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ST7FLITE10F1M6

STMicroelectronics

ST7FLITE10F1M6 by STMicroelectronics

ST7FLITE10F1M6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 85 °C. It supports ADC and PWM channels, making it ideal for industrial applications. Its compact SO package ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,808 parts In-Stock

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6,808

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Digiode

USA . 2,326 parts In-Stock

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2,326

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Infinite Electronics LLP

India . 1,477 parts In-Stock

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1,477

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Anansix

USA . 1,051 parts In-Stock

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1,051

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Distributors (Availability)

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Microchip USA

USA . 350 parts In-Stock

1+ parts

$8.807

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-

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350

$8.807

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AZTECH Wire

Italy . 299 parts In-Stock

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$14.710

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-

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299

$14.710

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IDEA Electronic Components Group

UK . 1,934 parts In-Stock

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$73.603

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-

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$66.242

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1,934

$73.603

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$66.242

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Component Stockers USA

USA . 525 parts In-Stock

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$99.990

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525

$99.990

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MKK Technologies

India . 347 parts In-Stock

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$138.405

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347

$138.405

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DigiPath Technology Company

USA . 347 parts In-Stock

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$138.405

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347

$138.405

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Kepictronics

USA . 25,000 parts In-Stock

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25,000

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GreenTree Electronics

Israel . 25,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,003 parts In-Stock

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Assy Fe

Spain . 4,735 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Vigor

Singapore . 2,189 parts In-Stock

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2,189

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Parana Technologies

USA . 498 parts In-Stock

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$88.003

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498

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Corphita

USA . 250 parts In-Stock

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250

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Overview

Elevate your projects with the ST7FLITE10F1M6 microcontroller from STMicroelectronics, a trusted leader in innovative solutions. Designed for versatility and efficiency, this 8-bit powerhouse excels in industrial applications, ensuring reliability in demanding environments. With its compact size and advanced features, it offers seamless integration and enhanced performance, giving you the edge to create smarter, more efficient designs that drive success. Experience quality and innovation like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures protection against environmental factors, enhancing the microcontroller's longevity.

Surface Mount: YES

Surface mount technology allows for a compact design, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V provides flexibility in power supply design, accommodating various system requirements.

Package Shape: RECTANGULAR

The rectangular shape is efficient for PCB layout, ensuring optimal space utilization and ease of integration.

Bit Size: 8

An 8-bit microcontroller is well-suited for simple control tasks and lower power applications.

Power Supplies (V): 3/5

Support for both 3 V and 5 V power supplies offers versatility in a range of electronic devices.

No. of Terminals: 20

With 20 terminals, this microcontroller can support multiple peripherals and I/O operations efficiently.

Package Style (Meter): SMALL OUTLINE

The small outline package facilitates a smaller PCB footprint, advantageous for compact electronic designs.

Minimum Supply Voltage: 3.3 V

A minimum supply voltage of 3.3 V enables compatibility with a wide range of modern electronic systems.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this microcontroller suitable for industrial and rugged environments.

CPU Family: ST72

The ST72 CPU family is known for its reliability and performance in low power applications.

Minimum Operating Temperature: -40 °C

Support for extreme low temperatures (-40 °C) makes this microcontroller suitable for automotive and outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish enhances solderability and reliability, ensuring stable connections.

ADC Channels: YES

Built-in ADC channels enable easy interfacing with analog sensors and signal processing tasks.

Terminal Position: DUAL

Dual terminal positions are beneficial for maximizing layout design and ensuring effective signal routing.

ROM Words: 4096

With 4096 ROM words, there's ample space for storing program code, suitable for various application needs.

Maximum Seated Height: 2.65 mm

A low profile height allows for slim device designs, enhancing portability and aesthetic appeal.

Width: 7.5 mm

The compact width allows integration into smaller devices without compromising performance.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides sufficient processing power for many control applications.

Length: 12.8 mm

This length contributes to the overall compactness of the microcontroller, making it suitable for space-sensitive applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in challenging conditions commonly found in industrial applications.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is optimized for handling diverse tasks in embedded systems.

RAM Bytes: 256

With 256 bytes of RAM, this microcontroller supports basic data processing needs effectively.

Technology: CMOS

CMOS technology ensures low power consumption, which is essential for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals offer excellent soldering characteristics, ensuring improved reliability and connection.

Maximum Supply Current: 12 mA

A maximum supply current of 12 mA helps maintain low power draw, making it energy efficient.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is commonly used, providing compatibility with many existing systems.

PWM Channels: YES

The inclusion of PWM channels allows for control of motors and lights, making it versatile for various applications.

ROM Programmability: FLASH

Flash programmability allows for easy code updates and revisions, enhancing development flexibility.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch is standard, facilitating easier soldering and component placement during assembly.

Speed: 8 rpm

A speed of 8 rpm indicates suitability for slow-moving mechanical controls and actuation tasks.

No. of I/O Lines: 15

Having 15 I/O lines promotes connectivity with multiple devices and sensors, broadening its application scope.

Technical Specifications

Microcontrollers ST7FLITE10F1M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.4 MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of I/O Lines:

15

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST7FLITE10F1M6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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