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ST7FLITE30F2B6

STMicroelectronics

ST7FLITE30F2B6 by STMicroelectronics

ST7FLITE30F2B6 microcontroller from STMicroelectronics operates at 3.3-5.5V with a max clock frequency of 16 MHz, featuring 15 I/O lines and ADC/PWM channels. Its industrial-grade design supports -40 °C to 85 °C temps, ideal for robust applications. With 384 bytes RAM and flash programmability, it's versatile for embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,785 parts In-Stock

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6,785

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Anansix

USA . 955 parts In-Stock

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955

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Digiode

USA . 611 parts In-Stock

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611

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Zilex Electronics Inc.

Canada . 180 parts In-Stock

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180

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Distributors (Availability)

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AZTECH Wire

Italy . 466 parts In-Stock

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$17.570

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466

$17.570

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IDEA Electronic Components Group

UK . 2,005 parts In-Stock

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$55.461

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$49.915

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$55.461

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$49.915

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Component Stockers USA

USA . 280 parts In-Stock

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$99.990

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280

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MKK Technologies

India . 850 parts In-Stock

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$104.291

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850

$104.291

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DigiPath Technology Company

USA . 850 parts In-Stock

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$104.291

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850

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QUARKTWIN TECHNOLOGY LTD

USA . 11,583 parts In-Stock

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Microchip USA

USA . 3,699 parts In-Stock

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3,699

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Vigor

Singapore . 2,204 parts In-Stock

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Corphita

USA . 364 parts In-Stock

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Parana Technologies

USA . 129 parts In-Stock

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$66.312

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Overview

Unlock your designs with the ST7FLITE30F2B6 microcontroller from STMicroelectronics—where quality meets innovation. Renowned for their reliability, STMicroelectronics delivers cutting-edge technology that empowers a wide range of applications, from industrial controls to consumer electronics. Benefit from exceptional processing power and energy efficiency that elevate your projects while ensuring durability across diverse environments. Elevate your solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides a good balance of durability and lightweight, making it ideal for various applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate in a broad range of power supply systems.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and allows for easier PCB layout.

Bit Size: 8

The 8-bit architecture is suitable for a variety of applications that require simple processing capabilities.

Power Supplies (V): 3/5

The versatility to operate at either 3V or 5V makes this microcontroller adaptable to different circuit designs.

No. of Terminals: 20

Having 20 terminals provides sufficient I/O options for various peripheral connections.

Package Style (Meter): IN-LINE

An in-line package style allows for easy integration into standard PCB designs.

Minimum Supply Voltage: 3.3 V

The capability to run at a minimum supply voltage of 3.3 V ensures compatibility with low-voltage applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this device is suitable for moderately harsh environments.

CPU Family: ST72

The ST72 CPU family is known for its reliability and performance in a range of embedded applications.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C makes this microcontroller excellent for industrial applications.

Terminal Finish: TIN

Tin terminal finish ensures good solderability, which can enhance assembly reliability.

ADC Channels: YES

The inclusion of ADC channels allows for the easy conversion of analog signals to digital, broadening application possibilities.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit layout and component placement.

Maximum Seated Height: 5.33 mm

The compact height makes it suitable for applications where space is a constraint.

Width: 7.62 mm

The small width ensures efficient use of PCB space, accommodating denser layouts.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for efficient processing speeds for most tasks.

Length: 26.16 mm

The overall length is suitable for various mounting options, providing design flexibility.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller is capable of handling demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates CPU, memory, and I/O, simplifying design and reducing component count.

RAM Bytes: 384

Having 384 bytes of RAM allows real-time processing for several embedded applications.

Technology: CMOS

CMOS technology provides low power consumption, making the device suitable for battery-operated applications.

Terminal Form: THROUGH-HOLE

Through-hole technology allows for robust soldering, enhancing the stability of connections.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V ensures compatibility with most digital logic levels.

PWM Channels: YES

The presence of PWM channels allows for effective control of motors and other devices requiring variable output.

ROM Programmability: FLASH

Flash programmability allows for easy updates and revisions of firmware, enhancing long-term product viability.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm facilitates easier integration with standard PCB designs.

Speed: 16 rpm

Operating speed of 16 rpm is suitable for tasks that demand moderate processing, such as simple data handling.

No. of I/O Lines: 15

Fifteen I/O lines provide significant interfacing capabilities with various sensors and devices.

Technical Specifications

Microcontrollers ST7FLITE30F2B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 2.7V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.16 mm

No. of I/O Lines:

15

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.4

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Programmability:

FLASH

Maximum Seated Height:

5.33 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

ST7FLITE30F2B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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