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RHFLVDSR2D2K1

STMicroelectronics

RHFLVDSR2D2K1 by STMicroelectronics

STMicroelectronics' RHFLVDSR2D2K1 is a ceramic, metal-sealed line driver with 3.6V max supply voltage and 1.5ns max transmit delay. Ideal for military-grade applications, it features differential output, 2 functions, and operates in temperatures ranging from -55 to 125 °C.

Median Price

$1,039.480

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 83 parts In-Stock

1+ parts

$1,039.390

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83

$1,039.390

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DigiKey

USA . 8 parts In-Stock

1+ parts

$1,039.570

100+ parts

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8

$1,039.570

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Arrow

USA . 6 parts In-Stock

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6

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Distributors (In-Stock)

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Flip Electronics

USA . 1 parts In-Stock

1+ parts

$726.750

100+ parts

-

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1

$726.750

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Digiode

USA . 4,384 parts In-Stock

1+ parts

$812.108

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4,384

$812.108

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Vyrian

USA . 6,406 parts In-Stock

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6,406

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Anansix

USA . 1,477 parts In-Stock

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1,477

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,181 parts In-Stock

1+ parts

$11.231

100+ parts

-

1k+ parts

$10.108

10k+ parts

-

2,181

$11.231

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$10.108

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MKK Technologies

India . 2,378 parts In-Stock

1+ parts

$21.120

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2,378

$21.120

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DigiPath Technology Company

USA . 2,378 parts In-Stock

1+ parts

$21.120

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2,378

$21.120

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Corphita

USA . 1,725 parts In-Stock

1+ parts

$769.365

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1,725

$769.365

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Parana Technologies

USA . 2,094 parts In-Stock

1+ parts

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100+ parts

$13.429

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2,094

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$13.429

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Overview

Experience top-notch quality and reliability with the RHFLVDSR2D2K1 from STMicroelectronics, a leading manufacturer in the industry. This line driver and receiver is perfect for a wide range of applications, offering unmatched performance and efficiency. Enjoy seamless communication and enhanced signal transmission with this advanced technology. Trust in the value and benefits that this product brings to your projects, delivering superior results every time. Choose excellence with the RHFLVDSR2D2K1 by STMicroelectronics.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures robustness and durability, making this product suitable for harsh environments.

Surface Mount: YES

The surface mount capability allows for easy and flexible installation in various applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power input requirements.

No. of Functions: 2

Having multiple functions in one product can save space and reduce overall cost in a design.

Maximum Transmit Delay: 1.5 ns

Low transmit delay ensures quick data transmission, making this product suitable for high-speed applications.

No. of Terminals: 18

Having a sufficient number of terminals allows for versatile connectivity options.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range makes this product suitable for industrial and military applications.

Output Characteristics: DIFFERENTIAL

Differential output helps in reducing noise and interference, ensuring reliable data transmission.

Maximum Output Low Current: 2 Amp

High output current capability allows for driving power-hungry loads with ease.

Total Dose (V): 300k Rad(Si)

The high total dose rating makes this product suitable for applications where radiation resistance is required.

Technical Specifications

Line Drivers & Receivers RHFLVDSR2D2K1 attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-CDFP-F18

Length:

11.81 mm

No. of Functions:

2

No. of Terminals:

18

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

.25 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

2 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL18,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Receive Delay:

2.5 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.74 mm

Maximum Supply Current:

19 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Total Dose (V):

300k Rad(Si)

Maximum Transmit Delay:

1.5 ns

Width:

7.11 mm

Trade Compliance

RHFLVDSR2D2K1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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