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RHFLVDS32AK02V

STMicroelectronics

RHFLVDS32AK02V by STMicroelectronics

RHFLVDS32AK02V by STMicroelectronics is a military-grade line receiver with a max supply voltage of 3.6 V, operating from -55 °C to 125 °C. It features 4 functions and a max receive delay of just 2.5 ns, ideal for high-speed data communication applications. Its compact flatpack design ensures efficient surface mounting in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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EBV Elektronik

Germany . 13 parts In-Stock

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Vyrian

USA . 4,542 parts In-Stock

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4,542

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Digiode

USA . 3,864 parts In-Stock

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Anansix

USA . 2,628 parts In-Stock

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IDEA Electronic Components Group

UK . 340 parts In-Stock

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$3.166

100+ parts

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$2.849

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340

$3.166

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$2.849

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MKK Technologies

India . 2,288 parts In-Stock

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$5.953

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$5.953

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DigiPath Technology Company

USA . 2,288 parts In-Stock

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$5.953

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2,288

$5.953

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Parana Technologies

USA . 2,143 parts In-Stock

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$3.785

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Corphita

USA . 606 parts In-Stock

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Eastek

USA . 13 parts In-Stock

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Overview

Unlock unparalleled performance with the RHFLVDS32AK02V by STMicroelectronics, a premier line driver and receiver designed for demanding applications. Crafted with precision in durable ceramic metal-sealed packaging, this device offers exceptional reliability even under extreme conditions. Experience swift data transmission, reduced power consumption, and unmatched temperature resilience, making it the ideal choice for military and industrial systems. Elevate your projects with ST's legacy of quality and innovation!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package offers excellent durability and thermal stability, making it ideal for harsh environments.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs and improves manufacturing efficiency.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a variety of low-voltage applications, enhancing versatility.

No. of Functions: 4

With four functions, this product provides flexibility for multiple applications within a single package, optimizing board space.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient layout and placement on PCBs, facilitating better space utilization.

No. of Terminals: 16

Sixteen terminals enable robust connectivity options and support complex routing in high-performance applications.

Package Style (Meter): FLATPACK

Flatpack design contributes to a lower profile on boards, which aids in achieving compact device designs.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V allows for operation in battery-powered environments, increasing its application range.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures ensures reliability under demanding conditions, suitable for industrial and military use.

Minimum Operating Temperature: -55 °C

This wide operating temperature range allows the device to function effectively in extreme environments, enhancing reliability.

Terminal Position: DUAL

Dual terminal positioning supports various installation configurations, which can be advantageous in complex electronic systems.

Maximum Seated Height: 2.72 mm

A maximum seated height of 2.72 mm helps to maintain a low profile on the PCB, which is essential for space-constrained applications.

Width: 6.905 mm

A width of 6.905 mm allows for precise placement and alignment on circuit boards, improving design flexibility.

Receiver No. of Bits: 4

The 4-bit receiver capability ensures efficient data handling for a variety of applications, particularly in digital communications.

Length: 9.94 mm

At a length of 9.94 mm, the device is compact and lightweight, conducive to modern electronics where size is a premium.

Temperature Grade: MILITARY

The military-grade temperature classification guarantees high reliability and performance in critical applications and environments.

Maximum Receive Delay: 2.5 ns

A maximum receive delay of 2.5 ns enables high-speed data transmission, crucial for advanced communication systems.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making it ideal for energy-efficient designs.

Terminal Form: FLAT

Flat terminal form simplifies mounting and soldering processes, enhancing manufacturing reliability and reducing assembly time.

Interface Standard: EIA-644; TIA-644

Compliance with industry standards EIA-644 and TIA-644 ensures compatibility with existing systems and offers reliable performance.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input characteristics provide improved noise immunity and faster switching, enhancing signal integrity.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V makes it ideal for use in modern low-voltage digital circuits.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for more compact arrangements on PCBs while maintaining ease of soldering and connection.

Interface IC Type: LINE RECEIVER

As a line receiver, this IC is specifically designed for reliable data transmission over long distances, essential for robust communication.

Technical Specifications

Line Drivers & Receivers RHFLVDS32AK02V attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-CDFP-F16

Length:

9.94 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Receive Delay:

2.5 ns

Receiver No. of Bits:

4

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.905 mm

Trade Compliance

RHFLVDS32AK02V Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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