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ST7FLITE15F1B6

STMicroelectronics

ST7FLITE15F1B6 by STMicroelectronics

ST7FLITE15F1B6 microcontroller from STMicroelectronics operates at 3.3-5.5V with a max clock frequency of 16 MHz, featuring 20 terminals and 15 I/O lines. It supports industrial applications with an operating temp range of -40 °C to 85 °C. Key specs include 128 bytes EEPROM and 7 ADC channels for versatile connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,384 parts In-Stock

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8,384

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Digiode

USA . 873 parts In-Stock

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Anansix

USA . 698 parts In-Stock

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Zilex Electronics Inc.

Canada . 100 parts In-Stock

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100

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Distributors (Availability)

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Microchip USA

USA . 167 parts In-Stock

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$3.498

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167

$3.498

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AZTECH Wire

Italy . 1,198 parts In-Stock

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$14.520

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IDEA Electronic Components Group

UK . 69 parts In-Stock

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$52.336

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$47.102

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69

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$47.102

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MKK Technologies

India . 902 parts In-Stock

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$98.415

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902

$98.415

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DigiPath Technology Company

USA . 902 parts In-Stock

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$98.415

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902

$98.415

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A-Z Elektronik GmbH

Germany . 6,494 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Vigor

Singapore . 2,558 parts In-Stock

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Assy Fe

Spain . 2,500 parts In-Stock

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Parana Technologies

USA . 688 parts In-Stock

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$62.576

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Corphita

USA . 275 parts In-Stock

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Overview

Unlock the potential of your next project with the ST7FLITE15F1B6 microcontroller by STMicroelectronics, a trusted leader in innovative technology. Designed for reliability and efficiency, this 8-bit microcontroller excels in industrial applications, providing robust performance in challenging environments. With its flexible power supply options and integrated peripherals, it simplifies design while maximizing functionality, ensuring remarkable value and longevity for your devices. Choose STMicroelectronics for quality you can depend on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy body material ensures good protection and longevity for the microcontroller in various applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows the microcontroller to operate safely in a wide range of conditions, compatible with many power sources.

Package Shape: RECTANGULAR

The rectangular package shape simplifies PCB design and allows for efficient usage of board space.

Bit Size: 8

An 8-bit microcontroller is suitable for applications that do not require extensive computational resources, making it cost-effective.

Power Supplies (V): 3/5

Accepting both 3V and 5V power supplies increases versatility in various projects and systems.

No. of Terminals: 20

With 20 terminals, the microcontroller offers ample connections for I/O operations while remaining compact.

Package Style (Meter): IN-LINE

The in-line package style ensures easy integration into circuit boards, suitable for various types of layouts.

Minimum Supply Voltage: 3.3 V

Allowing a minimum supply voltage of 3.3 V enables usage in low-power applications, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in industrial environments.

CPU Family: ST72

Part of the ST72 series, known for its stability and effectiveness in various embedded systems.

Minimum Operating Temperature: -40 °C

This temperature tolerance makes the microcontroller suitable for harsh environments, ensuring reliability in extreme conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and prevents corrosion, enhancing durability and performance.

ADC Channels: YES

Having ADC channels allows the microcontroller to handle analog input, which is essential for many sensor applications.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in mounting and connection methods, enhancing usability.

ROM Words: 4096

With 4096 words of ROM, sufficient program storage is available for medium complexity applications.

Maximum Seated Height: 5.33 mm

A low seated height improves compatibility with various board designs while maintaining a compact form factor.

Width: 7.62 mm

A compact width simplifies the design process and allows for high-density PCB layouts.

Data EEPROM Size: 128

128 bytes of EEPROM provides non-volatile storage for critical configuration and calibration data.

Peripherals: TIMER(4)

Having 4 timers allows for versatile timing applications, enhancing the microcontroller's functionality.

Maximum Clock Frequency: 16 MHz

Running at a maximum clock frequency of 16 MHz enables efficient processing, balancing speed and power consumption.

Length: 26.16 mm

Optimal length allows for space-efficient designs without compromising functionality.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, making it resilient in various challenging operating conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates processing and control on a single chip, simplifying design.

RAM Bytes: 256

256 bytes of RAM is sufficient for small to medium data processing tasks, ensuring smooth operation.

Technology: CMOS

CMOS technology provides low power consumption, essential for battery-operated devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals enable robustness and ease of soldering, enhancing assembly reliability.

Analog To Digital Converters: 7-Ch 10-Bit

7-channel 10-bit ADC allows for multiple analog signals to be processed simultaneously, increasing flexibility in applications.

Maximum Supply Current: 12 mA

With a maximum supply current of 12 mA, it ensures lower power consumption, extending battery life in portable applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard, providing ease of integration with common electronic components.

PWM Channels: YES

Having PWM channels allows for control of motors and lights, which is valuable in numerous projects.

Connectivity: SPI

Support for SPI connectivity enables fast communication with peripherals, enhancing overall system performance.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming of the microcontroller via software updates, ensuring its adaptability.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is a standard size for prototyping and breadboarding, making it convenient for developers.

Speed: 16 rpm

Operating at a speed of 16 rpm suits various low-speed control applications, such as robotics and automation.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for simpler and efficient coding approaches, ideal for small applications.

No. of I/O Lines: 15

15 I/O lines provide ample connectivity options for interfacing with various devices and sensors in embedded systems.

Technical Specifications

Microcontrollers ST7FLITE15F1B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.16 mm

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.4

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

5.33 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLITE15F1B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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