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ST7FLITE30F2M6

STMicroelectronics

ST7FLITE30F2M6 by STMicroelectronics

ST7FLITE30F2M6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w 3.3V and 5.5V. It includes ADC and PWM channels, making it ideal for industrial applications. Its compact SO package ensures efficient space utilization in designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 18,960 parts In-Stock

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18,960

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Vyrian

USA . 3,791 parts In-Stock

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3,791

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Anansix

USA . 1,004 parts In-Stock

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1,004

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Digiode

USA . 182 parts In-Stock

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182

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

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20

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Distributors (Availability)

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Microchip USA

USA . 218 parts In-Stock

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$2.136

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218

$2.136

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AZTECH Wire

Italy . 916 parts In-Stock

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$20.720

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916

$20.720

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IDEA Electronic Components Group

UK . 2,137 parts In-Stock

1+ parts

$33.924

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$30.532

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2,137

$33.924

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$30.532

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MKK Technologies

India . 1,856 parts In-Stock

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$63.792

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1,856

$63.792

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DigiPath Technology Company

USA . 1,856 parts In-Stock

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$63.792

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1,856

$63.792

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QUARKTWIN TECHNOLOGY LTD

USA . 28,511 parts In-Stock

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28,511

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Metaverse IC Inc.

Canada . 18,960 parts In-Stock

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18,960

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Vigor

Singapore . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 1,602 parts In-Stock

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$40.561

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$40.561

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Corphita

USA . 1,189 parts In-Stock

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Perfect Parts

USA . 90 parts In-Stock

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90

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Overview

Unlock innovation with the ST7FLITE30F2M6 microcontroller from STMicroelectronics, a trusted leader in semiconductor solutions. Designed for versatility and reliability, this compact powerhouse thrives in diverse applications—from industrial automation to consumer electronics—delivering exceptional performance in harsh environments. Enjoy the benefits of low power consumption and robust processing capabilities, ensuring your projects run smoothly while keeping costs down. Elevate your designs with ST's superior quality and expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures that the microcontroller is well-protected from environmental factors, enhancing its reliability.

Surface Mount: YES

Surface mount compatibility allows for compact designs and high-density circuit layouts, making it suitable for modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options while ensuring stable performance.

Package Shape: RECTANGULAR

The rectangular package shape is standard, allowing for easy integration into various designs and PCB layouts.

Bit Size: 8

An 8-bit architecture is ideal for simpler processing tasks, making it suitable for applications with lower complexity.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, offering versatility in applications and ease of integration into existing systems.

No. of Terminals: 20

With 20 terminals, this microcontroller provides ample I/O options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-efficient designs, crucial for compact and portable devices.

Minimum Supply Voltage: 3.3 V

The ability to operate at a minimum supply voltage of 3.3 V helps in reducing power consumption, making it suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

High-temperature tolerance ensures reliability in demanding industrial applications.

CPU Family: ST72

The ST72 family architecture offers proven performance and is well-supported in the development community.

Minimum Operating Temperature: -40 °C

Able to function in extreme low temperatures, making this microcontroller ideal for harsh environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and prevents oxidation, ensuring reliable connections.

ADC Channels: YES

Onboard ADC channels enable analog signal processing, making it suitable for sensor applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexible connections and greater layout options on the PCB.

Maximum Seated Height: 2.65 mm

A low maximum seated height facilitates low-profile designs, contributing to compact device assembly.

Width: 7.5 mm

The 7.5 mm width strikes a balance between compactness and accessibility of I/O pins.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for adequate processing speed for numerous applications.

Length: 12.8 mm

The compact length contributes to space-saving designs, which is crucial for modern electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures durability and longevity in demanding applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it's designed for control-oriented applications, expanding its usability.

RAM Bytes: 384

With 384 bytes of RAM, it provides sufficient memory for various tasks, enhancing multitasking capabilities.

Technology: CMOS

CMOS technology allows for low power consumption, which is crucial for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering processes and improves reliability in connections.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V balances performance and power efficiency, ideal for various applications.

PWM Channels: YES

Integrated PWM channels are beneficial for controlling motors and other devices requiring precise control.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of the program, increasing flexibility in development.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is compatible with various PCBs and enhances assembly ease.

Speed: 16 rpm

At 16 rpm, it facilitates good operational speed for various tasks and control functions.

No. of I/O Lines: 15

With 15 I/O lines available, this microcontroller supports a wide range of peripherals and functionalities.

Technical Specifications

Microcontrollers ST7FLITE30F2M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 2.7V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

No. of I/O Lines:

15

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST7FLITE30F2M6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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