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ST232ACWR

STMicroelectronics

ST232ACWR by STMicroelectronics

ST232ACWR by STMicroelectronics is a Line Driver & Receiver with 2 functions, operating at 5V. It has a max transmit delay of 3500ns and receiver with 2 bits. Widely used in EIA-232, TIA-232, V.28 interfaces for commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,796 parts In-Stock

1+ parts

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4,796

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Anansix

USA . 1,473 parts In-Stock

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1,473

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LIBRA Elektronik GmbH

Germany . 904 parts In-Stock

1+ parts

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904

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Digiode

USA . 258 parts In-Stock

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258

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,196 parts In-Stock

1+ parts

$12.868

100+ parts

-

1k+ parts

$11.581

10k+ parts

-

2,196

$12.868

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$11.581

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MKK Technologies

India . 510 parts In-Stock

1+ parts

$24.198

100+ parts

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510

$24.198

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DigiPath Technology Company

USA . 510 parts In-Stock

1+ parts

$24.198

100+ parts

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510

$24.198

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Authorized Procurement Solutions

USA . 8,500 parts In-Stock

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8,500

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Corphita

USA . 4,380 parts In-Stock

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4,380

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Parana Technologies

USA . 2,367 parts In-Stock

1+ parts

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$15.386

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2,367

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$15.386

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Overview

Elevate your communication systems with the ST232ACWR by STMicroelectronics, a top-of-the-line Line Driver & Receiver that guarantees unparalleled quality and reliability. With a reputation for excellence in manufacturing, STMicroelectronics delivers cutting-edge technology that exceeds industry standards. This versatile device is ideal for a wide range of applications, offering customers seamless connectivity and efficient data transmission. Trust in the ST232ACWR to provide exceptional value, superior performance, and unmatched benefits for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged environments.

Surface Mount: YES

Surface mount capability allows for easy and secure assembly on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources.

No. of Functions: 2

Having multiple functions in a single device increases versatility and saves space on the PCB.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to work with during PCB layout and assembly.

Maximum Transmit Delay: 3500 ns

Low transmit delay ensures fast and efficient data transmission.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with common power sources.

No. of Terminals: 16

Having a high number of terminals allows for more connections and functions to be supported.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is suitable for compact designs.

Minimum Supply Voltage: 4.5 V

Supports a lower minimum supply voltage, enhancing flexibility in power requirements.

Maximum Operating Temperature: 70 °C

Wide operating temperature range makes the product suitable for various environmental conditions.

Minimum Operating Temperature: 0 °C

Able to operate at low temperatures, ensuring reliable performance in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for easy and secure connection to the PCB.

Maximum Seated Height: 2.65 mm

Low seated height saves space on the PCB and is suitable for slim designs.

Width: 7.5 mm

Compact width makes the product suitable for applications with limited space.

Maximum Output Low Current: 3.2 Amp

High output current capacity allows for driving of power-hungry components.

Receiver No. of Bits: 2

Having 2 bits in the receiver enhances data processing capabilities.

Length: 10.3 mm

Compact length saves space on the PCB and is suitable for miniaturized designs.

Minimum Out Swing: 10 V

Supports a minimum out swing of 10 V, ensuring compatibility with a wide range of devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade is suitable for standard operating conditions in commercial applications.

Maximum Receive Delay: 500 ns

Low receive delay ensures fast and efficient reception of data.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical connection to the PCB.

Interface Standard: EIA-232; TIA-232; V.28

Support for multiple interface standards ensures compatibility with a variety of communication protocols.

Maximum Supply Current: 4 mA

Low supply current consumption helps in reducing power consumption and heat generation.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide hysteresis and noise immunity for reliable signal processing.

Nominal Supply Voltage: 5 V

Operating at a nominal 5V supply voltage makes it compatible with standard power sources.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy connection to the PCB and compatibility with standard connectors.

Driver No. of Bits: 2

Having 2 bits in the driver enhances data processing capabilities and signal resolution.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the product can withstand standard PCB manufacturing processes without damage.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type is suitable for converting and transmitting signals between different communication lines.

Technical Specifications

Line Drivers & Receivers ST232ACWR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232; TIA-232; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

3.2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

500 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

4 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

3500 ns

Width:

7.5 mm

Trade Compliance

ST232ACWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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