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ST7FLIT10BF1M6

STMicroelectronics

ST7FLIT10BF1M6 by STMicroelectronics

ST7FLIT10BF1M6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operates b/w 3.3V and 5.5V, and includes 7 ADC channels. Ideal for industrial applications, it supports SPI connectivity and has a compact SO package. With a temp range of -40 °C to 85 °C, it's designed for robust performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,424 parts In-Stock

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Digiode

USA . 4,658 parts In-Stock

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4,658

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Anansix

USA . 1,389 parts In-Stock

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1,389

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ComSIT Distribution GmbH

Germany . 560 parts In-Stock

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560

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 354 parts In-Stock

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$6.809

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354

$6.809

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AZTECH Wire

Italy . 187 parts In-Stock

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$19.390

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187

$19.390

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IDEA Electronic Components Group

UK . 528 parts In-Stock

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$60.704

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$54.634

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528

$60.704

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$54.634

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Component Stockers USA

USA . 538 parts In-Stock

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$99.990

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538

$99.990

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MKK Technologies

India . 2,044 parts In-Stock

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$114.151

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2,044

$114.151

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DigiPath Technology Company

USA . 2,044 parts In-Stock

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$114.151

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$114.151

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Infinite Electronics LLP (Excess)

. 25,000 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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A-Z Elektronik GmbH

Germany . 5,192 parts In-Stock

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Corphita

USA . 4,611 parts In-Stock

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Vigor

Singapore . 2,000 parts In-Stock

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Perfect Parts

USA . 1,075 parts In-Stock

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1,075

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Parana Technologies

USA . 453 parts In-Stock

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$72.581

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453

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$72.581

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Overview

Unlock innovation with the ST7FLIT10BF1M6 microcontroller from STMicroelectronics! Renowned for their commitment to quality, STMicroelectronics delivers a versatile solution that effortlessly powers your projects in industrial automation, smart appliances, and sensor applications. With a compact design, low power consumption, and robust performance, this microcontroller ensures reliability and efficiency. Embrace the future of technology while enjoying seamless integration and superior support—your projects deserve the best!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures a lightweight design and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for easier integration into compact designs, reducing PCB space requirements.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V offers flexibility in powering the microcontroller within standard voltage ranges.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient board layout and integration into various applications.

Bit Size: 8

An 8-bit architecture is suitable for many embedded applications, striking a balance between power consumption and processing capability.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies enhances compatibility with a wide range of systems.

No. of Terminals: 20

With 20 terminals, it provides ample I/O options for various peripherals and interfaces.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, facilitating compact designs.

Minimum Supply Voltage: 3.3 V

A minimum supply voltage of 3.3 V supports lower power operations, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

With an operating temperature up to 85 °C, it is suitable for industrial applications subject to varying environmental conditions.

CPU Family: ST72

The ST72 family is known for its reliability and performance in embedded applications, making it a trusted choice.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C expands its usability in harsh conditions, ensuring reliability in diverse environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures long-term reliability and enhanced conductivity for better electrical performance.

ADC Channels: YES

The presence of ADC channels allows for direct sensor interfacing, enhancing application versatility.

Terminal Position: DUAL

Dual terminal positioning facilitates efficient PCB routing, making it easier to connect to other components.

ROM Words: 4096

With 4096 ROM words, it offers sufficient memory for storing firmware, enabling complex functionality.

Maximum Seated Height: 2.65 mm

A low seated height contributes to a slim profile, making it suitable for space-constrained designs.

Width: 7.5 mm

A width of 7.5 mm allows for flexible placement on boards, enhancing design adaptability.

Peripherals: TIMER(5)

Five integrated timers enable precise control in time-based applications, enhancing functionality.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides a good balance of speed and power consumption, suitable for many applications.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds ensures compatibility with modern soldering techniques without damaging the chip.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C is reliable for soldering processes, ensuring product durability.

Length: 12.8 mm

The length of 12.8 mm aids in compact PCB design, facilitating smaller product footprints.

Temperature Grade: INDUSTRIAL

An industrial temperature grade guarantees reliability and performance in challenging environments.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is optimized for embedded applications, offering specific features tailored for control tasks.

RAM Bytes: 256

256 bytes of RAM supports essential data processing and improves performance in low-memory applications.

Technology: CMOS

CMOS technology allows for low power consumption while maintaining high speed, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enhance ease of soldering and provide robust mechanical stability when mounted.

Analog To Digital Converters: 7-Ch 10-Bit

Seven 10-bit ADCs allow for detailed analog signal processing, enhancing the microcontroller's versatility.

Maximum Supply Current: 9 mA

A maximum supply current of 9 mA ensures efficient power usage, making it suitable for battery-powered applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is common and enhances interoperability with relevant components.

PWM Channels: YES

The inclusion of PWM channels facilitates motor control and other applications requiring variable power output.

Connectivity: SPI

SPI connectivity allows for high-speed data transfer with external devices, enhancing overall system performance.

ROM Programmability: FLASH

Flash programmability enables easy updates to firmware, providing flexibility and convenience for developers.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm facilitates easier soldering and component spacing on printed circuit boards.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, suitable for appropriate handling and storage practices.

Speed: 8 rpm

A maximum speed of 8 rpm is sufficient for many control applications, providing reliable performance.

On Chip Program ROM Width: 8

An 8-bit program ROM width is common in simple to moderate embedded applications, ensuring compatibility.

No. of I/O Lines: 17

Seventeen I/O lines provide ample connectivity for peripherals, sensors, and interfacing with other devices.

Technical Specifications

Microcontrollers ST7FLIT10BF1M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

17

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLIT10BF1M6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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