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PD85035S-E

STMicroelectronics

PD85035S-E by STMicroelectronics

PD85035S-E by STMicroelectronics is an N-channel FET designed for amplification applications. It features a max drain current of 8 A, a breakdown voltage of 40 V, and operates at up to 165 °C. Ideal for compact power management in surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,988 parts In-Stock

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4,988

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Vyrian

USA . 3,223 parts In-Stock

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3,223

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Anansix

USA . 862 parts In-Stock

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862

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Chip Stock

USA . 147 parts In-Stock

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147

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$1.276

100+ parts

$1.161

1k+ parts

$1.046

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-

350

$1.276

$1.161

$1.046

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IDEA Electronic Components Group

UK . 980 parts In-Stock

1+ parts

$1.516

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$1.365

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980

$1.516

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$1.365

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MKK Technologies

India . 1,115 parts In-Stock

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$2.851

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$2.851

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DigiPath Technology Company

USA . 1,115 parts In-Stock

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$2.851

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$2.851

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AZTECH Wire

Italy . 1,089 parts In-Stock

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$12.580

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$12.580

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Microchip USA

USA . 7,786 parts In-Stock

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7,786

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QUARKTWIN TECHNOLOGY LTD

USA . 5,803 parts In-Stock

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5,803

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 1,506 parts In-Stock

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$1.813

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$1.813

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Corphita

USA . 89 parts In-Stock

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89

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Perfect Parts

USA . 63 parts In-Stock

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EMSNET (Excess)

USA . 2 parts In-Stock

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Overview

Elevate your designs with the PD85035S-E from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This powerful N-channel FET combines exceptional reliability and efficiency, making it ideal for amplifiers and various applications. With a compact footprint and robust performance at high temperatures, it delivers unparalleled value and flexibility, ensuring your projects stand out for quality and durability. Transform your next electronic challenge into a success story!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and reliability in various conditions, making it suitable for diverse applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower ON resistance and higher efficiency, making them ideal for amplification applications.

Configuration: SINGLE

A single configuration simplifies circuit design and integration, allowing for easier implementation in various electronic systems.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is optimized for high-performance audio and signal processing applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient PCB layouts, supporting modern electronic devices.

Minimum DS Breakdown Voltage: 40 V

A minimum breakdown voltage of 40 V provides ample headroom for high-voltage applications, ensuring safety and robustness.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used, facilitating easier integration into existing PCB designs.

Terminal Form: FLAT

Flat terminals provide better soldering contact and help in heat dissipation, improving reliability in high-current applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows the FET to remain off until a voltage is applied, minimizing power consumption in idle states.

Maximum Drain Current (Abs) (ID): 8 A

With a maximum drain current of 8 A, this FET can handle significant load currents, making it suitable for high-power applications.

No. of Terminals: 2

Having only 2 terminals simplifies the design and reduces the complexity of the circuit, which is beneficial for compact devices.

Maximum Power Dissipation (Abs): 95 W

A high power dissipation rating of 95 W allows the FET to operate efficiently under heavy loads without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained designs, enabling manufacturers to create more compact products.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides better performance and lower power consumption, making this FET an efficient choice for modern electronics.

Maximum Operating Temperature: 165 °C

A maximum operating temperature of 165 °C ensures reliable performance in demanding environments, enhancing long-term stability.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its excellent electrical properties, making it an industry standard.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and corrosion resistance, ensuring a solid electrical connection.

Maximum Drain Current (ID): 8 A

This specification is reiterated to emphasize its capability to handle significant load currents in a wide range of applications.

Terminal Position: DUAL

Dual terminal positioning allows for easier mounting and integration into PCB layouts, enhancing design flexibility.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 suggests moderate sensitivity to moisture, indicating that care should be taken during handling and soldering, ensuring product longevity.

Case Connection: SOURCE

The case connection to the source simplifies the thermal management and ensures efficient heat dissipation from the device.

Technical Specifications

Power Field Effect Transistors (FET) PD85035S-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD85035S-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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