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ST232EBN

STMicroelectronics

ST232EBN by STMicroelectronics

ST232EBN by STMicroelectronics is a dual line transceiver with a max supply voltage of 5.5V and operates in industrial temperatures from -40 °C to 85°C. It features a max transmit delay of 2000 ns and supports EIA-232-E standards, ideal for reliable data communication. With its compact design, it’s perfect for embedded systems requiring robust signal integrity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,223 parts In-Stock

1+ parts

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4,223

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Vyrian

USA . 2,843 parts In-Stock

1+ parts

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2,843

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Anansix

USA . 2,692 parts In-Stock

1+ parts

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2,692

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Corel Iberica Componentes, S.L.

Spain . 72 parts In-Stock

1+ parts

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72

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 392 parts In-Stock

1+ parts

$1.109

100+ parts

-

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392

$1.109

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IDEA Electronic Components Group

UK . 2,028 parts In-Stock

1+ parts

$7.487

100+ parts

-

1k+ parts

$6.738

10k+ parts

-

2,028

$7.487

-

$6.738

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MKK Technologies

India . 1,920 parts In-Stock

1+ parts

$14.079

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1,920

$14.079

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DigiPath Technology Company

USA . 1,920 parts In-Stock

1+ parts

$14.079

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1,920

$14.079

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AZTECH Wire

Italy . 238 parts In-Stock

1+ parts

$21.500

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-

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238

$21.500

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Component Stockers USA

USA . 382 parts In-Stock

1+ parts

$99.990

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382

$99.990

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A-Z Elektronik GmbH

Germany . 6,555 parts In-Stock

1+ parts

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6,555

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,473 parts In-Stock

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1,473

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Parana Technologies

USA . 248 parts In-Stock

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$8.952

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248

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$8.952

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Overview

Elevate your communication systems with the ST232EBN by STMicroelectronics, a reliable line driver and receiver designed for industrial applications. Renowned for superior quality and innovation, STMicroelectronics delivers exceptional performance, ensuring seamless data transmission even under extreme conditions. Enjoy the benefits of robust reliability, low power consumption, and versatile usage, making it an ideal choice for enhancing connectivity in diverse electronic projects. Trust in STMicroelectronics to power your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and resistance to environmental factors, making it suitable for a wide range of industrial applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product is compatible with many standard electronic devices, ensuring versatility.

No. of Functions: 2

Having two functions in one package saves space on the circuit board and simplifies the design, making it more efficient.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various layouts, providing flexibility in PCB design.

Maximum Transmit Delay: 2000 ns

A maximum transmit delay of 2000 ns ensures timely signal transmission, which is critical for high-speed communication applications.

Power Supplies (V): 5

Operating at a power supply of 5 V makes it energy-efficient and suitable for battery-operated and low-power devices.

No. of Terminals: 16

The presence of 16 terminals allows for multiple connections and functionalities, increasing the component's utility in circuit designs.

Package Style (Meter): IN-LINE

In-line packaging style is handy for straightforward mounting on PCB layouts, facilitating easier assembly and maintenance.

Minimum Supply Voltage: 4.5 V

This allows operation in a wider voltage range, accommodating variations in power source performance and enhancing reliability.

Maximum Operating Temperature: 85 °C

With an operating temperature up to 85 °C, this device is robust enough for harsh industrial environments.

Minimum Operating Temperature: -40 °C

The capability to operate as low as -40 °C ensures reliable performance in extreme conditions, making it suitable for outdoor applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, contributing to long-term performance and reliability.

Terminal Position: DUAL

Dual terminal positions allow versatile mounting options and flexible design layouts in various applications.

Maximum Seated Height: 5.1 mm

A maximum seated height of 5.1 mm allows for low-profile designs, which is ideal for compact electronic devices.

Width: 7.62 mm

A 7.62 mm width ensures compatibility with standard board layouts, aiding in easy assembly.

Maximum Output Low Current: 3.2 Amp

Outputting up to 3.2 Amps provides sufficient current handling for driving loads directly, reducing the need for external drivers.

Receiver No. of Bits: 2

The 2-bit receiver capability supports simple data applications, making it a good fit for basic communication needs.

Minimum Out Swing: 10 V

A minimum output swing of 10 V allows for good signal integrity over long distances, which is particularly useful in line-driver applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in demanding environments, making this product suitable for use in factories and plants.

Maximum Receive Delay: 10000 ns

This generous receive delay guarantees that the device can handle high latency scenarios without data loss, improving performance.

Terminal Form: THROUGH-HOLE

Through-hole connectors provide excellent mechanical stability and are easier to solder, making assembly more user-friendly.

Interface Standard: EIA-232-E; TIA-232-E; V.28

Compatibility with standard communication protocols ensures wide applicability in existing systems, enhancing usability.

Maximum Supply Current: 10 mA

With a maximum supply current of only 10 mA, this product is efficient, minimizing power consumption in applications.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics improve signal integrity, allowing for clean and noise-resistant signal processing.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V makes it highly compatible with common digital circuits, simplifying integration.

Terminal Pitch: 2.54 mm

The standard 2.54 mm terminal pitch allows for easy compatibility with most PCB designs and reduces assembly complexity.

Driver No. of Bits: 2

A 2-bit driver capability is well-suited for simple data lines, offering efficiency in low-data-rate communication scenarios.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this product is specifically designed for robust and reliable data transmission over various distances.

Technical Specifications

Line Drivers & Receivers ST232EBN attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-E; TIA-232-E; V.28

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

3.2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

10000 ns

Receiver No. of Bits:

2

Maximum Seated Height:

5.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

2000 ns

Width:

7.62 mm

Trade Compliance

ST232EBN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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