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ST7FLIT10BY0M6

STMicroelectronics

ST7FLIT10BY0M6 by STMicroelectronics

ST7FLIT10BY0M6 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 3.3V and 5.5V, and includes 5 ADC channels. With a compact SO package and industrial temperature range (-40 °C to 85 °C), it's ideal for embedded applications. Its flash ROM supports versatile programming needs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,967 parts In-Stock

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Digiode

USA . 2,528 parts In-Stock

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2,528

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Anansix

USA . 323 parts In-Stock

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323

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EMSNET

USA . 57 parts In-Stock

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57

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Distributors (Availability)

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Microchip USA

USA . 327 parts In-Stock

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$2.895

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327

$2.895

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AZTECH Wire

Italy . 712 parts In-Stock

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$9.390

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712

$9.390

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IDEA Electronic Components Group

UK . 1,411 parts In-Stock

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$63.463

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$57.117

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$63.463

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$57.117

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Component Stockers USA

USA . 656 parts In-Stock

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$99.990

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656

$99.990

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MKK Technologies

India . 1,698 parts In-Stock

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$119.339

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$119.339

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DigiPath Technology Company

USA . 1,698 parts In-Stock

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$119.339

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$119.339

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Vigor

Singapore . 5,780 parts In-Stock

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5,780

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Corphita

USA . 3,181 parts In-Stock

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Parana Technologies

USA . 1,067 parts In-Stock

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$75.880

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$75.880

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock exceptional performance with the ST7FLIT10BY0M6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability across diverse applications, this compact powerhouse thrives in industrial environments, delivering precision from -40 °C to 85 °C. Experience enhanced efficiency and seamless connectivity with its built-in peripherals, ensuring your projects are future-ready while benefiting from unmatched quality and support from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight construction, ensuring reliable performance in various environments.

Surface Mount: YES

Allows for compact designs and facilitates automated assembly processes, enhancing manufacturing efficiency.

Maximum Supply Voltage: 5.5 V

Provides flexibility in powering the device within standard voltage ranges, suitable for diverse applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and efficient use of space.

Bit Size: 8

Standard bit size suitable for many applications, balancing performance and complexity.

Power Supplies (V): 3/5

Versatile power supply options increase compatibility with various systems.

No. of Terminals: 16

Provides ample I/O options for interfacing with other components, facilitating more complex designs.

Package Style (Meter): SMALL OUTLINE

Compact design optimizes board space and enables integration into portable applications.

Minimum Supply Voltage: 3.3 V

Ensures operation in low-power applications, making it energy efficient.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, offering reliability in tougher thermal environments.

CPU Family: ST72

Part of the well-regarded ST family, ensuring familiarity and support within the engineering community.

Minimum Operating Temperature: -40 °C

Wide temperature operation range makes this microcontroller ideal for extreme environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality finish enhances solderability and prevents corrosion, ensuring long-term reliability.

ADC Channels: YES

Integrated ADC allows for seamless analog signal processing, enhancing the device's functionality.

Terminal Position: DUAL

Facilitates easy layout design, allowing for efficient PCB routing and space management.

ROM Words: 2048

Sufficient memory capacity enables complex programs and functionalities to be stored directly on-chip.

Maximum Seated Height: 2.65 mm

Low profile design is perfect for space-constrained applications and keeps the device discreet.

Width: 7.5 mm

Compact width allows for dense circuit layout and efficient use of PCB area.

Peripherals: TIMER(5)

Multiple timers enhance the microcontroller's ability to manage tasks and event scheduling concurrently.

Maximum Clock Frequency: 16 MHz

Provides adequate processing speed for a wide range of applications while maintaining low power consumption.

Maximum Time At Peak Reflow Temperature: 30s

Robust design withstands assembly processes like soldering, ensuring durability and performance.

Peak Reflow Temperature: 260 °C

Can tolerate high temperatures during manufacturing, ensuring the integrity of the device.

Length: 10.3 mm

Compact length allows for a smaller footprint on the PCB, making it suitable for portable applications.

Temperature Grade: INDUSTRIAL

Designed to meet industry standards, ensuring reliability and performance in critical applications.

Peripheral IC Type: MICROCONTROLLER

General-purpose microcontroller ideal for embedded applications across various industries.

RAM Bytes: 256

Adequate RAM for handling basic data manipulation tasks in various control applications.

Technology: CMOS

Offers lower power consumption and improved performance, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide optimal electrical connections and stability during soldering.

Analog To Digital Converters: 5-Ch 10-Bit

Multiple ADC channels with 10-bit resolution enable accurate analog data acquisition, critical for sensing applications.

Maximum Supply Current: 9 mA

Low supply current at maximum operation enhances battery life in portable applications.

Nominal Supply Voltage: 5 V

Standard voltage level simplifies power supply design and integration into existing systems.

PWM Channels: YES

Pulse Width Modulation capabilities allow for precise control of analog devices such as motors and LED brightness.

Connectivity: SPI

Serial Peripheral Interface enables fast and efficient communication with other devices, suitable for real-time applications.

ROM Programmability: FLASH

Flash memory allows for easy programming and reprogramming, providing flexibility during development.

Terminal Pitch: 1.27 mm

Standard terminal pitch supports compatibility with a variety of PCB layouts and design configurations.

Moisture Sensitivity Level (MSL): 3

Offers moderate moisture sensitivity, ensuring that handling and storage conditions are manageable during manufacturing.

Speed: 8 rpm

Functionality suitable for low-speed applications, helping to lower system complexity.

On Chip Program ROM Width: 8

Compatible with 8-bit data paths, streamlining communication and data handling processes.

No. of I/O Lines: 17

Generous number of I/O lines allows for various peripheral connections, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers ST7FLIT10BY0M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

17

No. of Terminals:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

ST7FLIT10BY0M6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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