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ST7FLI49MK1T6

STMicroelectronics

ST7FLI49MK1T6 by STMicroelectronics

ST7FLI49MK1T6 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 3.3-5.5 V, and includes 10 ADC channels. With a compact flatpack design and automotive-grade temperature range (-40 °C to 125 °C), it's ideal for embedded applications. Its robust I2C connectivity enhances versatility in various projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,668 parts In-Stock

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4,668

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Anansix

USA . 1,963 parts In-Stock

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1,963

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Digiode

USA . 967 parts In-Stock

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967

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Microchip USA

USA . 251 parts In-Stock

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$6.252

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251

$6.252

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AZTECH Wire

Italy . 105 parts In-Stock

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$16.010

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105

$16.010

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IDEA Electronic Components Group

UK . 256 parts In-Stock

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$18.786

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$16.908

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256

$18.786

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$16.908

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MKK Technologies

India . 1,603 parts In-Stock

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$35.327

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1,603

$35.327

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DigiPath Technology Company

USA . 1,603 parts In-Stock

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$35.327

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1,603

$35.327

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Component Stockers USA

USA . 430 parts In-Stock

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$99.990

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430

$99.990

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RC Electronics

USA . 12,600 parts In-Stock

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12,600

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A-Z Elektronik GmbH

Germany . 7,254 parts In-Stock

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Vigor

Singapore . 1,440 parts In-Stock

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1,440

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Parana Technologies

USA . 674 parts In-Stock

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$22.462

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Corphita

USA . 239 parts In-Stock

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Overview

Unlock the potential of your next project with the ST7FLI49MK1T6 microcontroller from STMicroelectronics. Renowned for its reliability and innovative design, ST delivers a powerhouse that excels in automotive applications and beyond. With robust performance, flexible power supply options, and extensive peripherals, this microcontroller streamlines development while ensuring durability in challenging environments. Experience unmatched quality and efficiency that empowers your creations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction ensures long-lasting performance in various environments.

Surface Mount: YES

The surface mount capability allows for compact designs and easier integration into modern electronic circuits.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile for various applications.

Package Shape: SQUARE

Square shape facilitates efficient PCB layout and space-saving designs.

Bit Size: 8

8-bit architecture balances computational power and simplicity, suitable for many basic control tasks.

Power Supplies (V): 3.3/5

Flexible power supply options allow integration with various systems and components.

No. of Terminals: 32

A generous number of terminals provides extensive connectivity options for peripherals and I/O operations.

Package Style (Meter): FLATPACK

Flatpack style contributes to a lower profile and less height on PCBs, improving compatibility.

Minimum Supply Voltage: 3.3 V

Lower power requirements help in energy-efficient designs and are ideal for battery-operated devices.

Maximum Operating Temperature: 125 °C

High operating temperature range supports use in demanding automotive and industrial applications.

CPU Family: ST72

Part of a well-known family offering reliability and support for various automotive and embedded applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold, making it suitable for outdoor and rugged environments.

Terminal Finish: TIN

Tin finish provides excellent solderability and reliability in connections.

ADC Channels: YES

Integrated Analog-to-Digital converter channels enhance the ability to handle real-world signals.

Terminal Position: QUAD

Quad terminal position allows for efficient routing and placement on circuit boards.

ROM Words: 4096

Sufficient ROM capacity to store firmware and application code for various applications.

Maximum Seated Height: 1.6 mm

Low seated height to save space on the PCB while allowing high-density designs.

Width: 7 mm

Compact width makes it suitable for space-constrained designs.

Data EEPROM Size: 128

Provides non-volatile storage for configuration and parameters, ensuring data retention even after power loss.

Peripherals: TIMER(5)

Multiple integrated timers enhance functionality for tasks like event scheduling and PWM generation.

Maximum Clock Frequency: 16 MHz

Sufficient processing speed for many control applications, striking a balance between performance and power consumption.

Maximum Time At Peak Reflow Temperature: 30 seconds

Designed to withstand standard surface mount reflow processes, ensuring reliable assembly.

Peak Reflow Temperature: 235 °C

High tolerance to reflow temperatures ensures compatibility with modern PCB assembly techniques.

Length: 7 mm

Compact length aids in fitting into portable and miniaturized electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade components are built to meet strict reliability requirements, ensuring safety and durability in vehicles.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for control applications, providing a rich set of integrated features.

RAM Bytes: 384

Adequate RAM for handling multiple processes and temporary data storage.

Technology: CMOS

CMOS technology allows for lower power consumption while maintaining performance.

Terminal Form: GULL WING

Gull wing terminal design enhances solder reliability and ensures better mechanical stability.

Analog To Digital Convertors: 10-Ch 10-Bit

10-channel, 10-bit ADCs provide robust features for signal sampling and conversion, useful in sensor applications.

PWM Channels: YES

Integrated PWM capability is beneficial for motor control and dimming applications.

Connectivity: I2C

Supports I2C connectivity, allowing for easy interfacing with other devices and sensors.

ROM Programmability: FLASH

Flash memory allows for easy updates and reprogramming, extending the product's lifespan and utility.

Terminal Pitch: 0.8 mm

Fine terminal pitch helps in high-density designs and better use of PCB space.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity rating allows for standard handling without stringent precautions.

Speed: 16 rpm

Adequate processing speed for responsive control applications.

On Chip Program ROM Width: 8

8-bit ROM width simplifies programming and integration for 8-bit applications.

No. of I/O Lines: 24

Provides ample I/O lines for interfacing with various sensors and actuators.

Technical Specifications

Microcontrollers ST7FLI49MK1T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

I2C

Peripherals:

TIMER(5)

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

ST7FLI49MK1T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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