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ST7FLITE19F1B6

STMicroelectronics

ST7FLITE19F1B6 by STMicroelectronics

ST7FLITE19F1B6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w 3.3V and 5.5V. It includes 7 ADC channels and supports industrial applications with a temp range of -40 °C to 85 °C. Ideal for embedded systems, it offers robust performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,567 parts In-Stock

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Digiode

USA . 1,762 parts In-Stock

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1,762

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Anansix

USA . 789 parts In-Stock

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789

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ComSIT Distribution GmbH

Germany . 750 parts In-Stock

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750

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J2 Sourcing AB

Sweden . 223 parts In-Stock

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Microchip USA

USA . 229 parts In-Stock

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$5.352

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229

$5.352

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AZTECH Wire

Italy . 119 parts In-Stock

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$13.520

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119

$13.520

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IDEA Electronic Components Group

UK . 1,645 parts In-Stock

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$35.738

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$32.164

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$35.738

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$32.164

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MKK Technologies

India . 1,448 parts In-Stock

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$67.204

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$67.204

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DigiPath Technology Company

USA . 1,448 parts In-Stock

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$67.204

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$67.204

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Parana Technologies

USA . 2,054 parts In-Stock

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$42.731

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Corphita

USA . 1,318 parts In-Stock

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Vigor

Singapore . 1,134 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Overview

Unlock the potential of your next project with the ST7FLITE19F1B6 microcontroller from STMicroelectronics—a leader in innovation and quality. Designed for versatility, this 8-bit powerhouse excels in a range of applications from industrial automation to consumer electronics, delivering reliability even in extreme temperatures. With efficient power management and rich peripheral features, it ensures seamless integration and optimal performance, providing you with exceptional value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and resistance to environmental factors, making it suitable for a variety of applications.

Maximum Supply Voltage: 5.5 V

This allows for higher operational flexibility and compatibility with a wide range of power supplies.

Package Shape: RECTANGULAR

The rectangular shape is optimized for space-efficient layouts on circuit boards.

Bit Size: 8

An 8-bit architecture is suitable for many basic and cost-effective applications, simplifying design and programming.

Power Supplies (V): 3/5

Supports two common voltage levels, making it versatile for integration with different systems.

No. of Terminals: 20

With 20 terminals, this microcontroller allows for a decent number of input/output connections for various peripherals.

Package Style (Meter): IN-LINE

The in-line package style is easy to work with for through-hole mounting on PCBs.

Minimum Supply Voltage: 3.3 V

This low supply voltage capability enhances energy efficiency, ideal for battery-operated devices.

Maximum Operating Temperature: 85 °C

High-temperature tolerance ensures reliability in industrial and outdoor applications.

CPU Family: ST72

Being part of the ST72 family provides established performance and support in the microcontroller market.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme cold conditions makes it suitable for harsh environments.

Terminal Finish: MATTE TIN

Matte tin provides good solderability and can improve long-term reliability.

ADC Channels: YES

Having an analog-to-digital converter allows for easy interfacing with sensors, expanding functionality.

Terminal Position: DUAL

Dual terminal positioning can enhance layout flexibility and ease of assembly.

ROM Words: 4096

With 4096 words of ROM, there is ample space for embedded programs, making it capable for complex tasks.

Maximum Seated Height: 5.33 mm

A compact design ensures the microcontroller can fit into smaller enclosures.

Width: 7.62 mm

This width fits well into various circuit designs, offering flexibility in PCB layouts.

Data EEPROM Size: 128

128 bytes of EEPROM allows for storing configuration data and settings, enhancing application customizability.

Peripherals: TIMER(4)

Four timers provide robust timing solutions for various application requirements.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for efficient processing, making it suitable for real-time applications.

Length: 26.16 mm

The length of the component aids in fitting well with standard PCB dimensions and layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade components guarantee reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing capabilities and peripheral controls in one device.

RAM Bytes: 256

With 256 bytes of RAM, it can handle multiple tasks and moderate data processing effectively.

Technology: CMOS

Using CMOS technology results in lower power consumption, ideal for portable devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, which are beneficial for durability.

Analog To Digital Convertors: 7-Ch 10-Bit

Seven channels with 10-bit resolution allow for versatile and precise sensor interfacing.

Maximum Supply Current: 12 mA

Low maximum supply current aids in power efficiency, prolonging battery life in portable applications.

Nominal Supply Voltage: 5 V

The nominal voltage is ideal for typical electronic components, ensuring easy integration into existing designs.

PWM Channels: YES

PWM capabilities enhance control of motors and other variable-speed applications.

Connectivity: SPI

SPI connectivity allows for high-speed synchronous communication with other devices.

ROM Programmability: FLASH

Flash programmability means that the ROM can be easily updated, allowing for flexible and adaptive applications.

Terminal Pitch: 2.54 mm

A standard pitch that simplifies PCB design and interfacing with other components.

Speed: 16 rpm

This speed parameter is suitable for applications requiring moderate response times.

On Chip Program ROM Width: 8

8-bit ROM width provides compatibility with various software and applications, enhancing usability.

No. of I/O Lines: 15

Fifteen I/O lines allow for substantial interfacing possibilities with external devices, sensors, and actuators.

Technical Specifications

Microcontrollers ST7FLITE19F1B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.16 mm

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.4

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

5.33 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLITE19F1B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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