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ST232EBWR

STMicroelectronics

ST232EBWR by STMicroelectronics

ST232EBWR by STMicroelectronics is a dual line transceiver with a max supply voltage of 5.5V and operates in industrial temperatures from -40 °C to 85°C. It features a max transmit delay of 2000 ns and supports EIA-232-E standards, ideal for reliable data communication. Its compact SO package ensures efficient surface mounting in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,103 parts In-Stock

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6,103

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Digiode

USA . 2,600 parts In-Stock

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2,600

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Anansix

USA . 2,021 parts In-Stock

1+ parts

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2,021

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Bristol Electronics

USA . 343 parts In-Stock

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343

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Dan-Mar Components

USA . 343 parts In-Stock

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343

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,407 parts In-Stock

1+ parts

$9.909

100+ parts

-

1k+ parts

$8.918

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-

1,407

$9.909

-

$8.918

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AZTECH Wire

Italy . 896 parts In-Stock

1+ parts

$10.950

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896

$10.950

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MKK Technologies

India . 1,746 parts In-Stock

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$18.634

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1,746

$18.634

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DigiPath Technology Company

USA . 1,746 parts In-Stock

1+ parts

$18.634

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1,746

$18.634

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Component Stockers USA

USA . 396 parts In-Stock

1+ parts

$99.990

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396

$99.990

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A-Z Elektronik GmbH

Germany . 6,939 parts In-Stock

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6,939

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Microchip USA

USA . 5,533 parts In-Stock

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Corphita

USA . 4,907 parts In-Stock

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Kepictronics

USA . 1,970 parts In-Stock

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Vigor

Singapore . 1,093 parts In-Stock

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1,093

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Parana Technologies

USA . 267 parts In-Stock

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$11.848

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267

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$11.848

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Overview

Elevate your designs with the ST232EBWR from STMicroelectronics, a pinnacle of reliability in line drivers and receivers. Crafted for superior performance, this compact, surface-mount solution excels in diverse applications, ensuring seamless communication even in challenging environments. Trust in ST’s industry-leading expertise to provide robust quality and unmatched efficiency, giving you the power to innovate while reducing time-to-market and enhancing product longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology provides a compact design, allowing for higher density circuit board layouts.

Maximum Supply Voltage: 5.5 V

This voltage rating allows for compatibility with a wide range of power supply systems.

No. of Functions: 2

Having two functions allows for versatile applications and efficient use of PCB space.

Package Shape: RECTANGULAR

A rectangular shape provides easy placement during assembly and integration into various designs.

Maximum Transmit Delay: 2000 ns

The low transmit delay ensures efficient and timely data communication, crucial for high-speed applications.

Power Supplies (V): 5

Supports standard 5V power supply, facilitating easy integration with existing systems.

No. of Terminals: 16

With 16 terminals, this device offers multiple connectivity options, enhancing its functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for space-saving on PCBs, making it a great choice for compact designs.

Minimum Supply Voltage: 4.5 V

The operational range between 4.5V and 5.5V adds flexibility for various power supply configurations.

Maximum Operating Temperature: 85 °C

With an operating range up to 85 °C, this product is suitable for industrial environments.

Minimum Operating Temperature: -40 °C

This temperature rating ensures reliable performance in extreme conditions, making it ideal for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances reliability and prevents oxidation, ensuring long-term usability.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout design, facilitating easier integration into systems.

Maximum Seated Height: 2.65 mm

The low seated height is ideal for thin designs and compact systems.

Width: 7.5 mm

Slim profile allows for easy placement in space-constrained environments.

Maximum Output Low Current: 3.2 Amp

The ability to handle high output current makes this device suitable for driving various loads effectively.

Receiver No. of Bits: 2

Having 2 bits for data reception allows it to support low-complexity communication systems efficiently.

Length: 10.3 mm

Compact length makes it suitable for high-density applications where space is critical.

Minimum Out Swing: 10 V

The minimum output swing of 10V supports robust signal integrity over long distances.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliability and performance under demanding conditions.

Maximum Receive Delay: 10000 ns

Long receive delay supports receiving data over extended distances without loss of quality.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and better mechanical stability in mounting.

Interface Standard: EIA-232-E; TIA-232-E; V.28

Conformance to standard interface protocols ensures compatibility with a wide range of communication systems.

Maximum Supply Current: 10 mA

Efficient power consumption with a maximum supply current of only 10 mA helps in energy savings.

Input Characteristics: SCHMITT TRIGGER

The integrated Schmitt trigger input provides improved noise immunity and faster switching.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage simplifies integration with typical power supply systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for compact PCB layout and easy routing of connections.

Driver No. of Bits: 2

Two bits for data transmission provides an efficient solution for simple communications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, guiding proper handling and storage practices.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is optimized for both sending and receiving signals, essential for robust communications.

Technical Specifications

Line Drivers & Receivers ST232EBWR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-E; TIA-232-E; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

3.2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

10000 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

2000 ns

Width:

7.5 mm

Trade Compliance

ST232EBWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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