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ST232BT

STMicroelectronics

ST232BT by STMicroelectronics

ST232BT by STMicroelectronics is a Line Driver & Receiver with 2 functions, operating at 5V. It has a small outline package style, Schmitt trigger input characteristics, and supports EIA-232, TIA-232, V.28 interfaces. Ideal for industrial applications requiring reliable communication over short distances.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,236 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,236

-

-

-

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Vyrian

USA . 4,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,132

-

-

-

-

Anansix

USA . 506 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

506

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,857 parts In-Stock

1+ parts

$11.943

100+ parts

-

1k+ parts

$10.749

10k+ parts

-

1,857

$11.943

-

$10.749

-

MKK Technologies

India . 330 parts In-Stock

1+ parts

$22.459

100+ parts

-

1k+ parts

-

10k+ parts

-

330

$22.459

-

-

-

DigiPath Technology Company

USA . 330 parts In-Stock

1+ parts

$22.459

100+ parts

-

1k+ parts

-

10k+ parts

-

330

$22.459

-

-

-

Corphita

USA . 2,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,038

-

-

-

-

Parana Technologies

USA . 712 parts In-Stock

1+ parts

-

100+ parts

$14.280

1k+ parts

-

10k+ parts

-

712

-

$14.280

-

-

Overview

Elevate your electronic designs with the ST232BT by STMicroelectronics. Crafted with precision and expertise, this line driver and receiver offers unparalleled quality and reliability. Ideal for a wide range of applications, this product delivers exceptional value and benefits to our customers. Experience seamless communication and efficiency with the ST232BT, designed to meet your unique needs and exceed your expectations. Choose excellence, choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, making it suitable for compact electronic devices.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, adding versatility to its usage.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components, simplifying the overall design of electronic systems.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on circuit boards, optimizing space utilization and enabling neat layouts.

Power Supplies (V): 5

Operating at a standard power supply voltage of 5V makes this product compatible with a wide range of electronic systems.

No. of Terminals: 16

Having multiple terminals enables connectivity with various other components, enhancing the product's versatility and compatibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers a compact form factor, making it suitable for applications where space is limited or a slim design is desired.

Maximum High Level Input Current: 0.0002 Amp

The low input current allows for energy-efficient operation and reduces the risk of heat generation, contributing to overall system reliability.

Minimum Supply Voltage: 4.5 V

With a low minimum supply voltage requirement, this product can still function within a narrow voltage range, ensuring stable performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable operation even in demanding environmental conditions, increasing product usability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature indicates that this product can withstand cold environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term signal integrity and reliability.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in circuit board layout and simplifies the installation process.

Maximum Seated Height: 1.2 mm

The low seated height makes this product suitable for slim devices or applications where space constraints are a concern.

Width: 4.4 mm

The narrow width of the product enables compact placement on circuit boards, optimizing space utilization in electronic designs.

Maximum Output Low Current: 3.2 Amp

The high output current capability makes this product suitable for driving power-hungry components, expanding its application range.

Receiver No. of Bits: 2

The 2-bit receiver allows for accurate data reception and processing, enhancing the overall performance of communication systems.

Maximum Time At Peak Reflow Temperature (s): 40

This prolonged time at peak reflow temperature ensures proper soldering and mounting of the device, preventing component damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance indicates the product's reliability in soldering processes, ensuring robust mechanical connections.

Length: 5 mm

The compact length of the product makes it suitable for applications where space-saving design is essential, offering versatility in installation.

Minimum Out Swing: 10 V

The minimum output swing value ensures accurate signal transmission and reception, maintaining high signal integrity in communication systems.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating signifies the product's reliability in harsh operating conditions, making it suitable for rugged applications.

Maximum Receive Delay: 1000 ns

With a low receive delay, this product ensures timely data transmission and reception, enhancing the efficiency of communication systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, preventing signal loss and ensuring robust electrical connections.

Interface Standard: EIA-232; TIA-232; V.28

Compliant with various interface standards, this product offers versatile connectivity options, making it compatible with a wide range of systems.

Maximum Supply Current: 10 mA

With a low maximum supply current requirement, this product operates efficiently and conserves power, contributing to energy savings.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristic ensures robust signal processing and noise immunity, enhancing the product's reliability in noisy environments.

Nominal Supply Voltage: 5 V

Operating at a standard nominal supply voltage simplifies power requirements and ensures compatibility with common power sources.

Terminal Pitch: 0.65 mm

With a fine terminal pitch, this product offers precise connectivity and compact layout options, enabling high-density circuit board designs.

Driver No. of Bits: 2

The 2-bit driver configuration enables accurate signal transmission and processing, ensuring reliable communication in electronic systems.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product's resistance to moisture-induced damage, making it suitable for a variety of operating environments.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type enables seamless signal conversion and communication between different interfaces, enhancing system compatibility.

Technical Specifications

Line Drivers & Receivers ST232BT attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.0002 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232; TIA-232; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

3.2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

1000 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

ST232BT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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