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M95160-MN6P

STMicroelectronics

M95160-MN6P by STMicroelectronics

M95160-MN6P from STMicroelectronics is a 2Kx8 EEPROM with a synchronous operating mode and SPI serial bus type. It features a wide temperature range (-40 °C to 85 °C), operates at 5V, and supports up to 1M write/erase cycles, ideal for industrial applications. Its compact SOIC package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,659 parts In-Stock

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8,659

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Digiode

USA . 2,563 parts In-Stock

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2,563

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Anansix

USA . 2,120 parts In-Stock

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2,120

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Lantek

USA . 571 parts In-Stock

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571

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,309 parts In-Stock

1+ parts

$5.039

100+ parts

-

1k+ parts

$4.535

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1,309

$5.039

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$4.535

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MKK Technologies

India . 1,816 parts In-Stock

1+ parts

$9.475

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1,816

$9.475

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DigiPath Technology Company

USA . 1,816 parts In-Stock

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$9.475

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1,816

$9.475

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AZTECH Wire

Italy . 1,068 parts In-Stock

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$14.700

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1,068

$14.700

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Microchip USA

USA . 7,251 parts In-Stock

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Corphita

USA . 3,507 parts In-Stock

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3,507

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Parana Technologies

USA . 2,297 parts In-Stock

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$6.025

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2,297

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$6.025

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GreenTree Electronics

Israel . 571 parts In-Stock

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571

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Overview

Unlock innovation with the M95160-MN6P EEPROM from STMicroelectronics, a leader in semiconductor solutions. This high-quality memory component is designed for reliability across various applications, from automotive to industrial systems. With its robust temperature range and write protection features, it ensures data integrity and endurance for up to 1 million cycles. Elevate your projects with enhanced performance and peace of mind—choose STMicroelectronics for excellence that powers your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs, suitable for modern electronics.

Package Shape: RECTANGULAR

Rectangular packaging optimizes space utilization on PCBs, making it efficient for layout.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer speeds and overall performance.

Nominal Supply Voltage / Vsup: 5V

The nominal supply voltage is standard, simplifying compatibility with various systems.

Power Supplies (V): 5

Operating at a single voltage level reduces complexity in power supply design.

No. of Terminals: 8

The 8 terminals allow for essential connections while minimizing space requirements.

Package Style (Meter): SMALL OUTLINE

Small outline package style contributes to lightweight and compact electronic designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in demanding environments.

Organization: 2KX8

The organization supports a structured memory layout, optimizing data management.

Minimum Operating Temperature: -40 °C

Wide temperature range makes this EEPROM suitable for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances solderability and reliability in connections.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB design and improved connectivity options.

Write Protection: HARDWARE/SOFTWARE

The dual method of write protection enhances data integrity and security.

Maximum Seated Height: 1.75 mm

Low profile minimizes space usage on PCBs, beneficial for compact designs.

Maximum Clock Frequency (fCLK): 5 MHz

A maximum clock frequency of 5 MHz supports fast data access speeds.

Width: 3.9 mm

Compact width contributes to efficient space management on PCB layouts.

Minimum Supply Voltage (Vsup): 4.5V

This minimum supply voltage allows for flexibility in power management.

Length: 4.9 mm

Compact length helps maintain optimal design constraints in limited spaces.

Temperature Grade: INDUSTRIAL

Industrial grade ensures robustness in harsh environments, enhancing reliability.

Technology: CMOS

CMOS technology provides low power consumption and high speed, improving efficiency.

Parallel or Serial: SERIAL

Serial interface simplifies connections, reducing wiring complexity.

Terminal Form: GULL WING

Gull wing terminals facilitate easier solder connections and improve reliability.

Maximum Supply Current: 5 mA

Low supply current indicates efficient power consumption, extending device battery life.

No. of Words: 2048 words

A capacity of 2048 words offers ample storage for various applications.

Memory Width: 8

An 8-bit memory width efficiently handles standard data sizes.

Minimum Data Retention Time: 40 years

Long data retention time ensures reliable storage and less frequent data refresh.

Terminal Pitch: 1.27 mm

Standard terminal pitch ensures compatibility with a variety of PCB designs.

No. of Words Code: 2K

Offers moderate data storage capabilities, suitable for many applications.

Maximum Supply Voltage (Vsup): 5.5V

Allows flexibility in design with a range of compliant voltage supplies.

Endurance: 1000000 Write/Erase Cycles

High endurance rating indicates long lifespan for frequent data updates.

Serial Bus Type: SPI

SPI bus type enables high-speed data transfer in serial communications.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time enhances overall system performance and responsiveness.

Memory Density: 16384 bit

Adequate memory density supports multiple applications and data storage needs.

Memory IC Type: EEPROM

EEPROM type provides non-volatile storage, retaining data without power.

Maximum Standby Current: 0.000002 Amp

Ultra-low standby current minimizes power consumption in idle states.

Technical Specifications

EEPROM M95160-MN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95160-MN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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