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SCTW90N65G2V

STMicroelectronics

SCTW90N65G2V by STMicroelectronics

SCTW90N65G2V by STMicroelectronics is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 220A Max Pulsed Drain Current and 390W Max Power Dissipation. Operating in ENHANCEMENT MODE, it has a temperature range of -55 to 200°C.

Median Price

$25.210

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 980 parts In-Stock

1+ parts

$17.310

100+ parts

-

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-

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980

$17.310

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-

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Verical

USA . 980 parts In-Stock

1+ parts

$17.310

100+ parts

-

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980

$17.310

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-

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Farnell

UK . 211 parts In-Stock

1+ parts

$23.780

100+ parts

$18.000

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-

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211

$23.780

$18.000

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-

Mouser Electronics

USA . 45 parts In-Stock

1+ parts

$25.210

100+ parts

$20.230

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-

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-

45

$25.210

$20.230

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-

Newark

USA . 351 parts In-Stock

1+ parts

$33.490

100+ parts

$30.440

1k+ parts

$30.060

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-

351

$33.490

$30.440

$30.060

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Element14

Singapore . 211 parts In-Stock

1+ parts

$41.580

100+ parts

$33.230

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-

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211

$41.580

$33.230

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Chip1Stop

Japan . 6 parts In-Stock

1+ parts

$49.400

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-

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6

$49.400

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Distributors (In-Stock)

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Digiode

USA . 166 parts In-Stock

1+ parts

$20.140

100+ parts

-

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-

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166

$20.140

-

-

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IBS Electronics

USA . 610 parts In-Stock

1+ parts

$20.715

100+ parts

-

1k+ parts

$24.277

10k+ parts

-

610

$20.715

-

$24.277

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$28.732

100+ parts

-

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10

$28.732

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Vyrian

USA . 2,605 parts In-Stock

1+ parts

-

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2,605

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Anansix

USA . 1,588 parts In-Stock

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1,588

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,791 parts In-Stock

1+ parts

$0.951

100+ parts

-

1k+ parts

$0.856

10k+ parts

-

1,791

$0.951

-

$0.856

-

MKK Technologies

India . 1,403 parts In-Stock

1+ parts

$1.789

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1,403

$1.789

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DigiPath Technology Company

USA . 1,403 parts In-Stock

1+ parts

$1.789

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1,403

$1.789

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Ampacity Inc.

Singapore . 472 parts In-Stock

1+ parts

$18.020

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472

$18.020

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Corphita

USA . 3,164 parts In-Stock

1+ parts

$19.080

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3,164

$19.080

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Microchip USA

USA . 2,369 parts In-Stock

1+ parts

$83.467

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2,369

$83.467

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Lixinc

USA . 6,438 parts In-Stock

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6,438

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Alle Elektronik GmbH

Germany . 4,465 parts In-Stock

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4,465

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Parana Technologies

USA . 1,111 parts In-Stock

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$1.137

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1,111

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$1.137

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$28.157

1k+ parts

$27.295

10k+ parts

$26.721

100

-

$28.157

$27.295

$26.721

Eastek

USA . 40 parts In-Stock

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40

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Overview

Discover the SCTW90N65G2V by STMicroelectronics, a high-quality Power FET designed for switching applications. Manufactured by industry leader STMicroelectronics, this N-CHANNEL transistor offers reliability and efficiency. With a minimum DS Breakdown Voltage of 650V and a maximum Drain Current of 110A, this transistor is perfect for various power applications. Its single configuration with a built-in diode makes installation easy and hassle-free. Trust in STMicroelectronics to deliver top-notch performance and value with the SCTW90N65G2V.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration offers high efficiency and performance, making this product suitable for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in the single configuration simplifies circuit design and enhances overall reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this field effect transistor provides fast and efficient operation.

Minimum DS Breakdown Voltage: 650 V

With a high minimum breakdown voltage, this FET can withstand high voltages, ensuring reliable performance in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various electronic systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and reliable connections, suitable for industrial applications.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode offers precise control over the transistor's performance, making it a versatile choice for different applications.

Maximum Pulsed Drain Current (IDM): 220 A

The high maximum pulsed drain current capability allows the FET to handle sudden surges of power effectively.

Maximum Drain Current (Abs) (ID): 110 A

This FET can continuously handle a maximum drain current of 110A, making it suitable for high-power applications.

No. of Terminals: 3

With three terminals, this FET provides convenient connectivity options for various circuit configurations.

Maximum Power Dissipation (Abs): 390 W

The high maximum power dissipation rating ensures the FET can effectively handle heat dissipation, contributing to its reliability.

Package Style (Meter): FLANGE MOUNT

The flange mount package style facilitates easy installation and helps in heat dissipation, enhancing the overall performance of the product.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this FET offers high switching speeds and low power consumption, making it energy-efficient.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature, this FET can operate reliably in extreme temperature conditions.

Transistor Element Material: SILICON CARBIDE

The use of silicon carbide for the transistor element material ensures high durability and efficiency in various environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature rating allows the FET to function effectively even in cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent electrical conductivity and corrosion resistance, enhancing the longevity of the FET.

Maximum Drain Current (ID): 110 A

The FET can handle a maximum drain current of 110A, making it suitable for high-power applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and maintenance of the FET, making it a user-friendly choice.

Case Connection: DRAIN

The drain case connection enhances the thermal performance of the FET by efficiently dissipating heat, ensuring optimal operation.

Technical Specifications

Power Field Effect Transistors (FET) SCTW90N65G2V attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

110 A

Maximum Drain Current (ID):

110 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

220 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

SCTW90N65G2V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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