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ST7FLIT19BF1M6

STMicroelectronics

ST7FLIT19BF1M6 by STMicroelectronics

ST7FLIT19BF1M6 by STMicroelectronics is an 8-bit microcontroller with 256 bytes of RAM and 128 bytes of data EEPROM. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring up to 5.5V supply voltage. Features include 7-channel ADC, SPI connectivity, and on-chip flash ROM programmability.

Median Price

$1.573

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 600 parts In-Stock

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$1.573

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600

$1.573

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Vyrian

USA . 2,976 parts In-Stock

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Digiode

USA . 2,802 parts In-Stock

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2,802

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Anansix

USA . 2,519 parts In-Stock

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2,519

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Chip Stock

USA . 326 parts In-Stock

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326

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Bristol Electronics

USA . 25 parts In-Stock

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25

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EMSNET

USA . 23 parts In-Stock

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23

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ABC Electronics Ltd.

UK . 20 parts In-Stock

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20

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Distributors (Availability)

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.573

100+ parts

-

1k+ parts

$1.494

10k+ parts

$1.463

100

$1.573

-

$1.494

$1.463

Vigor

Singapore . 10,185 parts In-Stock

1+ parts

$3.780

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10,185

$3.780

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Ampacity Inc.

Singapore . 320 parts In-Stock

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$9.000

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320

$9.000

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AZTECH Wire

Italy . 218 parts In-Stock

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$15.660

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$15.660

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Microchip USA

USA . 263 parts In-Stock

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$47.817

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IDEA Electronic Components Group

UK . 2,017 parts In-Stock

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$79.057

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$71.151

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$79.057

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MKK Technologies

India . 753 parts In-Stock

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$148.661

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753

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DigiPath Technology Company

USA . 753 parts In-Stock

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$148.661

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753

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Perfect Parts

USA . 11,878 parts In-Stock

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Lixinc

USA . 11,629 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,559 parts In-Stock

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4,559

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Kepictronics

USA . 3,691 parts In-Stock

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Corphita

USA . 3,012 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,081 parts In-Stock

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$94.524

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1,081

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$94.524

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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iodParts Technologies Inc.

India . 89 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 70 parts In-Stock

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70

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Overview

Unleash the power of innovation with the ST7FLIT19BF1M6 microcontroller by STMicroelectronics. Crafted with precision and expertise, this device offers unparalleled quality and reliability for a wide range of applications. From smart home devices to industrial automation, this microcontroller delivers superior performance with its advanced features and cutting-edge technology. Experience seamless connectivity, efficient power management, and seamless integration with peripherals such as comparators and timers. Elevate your projects to new heights with the ST7FLIT19BF1M6 microcontroller and unlock endless possibilities for creativity and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, making it versatile for various projects.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and space-efficient design, perfect for applications with limited board space.

Bit Size: 8

With an 8-bit size, this microcontroller offers sufficient processing power for basic tasks without being overly complex, making it cost-effective for simple applications.

Power Supplies (V): 3/5

The availability of both 3V and 5V power supplies allows for compatibility with different voltage requirements, ensuring flexibility in design.

No. of Terminals: 20

The 20 terminals provide ample connection points for interfacing with other components, enabling versatility in circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes the footprint of the microcontroller, making it suitable for compact devices and applications.

Minimum Supply Voltage: 3.3 V

With a low minimum supply voltage, this microcontroller can operate efficiently even in low-power scenarios, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environments, making it suitable for industrial applications.

CPU Family: ST72

The ST72 CPU family brings a legacy of high-performance microcontrollers with proven reliability and industry-standard features.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this microcontroller to function in extreme cold conditions, expanding its range of potential applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The Ni/Pd/Au terminal finish offers excellent corrosion resistance and solderability, ensuring long-term reliability in various operating environments.

ADC Channels: YES

The inclusion of ADC channels enables analog-to-digital conversion, providing accurate measurement and control capabilities essential for many applications.

Terminal Position: DUAL

Dual terminal positions allow for versatile PCB orientation options, making it easier to integrate the microcontroller into different circuit layouts.

ROM Words: 4096

The 4096 ROM words provide ample storage capacity for program instructions and data, accommodating the needs of complex applications.

Maximum Seated Height: 2.65 mm

The low maximum seated height offers a slim profile, making this microcontroller suitable for applications with height constraints.

Width: 7.5 mm

The compact width dimension enables efficient use of PCB space, facilitating the design of compact and lightweight electronic devices.

Data EEPROM Size: 128

The 128 bytes of data EEPROM size allow for non-volatile data storage, retaining critical information even when the power is turned off.

Peripherals: COMPARATOR, TIMER(5)

The inclusion of a comparator and five timers enhances the functionality of this microcontroller, enabling advanced control and monitoring features.

Maximum Clock Frequency: 16 MHz

With a high maximum clock frequency, this microcontroller can execute instructions at high speed, ensuring efficient performance for time-critical tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper solder reflow during manufacturing, guaranteeing reliable connections on the PCB.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance enables robust solder joints, ensuring the microcontroller's reliability in high-temperature environments.

Length: 12.8 mm

The compact length dimension contributes to the overall small footprint of the microcontroller, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this microcontroller can withstand harsh conditions and operate reliably in demanding settings.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this product offers integrated peripherals and processing capabilities, simplifying system design and reducing component count.

RAM Bytes: 256

The 256 bytes of RAM provide temporary storage for data and variables, essential for efficient operation and multitasking in embedded applications.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity, enhancing energy efficiency and reliability.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and rework, simplifying the assembly process and ensuring reliable connections on the PCB.

Analog To Digital Convertors: 7-Ch 10-Bit

The seven 10-bit ADC channels enable precise conversion of analog signals to digital data, supporting accurate sensor interfacing and signal processing.

Maximum Supply Current: 9 mA

With a low maximum supply current, this microcontroller consumes minimal power, making it suitable for battery-powered applications and energy-efficient designs.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, simplifying integration into existing systems and designs.

PWM Channels: YES

The availability of PWM channels allows for precise control of pulse-width modulation signals, essential for motor control, LED dimming, and other applications.

Connectivity: SPI

The SPI connectivity feature enables communication with external devices and peripherals, expanding the microcontroller's capabilities for data exchange and control.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and flexible firmware updates, ensuring adaptability to evolving project requirements and bug fixes.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch provides ample spacing for soldering and routing traces on the PCB, simplifying assembly and ensuring reliable electrical connections.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this microcontroller exhibits moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly.

Speed: 8 rpm

The 8 rpm speed rating denotes the maximum clock speed of the microcontroller, indicating its processing capabilities for real-time and time-sensitive applications.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM provides sufficient storage capacity for firmware and program data, supporting the execution of complex algorithms.

No. of I/O Lines: 17

The 17 I/O lines allow for versatile connectivity with external devices and sensors, enabling robust interfacing and control capabilities in embedded systems.

Technical Specifications

Microcontrollers ST7FLIT19BF1M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

17

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

SPI

Peripherals:

COMPARATOR, TIMER(5)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLIT19BF1M6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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