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ST7FLITE19F1M6

STMicroelectronics

ST7FLITE19F1M6 by STMicroelectronics

ST7FLITE19F1M6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 85 °C. It supports up to 15 I/O lines and includes ADC and PWM channels. Ideal for industrial applications, it operates on a supply voltage of 3.3V to 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,796 parts In-Stock

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Digiode

USA . 1,870 parts In-Stock

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Anansix

USA . 288 parts In-Stock

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288

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ComSIT Distribution GmbH

Germany . 117 parts In-Stock

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R&J Components

USA . 100 parts In-Stock

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100

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ACDS - Activité Composants Distribution Service

France . 80 parts In-Stock

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80

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Bristol Electronics

USA . 80 parts In-Stock

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80

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Dan-Mar Components

USA . 80 parts In-Stock

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80

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ABC Electronics Ltd.

UK . 16 parts In-Stock

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16

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Speed Components Ltd

Israel . 10 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 1,614 parts In-Stock

1+ parts

$5.210

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1,614

$5.210

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AZTECH Wire

Italy . 566 parts In-Stock

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$8.080

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566

$8.080

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Microchip USA

USA . 418 parts In-Stock

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$29.585

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418

$29.585

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IDEA Electronic Components Group

UK . 2,364 parts In-Stock

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$62.379

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$56.141

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2,364

$62.379

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$56.141

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MKK Technologies

India . 2,255 parts In-Stock

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$117.299

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$117.299

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DigiPath Technology Company

USA . 2,255 parts In-Stock

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$117.299

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Perfect Parts

USA . 17,121 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,993 parts In-Stock

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Kepictronics

USA . 2,154 parts In-Stock

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Parana Technologies

USA . 1,575 parts In-Stock

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$74.583

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1,575

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$74.583

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Authorized Procurement Solutions

USA . 480 parts In-Stock

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480

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Corphita

USA . 244 parts In-Stock

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244

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Cyclops Electronics Ltd (Excess)

UK . 31 parts In-Stock

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Glotronic Ltd.

UK . 25 parts In-Stock

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25

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Overview

Unlock the power of innovation with the ST7FLITE19F1M6 microcontroller from STMicroelectronics, a leader in cutting-edge technology. Renowned for its reliability and performance, this compact yet robust solution is ideal for diverse applications—from consumer electronics to industrial automation. With exceptional energy efficiency and a versatile design, it empowers engineers to create smarter, more efficient devices that elevate your projects to new heights. Experience quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides protection against environmental factors, enhancing the product's longevity.

Surface Mount: YES

Surface mount technology allows for easier and more efficient integration into modern electronic designs, saving board space.

Maximum Supply Voltage: 5.5 V

This higher maximum supply voltage accommodates various applications and ensures robust operation.

Package Shape: RECTANGULAR

The rectangular shape is industry-standard, facilitating compatibility and ease of placement on PCBs.

Bit Size: 8

An 8-bit architecture supports a wide range of applications, particularly in cost-sensitive embedded systems.

Power Supplies (V): 3/5

Flexible power supply options allow for versatile use in different applications with varying supply requirements.

No. of Terminals: 20

A sufficient number of terminals enables multiple I/O configurations, enhancing functionality for diverse applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact designs and reduces the overall footprint of the system.

Minimum Supply Voltage: 3.3 V

The ability to operate at a lower supply voltage supports energy efficiency and battery-powered applications.

Maximum Operating Temperature: 85 °C

Operating in high temperatures ensures reliability in industrial environments, making it suitable for demanding applications.

CPU Family: ST72

Being part of the ST72 family indicates a well-supported platform with established development tools and resources.

Minimum Operating Temperature: -40 °C

The wide temperature range makes this microcontroller suitable for extreme environments, enhancing reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish improves solder joint reliability and reduces oxidation, ensuring better performance.

ADC Channels: YES

Integrated ADC channels enable real-time analog signal processing, making it ideal for sensor applications.

Terminal Position: DUAL

Dual terminal positioning allows for efficient PCB layout and better routing options.

ROM Words: 4096

With 4096 ROM words, this microcontroller offers ample memory for complex applications, enabling more advanced functionality.

Maximum Seated Height: 2.65 mm

The low seated height aids in minimizing the overall profile of the assembly, suitable for compact devices.

Width: 7.5 mm

A narrow width enhances placement flexibility on PCBs, enabling dense circuit designs.

Maximum Clock Frequency: 16 MHz

The maximum clock frequency allows for fast processing speeds, enhancing performance in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard manufacturing reflow processes, promoting mass production capabilities.

Peak Reflow Temperature °C: 260

The ability to withstand high peak temperatures is crucial for reliable soldering during assembly.

Length: 12.8 mm

The length of the package allows for easy integration into various design layouts without extensive modifications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade assures reliability and performance in challenging environments, increasing the product's durability.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is designed specifically for control applications, offering tailored functions.

RAM Bytes: 256

With 256 bytes of RAM, it supports moderate data handling requirements for embedded applications.

Technology: CMOS

CMOS technology enhances power efficiency and reduces heat generation, making it ideal for low-power applications.

Terminal Form: GULL WING

Gull wing terminals improve soldering reliability and simplify the mounting process on PCBs.

Maximum Supply Current: 12 mA

A low maximum supply current helps in reducing power consumption, making it suitable for battery-operated devices.

Nominal Supply Voltage: 5 V

The standard nominal voltage makes it compatible with various available power sources, enhancing versatility.

PWM Channels: YES

Includes PWM channels for control of motors and other devices, adding flexibility for a wide range of applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and enhancements in firmware, improving the lifecycle of the product.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch supports high-density layouts while remaining accessible for soldering.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, guiding proper handling and storage to ensure reliability.

Speed: 8 rpm

While speed rating may appear low, it suits specific applications needing gradual motion, providing stability.

No. of I/O Lines: 15

Fifteen I/O lines offer ample connectivity options for integrating with sensors, displays, and other peripherals.

Technical Specifications

Microcontrollers ST7FLITE19F1M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.4 MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

15

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST7FLITE19F1M6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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