

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$33.893

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Vigor

Singapore . 1,161 parts In-Stock

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Kepictronics

USA . 82 parts In-Stock

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Overview

Unlock limitless possibilities with the ST7FLITE39F2B6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for industrial applications, this robust 8-bit MCU offers reliable performance, low power consumption, and an impressive range of connectivity options. Elevate your projects with enhanced functionality and efficiency, ensuring you stay ahead in a competitive market. Choose STMicroelectronics for unparalleled quality and support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance to environmental factors, making this microcontroller suitable for a variety of applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate safely without the risk of damage, which is ideal for projects with variable power sources.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient layout and integration onto printed circuit boards (PCBs), facilitating design and assembly.

Bit Size: 8

The 8-bit architecture is suitable for many embedded applications that require basic processing capabilities, ensuring ease of programming and reduced complexity.

Power Supplies (V): 3/5

This microcontroller supports both 3V and 5V power sources, offering versatility for different project requirements and enhancing compatibility.

No. of Terminals: 20

Having 20 terminals provides ample connections for input and output, enabling a range of peripherals and functionalities in compact designs.

Package Style (Meter): IN-LINE

The in-line package style simplifies mounting and soldering onto PCBs, making production processes easier and more efficient.

Minimum Supply Voltage: 3.3 V

A minimum supply voltage of 3.3 V allows for energy-efficient applications, making it a good choice for battery-operated devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for industrial and commercial environments where temperature variations may occur.

CPU Family: ST72

Part of the reputable ST72 CPU family, guaranteeing reliable performance and support for a wide range of applications.

Minimum Operating Temperature: -40 °C

The capability to function in environments as cold as -40 °C makes this microcontroller ideal for outdoor and harsh climate applications.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish enhances solderability and provides excellent corrosion resistance, ensuring long-lasting connections.

ADC Channels: YES

The inclusion of ADC channels enables this microcontroller to interface with analog sensors, expanding its application range in monitoring and control tasks.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options on PCBs, catering to various design layouts.

ROM Words: 8192

With 8192 ROM words, this microcontroller has sufficient memory to store necessary programs and data for complex tasks.

Maximum Seated Height: 5.33 mm

A compact seated height of 5.33 mm allows for space-saving designs in applications where size is a critical factor.

Width: 7.62 mm

A width of 7.62 mm contributes to compact PCB layouts, facilitating use in low-profile or miniaturized devices.

Data EEPROM Size: 256

The inclusion of 256 bytes of data EEPROM allows for non-volatile storage of important parameters or calibration data.

Peripherals: TIMER(5)

Five timers provide robust timing capabilities, essential for various applications such as motor control and time-based operations.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16 MHz offers sufficient performance for many embedded tasks without consuming excessive power.

Length: 26.16 mm

A length of 26.16 mm enables streamlined designs, especially in systems with limited space available for components.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in demanding environments, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing, memory, and I/O capabilities, reducing the need for multiple ICs in designs.

RAM Bytes: 384

384 bytes of RAM is adequate for many small applications, balancing performance and cost-effectiveness.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-operated devices and sensitive applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form aids in robust mechanical strength and thermal tolerance during soldering processes.

Analog To Digital Convertors: 7-Ch 10-Bit

Seven 10-bit ADC channels allow for precise analog signal conversion, making it perfect for interfacing with multiple sensors.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V aligns with industry standards, providing compatibility with a wide range of components and peripherals.

PWM Channels: YES

PWM capabilities allow for effective control of motors and lights, widely used in automation and embedded systems.

Connectivity: LIN, SCI, SPI

Support for multiple communication protocols (LIN, SCI, SPI) enhances the microcontroller's versatility for various interfaces and connectivity options.

ROM Programmability: FLASH

The presence of FLASH ROM programming enables reusability and updating of code post-deployment, offering flexibility in product development.

Terminal Pitch: 2.54 mm

A 2.54 mm terminal pitch is compatible with standard prototyping boards and enhances ease of integration into existing designs.

Speed: 16 rpm

A speed specification of 16 rpm may indicate rotary applications or servos, suggesting suitability for motor control scenarios.

On Chip Program ROM Width: 8

An 8-bit program ROM width streamlines data handling and processing, contributing to effective program execution.

No. of I/O Lines: 15

Fifteen I/O lines allow for significant interfacing capabilities with sensors, actuators, and other peripherals, promoting versatility.

Technical Specifications

Microcontrollers ST7FLITE39F2B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 2.7V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.16 mm

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.4

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

5.33 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

LIN, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLITE39F2B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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