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M95160-WMN6

STMicroelectronics

M95160-WMN6 by STMicroelectronics

M95160-WMN6 by STMicroelectronics is an EEPROM with 2Kx8 organization, SPI serial bus type, and 16384-bit memory density. It operates at a max clock frequency of 2MHz and has a write protection feature for hardware/software security. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,649 parts In-Stock

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6,649

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Digiode

USA . 3,749 parts In-Stock

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3,749

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Anansix

USA . 1,745 parts In-Stock

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1,745

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LIBRA Elektronik GmbH

Germany . 170 parts In-Stock

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170

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LWI Electronics Inc

India . 135 parts In-Stock

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135

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North Shore Components

USA . 67 parts In-Stock

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67

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Prism Electronics

USA . 35 parts In-Stock

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Connector Distribution Corp

USA . 10 parts In-Stock

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Right Parts Inc.

USA . 10 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 274 parts In-Stock

1+ parts

$3.675

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274

$3.675

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IDEA Electronic Components Group

UK . 1,322 parts In-Stock

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$4.083

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$3.675

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$4.083

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$3.675

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MKK Technologies

India . 2,295 parts In-Stock

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$7.678

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2,295

$7.678

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DigiPath Technology Company

USA . 2,295 parts In-Stock

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$7.678

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$7.678

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AZTECH Wire

Italy . 1,107 parts In-Stock

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$9.990

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Component Stockers USA

USA . 409 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 5,583 parts In-Stock

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Kepictronics

USA . 4,350 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,722 parts In-Stock

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Corphita

USA . 3,171 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Parana Technologies

USA . 1,187 parts In-Stock

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$4.882

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Assy Fe

Spain . 1,000 parts In-Stock

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Perfect Parts

USA . 951 parts In-Stock

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951

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Overview

Unlock the power of reliable data storage with the M95160-WMN6 from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality EEPROM products that are perfect for a wide range of applications. With a focus on performance and durability, this small outline memory device offers customers the value and benefits they need for their projects. Whether for industrial or commercial use, the M95160-WMN6 provides seamless operation and high endurance, ensuring long-lasting performance that customers can rely on. Choose STMicroelectronics for trusted quality and unmatched innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the EEPROM, making it suitable for various environments.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures stable and reliable performance of the EEPROM.

Operating Mode: SYNCHRONOUS

The synchronous operation mode allows for efficient data transfer and processing within the EEPROM.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this EEPROM can function reliably even in harsh industrial environments.

Write Protection: HARDWARE/SOFTWARE

The option for both hardware and software write protection ensures data security and integrity within the EEPROM.

Maximum Clock Frequency (fCLK): 2 MHz

The high clock frequency of 2MHz enables fast data transfer and processing within the EEPROM.

Endurance: 1000000 Write/Erase Cycles

The high endurance rating of 1,000,000 write/erase cycles ensures the longevity and reliability of the EEPROM.

Serial Bus Type: SPI

The SPI bus type allows for serial communication with other devices, making integration and communication easier in a system.

Technical Specifications

EEPROM M95160-WMN6 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Additional Features:

MINIMUM 1 MILLION ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95160-WMN6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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