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M95512-DRMB6TG

STMicroelectronics

M95512-DRMB6TG by STMicroelectronics

STMicroelectronics M95512-DRMB6TG is an EEPROM with 64KX8 organization, SPI serial bus type, and 524288-bit memory density. It operates b/w -40 to 85 °C and has a min data retention time of 40s. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,232 parts In-Stock

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9,232

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Digiode

USA . 1,269 parts In-Stock

1+ parts

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1,269

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Anansix

USA . 311 parts In-Stock

1+ parts

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311

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 947 parts In-Stock

1+ parts

$3.777

100+ parts

-

1k+ parts

$3.399

10k+ parts

-

947

$3.777

-

$3.399

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MKK Technologies

India . 888 parts In-Stock

1+ parts

$7.102

100+ parts

-

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888

$7.102

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DigiPath Technology Company

USA . 888 parts In-Stock

1+ parts

$7.102

100+ parts

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888

$7.102

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Microchip USA

USA . 493 parts In-Stock

1+ parts

$8.694

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493

$8.694

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AZTECH Wire

Italy . 1,186 parts In-Stock

1+ parts

$13.640

100+ parts

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1,186

$13.640

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Parana Technologies

USA . 1,456 parts In-Stock

1+ parts

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$4.516

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1,456

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$4.516

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Corphita

USA . 1,405 parts In-Stock

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1,405

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Overview

Unlock endless possibilities with the M95512-DRMB6TG EEPROM by STMicroelectronics. Crafted with precision and expertise, this small outline memory device offers reliable data storage solutions for industrial applications. With a million write/erase cycles, hardware/software write protection, and a wide temperature range, this EEPROM ensures your critical information is safe and accessible at all times. Trust in STMicroelectronics to deliver quality and innovation in every product, empowering you to push boundaries and achieve more. Choose the M95512-DRMB6TG for unparalleled performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM chip, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Power Supplies (V): 2/5

Versatile power supply options allow for compatibility with a range of systems and applications.

Package Shape: RECTANGULAR

Standard shape makes it easy to design into various electronic devices or systems.

No. of Terminals: 8

Provides multiple connection points for secure and stable integration.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on the PCB and allows for denser component layout.

Maximum Operating Temperature: 85 °C

Ability to operate at high temperatures makes it suitable for industrial applications.

Organization: 64KX8

Offers a large amount of memory organized in a convenient format for data storage.

Minimum Operating Temperature: -40 °C

Can function in extreme cold environments without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting orientation and PCB layout.

Write Protection: HARDWARE/SOFTWARE

Enhanced security features to prevent unauthorized data writes or erasures.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized for efficient manufacturing processes during reflow soldering.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly without damage.

Temperature Grade: INDUSTRIAL

Designed to meet the demanding temperature requirements of industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation.

Parallel or Serial: SERIAL

Serial communication interface for efficient data transfer and control.

Terminal Form: NO LEAD

Lead-free terminal construction for environmental sustainability and RoHS compliance.

Maximum Supply Current: 8 mA

Low power consumption for energy-efficient operation.

No. of Words: 65536 words

Large memory capacity for storing a significant amount of data or program code.

Memory Width: 8

8-bit memory width for efficient data access and processing.

Minimum Data Retention Time: 40

Long data retention time ensures data integrity even during power loss or failure.

Terminal Pitch: 0.5 mm

Fine pitch terminals for compact design and high-density PCB integration.

No. of Words Code: 64K

Easy-to-understand code format for memory addressing and data retrieval.

Endurance: 1000000 Write/Erase Cycles

High endurance for frequent read/write operations and data updates.

Serial Bus Type: SPI

Serial Peripheral Interface (SPI) for fast and efficient data communication.

Memory Density: 524288 bit

High memory density for storing a large volume of data in a compact chip.

Memory IC Type: EEPROM

Electrically Erasable Programmable Read-Only Memory for flexible data storage and retrieval.

Maximum Standby Current: 0.000005 Amp

Ultra-low standby current consumption for power-saving operation in idle mode.

Technical Specifications

EEPROM M95512-DRMB6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Serial Bus Type:

SPI

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

8 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95512-DRMB6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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