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ST7FLIT15BF1M3

STMicroelectronics

ST7FLIT15BF1M3 by STMicroelectronics

ST7FLIT15BF1M3 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 125 °C. It supports up to 7 ADC channels and offers connectivity via SPI. Ideal for automotive applications, it operates on supply voltages of 3.3V to 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,386 parts In-Stock

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3,386

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Digiode

USA . 2,651 parts In-Stock

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2,651

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Anansix

USA . 2,365 parts In-Stock

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2,365

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,820 parts In-Stock

1+ parts

$2.540

100+ parts

-

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-

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1,820

$2.540

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AZTECH Wire

Italy . 1,089 parts In-Stock

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$17.120

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1,089

$17.120

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Microchip USA

USA . 3,090 parts In-Stock

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$17.551

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3,090

$17.551

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IDEA Electronic Components Group

UK . 742 parts In-Stock

1+ parts

$48.585

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$43.727

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742

$48.585

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$43.727

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MKK Technologies

India . 120 parts In-Stock

1+ parts

$91.361

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120

$91.361

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DigiPath Technology Company

USA . 120 parts In-Stock

1+ parts

$91.361

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120

$91.361

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Corphita

USA . 4,324 parts In-Stock

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4,324

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Parana Technologies

USA . 1,280 parts In-Stock

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$58.091

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1,280

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$58.091

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Overview

Elevate your projects with the ST7FLIT15BF1M3 microcontroller from STMicroelectronics—where reliability meets innovation. Designed for automotive applications, this 8-bit powerhouse ensures superior performance in demanding environments. With low power consumption and robust features like ADC channels and PWM, it seamlessly integrates into various designs, delivering unmatched value and efficiency. Trust in STMicroelectronics' legacy of quality to drive your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the microcontroller lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs, saving space on PCBs.

Maximum Supply Voltage: 5.5 V

A high maximum supply voltage allows flexibility in power supply design, accommodating diverse circuitry.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient placement and assembly on circuit boards.

Bit Size: 8

An 8-bit architecture is ideal for simple control tasks, making it effective for cost-sensitive applications.

Power Supplies (V): 3/5

Operation at both 3V and 5V makes it versatile for various applications and power conditions.

No. of Terminals: 20

With 20 terminals, it offers a good balance of I/O options while still maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to space efficiency in design, beneficial for modern electronics.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage enhances power efficiency and allows for battery-powered applications.

Maximum Operating Temperature: 125 °C

A high operating temperature tolerance makes it suitable for use in harsh environments, like automotive applications.

CPU Family: ST72

Part of the ST72 family, a well-known range providing reliability and support in embedded systems.

Minimum Operating Temperature: -40 °C

Designed to operate at low temperatures, ideal for applications in cold environments.

Terminal Finish: TIN

Tin finishing enhances solderability and longevity of connections, ensuring reliable performance.

ADC Channels: YES

Integrated ADC channels allow for direct sensor interfacing, making it ideal for data acquisition applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB design, aiding in layout optimization.

ROM Words: 4096

Offer a sufficient ROM capacity for moderate applications, allowing for complex programming logic.

Maximum Seated Height: 2.65 mm

Low profile design reduces overall device height, beneficial for compact electronic applications.

Width: 7.5 mm

A compact width ensures it can fit into space-constrained designs, enhancing design flexibility.

Peripherals: COMPARATOR, TIMER(5)

On-chip peripherals reduce the need for additional components, simplifying the design and saving costs.

Maximum Clock Frequency: 16 MHz

16 MHz clock frequency allows for efficient processing capabilities suited for many applications.

Length: 12.8 mm

The length contributes to a compact footprint, making it suitable for small-scale electronics.

Temperature Grade: AUTOMOTIVE

Automotive-grade specifications ensure reliability and safety in automotive applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing with peripheral features, making it ideal for embedded designs.

RAM Bytes: 256

Adequate RAM allows for efficient data handling in various applications, accommodating moderate tasks.

Technology: CMOS

CMOS technology enhances power efficiency and allows for high-density integrations.

Terminal Form: GULL WING

Gull wing terminals ensure ease of soldering and robust mechanical connections, enhancing durability.

Analog To Digital Converters: 7-Ch 10-Bit

Having multiple ADC channels allows simultaneous measurement of multiple signals, enhancing data acquisition capabilities.

Maximum Supply Current: 9 mA

A low maximum supply current is beneficial for battery-operated and energy-sensitive applications.

Nominal Supply Voltage: 5 V

A nominal voltage of 5V is commonly used, ensuring compatibility with numerous power supplies and designs.

PWM Channels: YES

PWM channels enable precise control of motors and lights, making it applicable in various control applications.

Connectivity: SPI

SPI connectivity facilitates fast and reliable communication with other devices, enhancing system performance.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications without replacing components, enhancing flexibility.

Terminal Pitch: 1.27 mm

A standard terminal pitch ensures compatibility with most PCB designs, simplifying manufacturing.

Speed: 8 rpm

The ability to manage speed effectively is crucial in control applications, providing versatility in functionality.

On Chip Program ROM Width: 8

8-bit program ROM width is sufficient for a range of simple applications, enhancing cost-effectiveness.

No. of I/O Lines: 17

With 17 I/O lines, it allows for significant interfacing options with various sensors and actuators.

Technical Specifications

Microcontrollers ST7FLIT15BF1M3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

No. of I/O Lines:

17

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

COMPARATOR, TIMER(5)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLIT15BF1M3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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