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ST7FLIT19BF0M6

STMicroelectronics

ST7FLIT19BF0M6 by STMicroelectronics

ST7FLIT19BF0M6 microcontroller from STMicroelectronics features an 8-bit CPU with a max supply voltage of 5.5V and operates in temperatures from -40 °C to 85 °C. It includes 7 ADC channels and supports SPI connectivity, making it ideal for industrial applications. With a compact SO package and low power consumption, it's perfect for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,407 parts In-Stock

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5,407

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Digiode

USA . 4,594 parts In-Stock

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4,594

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Anansix

USA . 2,699 parts In-Stock

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2,699

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Distributors (Availability)

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AZTECH Wire

Italy . 731 parts In-Stock

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$10.260

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731

$10.260

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IDEA Electronic Components Group

UK . 1,891 parts In-Stock

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$48.368

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-

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$43.531

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1,891

$48.368

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$43.531

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MKK Technologies

India . 787 parts In-Stock

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$90.953

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787

$90.953

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DigiPath Technology Company

USA . 787 parts In-Stock

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$90.953

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787

$90.953

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QUARKTWIN TECHNOLOGY LTD

USA . 21,577 parts In-Stock

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21,577

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Corphita

USA . 4,865 parts In-Stock

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Microchip USA

USA . 3,934 parts In-Stock

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3,934

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Vigor

Singapore . 1,958 parts In-Stock

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1,958

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Parana Technologies

USA . 1,171 parts In-Stock

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$57.831

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1,171

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$57.831

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Overview

Unlock your project’s potential with the ST7FLIT19BF0M6 microcontroller from STMicroelectronics! Renowned for its exceptional quality and reliability, this robust 8-bit MCU offers unmatched performance across diverse applications, from industrial automation to consumer electronics. With versatile connectivity and efficient power management, it empowers developers to create innovative solutions that stand out in today's competitive market. Count on STMicroelectronics to deliver value-driven technology that accelerates your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for compact designs and simplifies automated assembly processes.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can integrate easily with a variety of power sources.

Package Shape: RECTANGULAR

The rectangular shape can facilitate efficient PCB layout and space optimization.

Bit Size: 8

An 8-bit architecture balances performance and power consumption, making it suitable for many low-power applications.

Power Supplies (V): 3/5

Support for multiple voltage levels increases versatility for diverse applications.

No. of Terminals: 20

Having 20 terminals enhances connectivity options for peripherals and I/O operations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, which is crucial for compact designs.

Minimum Supply Voltage: 3.3 V

Supports lower supply voltages, making it energy-efficient for battery-powered devices.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85 °C ensures reliable performance in moderately severe environments.

CPU Family: ST72

The ST72 family offers targeted performance and features, suitable for specific application needs.

Minimum Operating Temperature: -40 °C

The wide operating temperature range (-40 °C to 85 °C) makes it ideal for industrial and automotive applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances reliability and reduces the risk of corrosion.

ADC Channels: YES

The presence of ADC channels allows for direct interfacing with analog sensors, expanding application possibilities.

Terminal Position: DUAL

Dual terminal position improves layout flexibility and ease of handling during assembly.

ROM Words: 2048

2048 ROM words provide sufficient storage for program code, allowing for feature-rich applications.

Maximum Seated Height: 2.65 mm

A low maximum seated height facilitates compact designs, particularly in space-constrained layouts.

Width: 7.5 mm

A compact width supports space-saving applications in tightly packed circuit boards.

Data EEPROM Size: 128

128 bytes of EEPROM allows for non-volatile storage of configuration data or settings.

Peripherals: COMPARATOR, TIMER(5)

Integrated peripherals like comparators and timers enable enhanced functionality without additional components.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz supports efficient processing speed for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

Designed to withstand the soldering process, ensuring reliability in manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for safe and effective soldering processes.

Length: 12.8 mm

Compact length contributes to space-efficient PCB designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring durability and reliability in harsh environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing capability with peripherals, ideal for embedded systems.

RAM Bytes: 256

256 bytes of RAM provides adequate working memory for processing tasks in moderate complexity applications.

Technology: CMOS

CMOS technology delivers low power consumption and high integration levels, suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals ensure reliable connections and are compatible with standard PCB assembly techniques.

Analog To Digital Converters: 7-Ch 10-Bit

With 7 analog-to-digital converters, this microcontroller can handle multiple analog inputs simultaneously.

Maximum Supply Current: 9 mA

A low maximum supply current contributes to energy efficiency, making it suitable for portable applications.

Nominal Supply Voltage: 5 V

A standard nominal supply voltage of 5 V aligns with common voltage levels in microcontroller applications.

PWM Channels: YES

PWM channels facilitate control of motors and other peripherals, enhancing application flexibility.

Connectivity: SPI

SPI connectivity supports high-speed communication with external devices and peripherals, broadening application scope.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, increasing the longevity of the device.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm ensures compatibility with many PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, which is manageable during handling and storage.

Speed: 8 rpm

An 8 rpm speed rating supports various low-speed control applications.

On Chip Program ROM Width: 8

The 8-bit ROM width aligns with the microcontroller's architecture, ensuring efficient data handling.

No. of I/O Lines: 17

With 17 I/O lines, the microcontroller provides ample interfaces for peripherals and sensors.

Technical Specifications

Microcontrollers ST7FLIT19BF0M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

17

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

SPI

Peripherals:

COMPARATOR, TIMER(5)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLIT19BF0M6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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